AVR 360 - Harman Kardon Audio EMC - CB Certificate (repair manual). Page 17

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- Page 13 of 44 - 
 
 
 
 
 Report 
No. 
129950 
 
IEC 60065 
Clause 
Requirement – Test 
Result - Remark 
Verdict 
 
TRF No. IEC60065_I 
 
 
 
11 Fault 
conditions 
 
11.1 
No shock hazard under fault condition ……………: 
No electric shock hazard under 
fault conditions. 
11.2 
Heating under fault condition ………………….: 
(see appended table 11.2) 
 
Flames extinguish within 10 seconds ..................: 
No flames 
 
No hazard from softening solder ……………...: 
No softening of solder 
 
Soldered terminations not used  as protective 
mechanism ………………………………..: 
No soldered terminations 
11.2.1 
Measurement of temperature rises ……..: 
(see appended table 11.2) 
11.2.2 
Temperature rise of accessible parts ……...: 
(see appended table 11.2) 
11.2.3 
Temperature rise of parts, other than windings, 
providing electrical insulation ………: 
(see appended table 11.2) 
 
Temperature rise of printed circuit boards (PCB) 
exceeding the limits of table 3 by max. 100 K for 
max. 5 min ...: 
No exceeding the limits of 
Table 3. 
N/A 
 
a) Temperature rise of printed circuit boards (PCB) 
to 20.1.3, exceeding the limits of table 3 by not more 
than 100 K for an area not greater than 2 cm² : 
 
N/A 
 
b) Temperature rise of printed circuit boards (PCB) 
to 20.1.3 up to 300 K for an area not greater than 
2 cm² for a maximum of 5 min …………….: 
 
N/A 
 
Meets all the special conditions if conductors on 
printed circuit boards are interrupted …...: 
No conductors are 
interrupted/peeled/loosened 
during fault conditions 
 
Class I protective earthing maintained ………….: 
Class II equipment 
N/A 
11.2.4 
Temperature rise of parts acting as a support or  
mechanical barrier ….: 
(see appended table 11.2) 
11.2.5 
Temperature rise of windings ………………: 
(see appended table 11.2) 
11.2.6 
Temperature rise of parts not subject to the limits of 
11.2.1 to 11.2.5 ………………: 
No excessive temperature  
observed/measured on  
other parts. 
(see appended table 11.2) 
 
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