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Report No. NTEK-2011NT1009318S
EN 60065
Clause
Requirement + Test
Result - Remark
Verdict
NTEK Testing Technology Co., Ltd.
10.3
Insulation resistance and dielectric strength
(see appended table).
P
Insulation Resistance and dielectric strength across
BASIC or SUPPLEMENTARY insulation (Class I)
The approved Class II
switching power supply be
used.
switching power supply be
used.
N
Insulation resistance and dielectric strength across
REINFORCED insulation (Class II)
The approved Class II
switching power supply be
used.
switching power supply be
used.
N
11 FAULT
CONDITIONS
P
11.1
No shock hazard under fault conditions
No electric shock during fault
operation. For details refer to
appended table 11.2.
P
11.2
Heating under fault condition
See below.
P
Flames extinguish within 10 seconds
No such flames
P
No hazard from softening solder
No solder point became soft.
P
Soldered terminations not used as protective
mechanism
P
11.2.1
Measurement of temperature rises
(see appended table).
P
11.2.2
Temperature rise of accessible parts
(see appended table).
P
11.2.3
Temperature rise of parts, other than windings,
providing electrical insulation
providing electrical insulation
(see appended table).
P
11.2.4
Temperature rise of parts acting as a support or
mechanical barrier
mechanical barrier
No such parts. See 7.1.3.
P
11.2.5
Temperature rise of windings
(See appended table)
P
11.2.6
Temperature rise of parts not subject to the limits of
11.2.1 to 11.2.5
11.2.1 to 11.2.5
P
Printed circuit boards (PCB) classified as V-0
according to 60695-11-10 or Clause G.1 may
exceed the limit in table 3 in case a) and b):
P
a) Temperature rise of printed circuit boards
exceeding the limits of table 3 by not more than
100 K for an area not greater than 2 cm² ................ :
N
b) Temperature rise of printed circuit boards
exceeding the limits of table 3 up to 300 K for an
area not greater than 2 cm² for a maximum of 5 min
N
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