Read Harman Kardon HK 970 (serv.man13) EMC - CB Certificate online
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Report No.: HK-R04173361
IEC 60065 / EN 60065
Clause
Requirement – Test
Result - Remark
Verdict
TRF No: IECEN60065D
Intertek Testing Services Hong Kong Ltd.
2/F., Garment Centre, 576 Castle Peak Road, Kowloon, Hong Kong.
Tel: (852) 2173 8888 Fax: (852) 2785 5487 Website: www.hk.intertek-etlsemko.com
9.1.6
No shock hazard due to stored charge on
withdrawal of the mains plug; voltage (V) after 2s :
withdrawal of the mains plug; voltage (V) after 2s :
Measured max. votlage:
0.115mVdc
0.115mVdc
P
If C is not greater than 0,1 µF no test needed
Measured capacitance: 0,18
µF P
9.1.7
Enclosure sufficiently resistant to external force
P
Test probe 11 of IEC 61032 for 10 s (50 N)
P
Test hook of fig. 4 for 10 s (20 N)
P
30 mm diameter test tool for 5 s (100 or 250 N) ... : 100N used, no damage
P
9.2
No hazard after removing a cover by hand
Tools are required
N
10 INSULATION
REQUIREMENTS
10.1 Insulation
resistance
(MΩ) at least 2 MΩ min. after
surge test for basic and 4 MΩ min. for reinforced
insulation ............................................................... :
insulation ............................................................... :
Clause 10.3 was complied
P
10.2
Humidity treatment 48 h or 120 h .......................... : 48h P
10.3
Insulation resistance and dielectric strength
(see appended table)
P
11 FAULT
CONDITIONS
11.1
No shock hazard under fault condition
P
11.2
Heating under fault condition
P
No hazard from softening solder
P
11.2.1
Measurement of temperature rises
(see appended table)
P
11.2.2
Temperature rise of accessible parts
(see appended table)
P
11.2.3
Temperature rise of parts, other than windings,
providing electrical insulation
providing electrical insulation
(see appended table)
P
Temperature rise of printed circuit boards (PCB)
exceeding the limits of table 3 by max. 100 K for
max. 5 min
exceeding the limits of table 3 by max. 100 K for
max. 5 min
(see appended table)
P
a) Temperature rise of printed circuit boards (PCB)
to 20.1.3, exceeding the limits of table 3 by not
more than 100 K for an area not greater than
2 cm²
to 20.1.3, exceeding the limits of table 3 by not
more than 100 K for an area not greater than
2 cm²
N
b) Temperature rise of printed circuit boards (PCB)
to 20.1.3 up to 300 K for an area not greater than
2 cm² for a maximum of 5 min
to 20.1.3 up to 300 K for an area not greater than
2 cm² for a maximum of 5 min
N
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