Read Sony HDR-PJ260 / HDR-PJ260E / HDR-PJ260V / HDR-PJ260VE / HDR-XR260V / HDR-XR260VE Service Manual online
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HDR-PJ260/PJ260E/PJ260V/PJ260VE/XR260E/XR260V/XR260VE_L2
Model information table
Model
HDR-PJ260
HDR-PJ260E
HDR-PJ260V
HDR-PJ260VE HDR-XR260E
HDR-XR260V HDR-XR260VE
Destination
KR
NE,
E, CH, JE
US, CND, E
AEP,UK,NE, E,
AUS
E, CH
US, CND, E, BR AEP,UK,NE, E,
AUS, HK
COLOR system
NTSC
PAL
NTSC
PAL
PAL
NTSC
PAL
Recording media
Internal memory
16 GB
Internal memory
16 GB
Internal memory
16 GB
Internal memory
16 GB
Hard Disk
Drive
160 GB
Hard Disk
Drive
160 GB
Hard Disk
Drive
160 GB
LENS
LSV-1450A
LSV-1450A
LSV-1450A
LSV-1450A
LSV-1450A
LSV-1450A
LSV-1450A
Projector
●
●
●
●
─
─
─
GPS
─
─
●
●
─
●
●
Hot shoe
─
─
─
─
─
─
─
Charging capacitor
(for flash)
─
─
─
─
─
─
─
MODEL GROUP
Projector Model:
PJ260/PJ260E/PJ260V/PJ260VE
Non Projector Model: XR260E/XR260V/XR260VE
HDD Model:
XR260E/XR260V/XR260VE
IM Model (Internal Memory Model): PJ260/PJ260E/PJ260V/PJ260VE
GPS Model:
PJ260V/PJ260VE/XR260V/XR260VE
Non GPS Model: PJ260/PJ260E/XR260E
• Abbreviation
AUS: Australian
model
BR: Brazilian model
CH: Chinese
model
CND:
Canadian
model
HK: Hong Kong model
JE: Tourist
model
KR: Korea
model
NE: North European model
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST
ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPO-
NENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY
SONY.
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST
ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPO-
NENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS
SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY
SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REM-
PLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT
LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE REM-
PLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY DONT
LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU DANS LES
SUPPLÉMENTS PUBLIÉS PAR SONY.
Caution
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes and
bridges.
bridges.
2. Check the interboard wiring to ensure that no wires are “pinched”
or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transistors,
that were installed during a previous repair. Point them out to the
customer and recommend their replacement.
customer and recommend their replacement.
4. Look for parts which, through functioning, show obvious signs of
deterioration. Point them out to the customer and recommend their
replacement.
replacement.
5. Check the B+ voltage to see it is at the values specified.
6. Flexible Circuit Board Repairing
6. Flexible Circuit Board Repairing
• Set the soldering iron tip temperature to 350 °C approximately.
• Do not touch the soldering iron on the same conductor of the circuit
• Do not touch the soldering iron on the same conductor of the circuit
board (within 3 times).
• Be careful not to apply force on the conductor when soldering or
unsoldering.
UNLEADED SOLDER
This unit uses unleaded solder.
Boards requiring use of unleaded solder are printed with the lead free
mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with the
Boards requiring use of unleaded solder are printed with the lead free
mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with the
lead free mark due to their particular size.)
: LEAD FREE MARK
Be careful to the following points to solder or unsolder.
• Set the soldering iron tip temperature to 350 °C approximately.
If cannot control temperature, solder/unsolder at high temperature
for a short time.
Caution: The printed pattern (copper foil) may peel away if the
for a short time.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
Unleaded solder is more viscous (sticky, less prone to
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
flow) than ordinary solder so use caution not to let solder
bridges occur such as on IC pins, etc.
• Be sure to control soldering iron tips used for unleaded solder and
those for leaded solder so they are managed separately. Mixing un-
leaded solder and leaded solder will cause detachment phenomenon.
leaded solder and leaded solder will cause detachment phenomenon.
The changed portions from
Ver. 1.1 are shown in blue.
Ver. 1.1 are shown in blue.
Ver. 1.2 2012.05
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