XDR-S60DBP - Sony Audio Service Manual (repair manual). Page 2

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

ABOUT  PART  REPAIR  OF  EACH  BOARD
When boards installed by this unit are defective, replace the com-
plete board. However, some of mounted parts are replaceable. Re-
fer to “4. EXPLODED VIEWS” (page 16 or subsequent ones) for 
parts that can be replaceable.

 .............................................  

2

2-1. Disassembly 

Flow 

...........................................................   3

2-2. Knob 

(Tune) 

Assy 

...........................................................   3

2-3.  Knob (Volume) Block .....................................................   4
2-4. Telescopic 

Antenna 

(ANT1) 

...........................................   4

2-5.  Cabinet (Rear) Block ......................................................   5
2-6.  Wire Fuse (F102) ............................................................   5
2-7. Chassis 

Block 

..................................................................   6

2-8. AMP 

Board 

.....................................................................   7

2-9.  MAIN Board Block ........................................................   8
2-10.  Module Assy (DAB Module) (DAB1) ............................   8
2-11. LCD Board ......................................................................   9
2-12.  Shield Case (LCD) Block ...............................................   9
2-13.  Liquid Crystal Display Panel (LCD1) ............................   10
2-14.  Box (Speaker) Block .......................................................   11
2-15. Speaker Assy (SP1) .........................................................   11

 ............................................................   12

4-1. Overall 

Section 

...............................................................  16

4-2.  Cabinet (Rear) Section ....................................................   17
4-3.  Cabinet (Front) Section ...................................................   18
4-4.  LCD Board Section .........................................................   19
4-5. Chassis 

Section 

...............................................................  20

 .......................................................   21