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FST-GTK11iP/GTK33iP/RDH-GTK11iP/GTK33iP
9
3. GTK33-SMPS board (GTK33iP only)
– GTK33-SMPS Board (Component Side) –
A932
A930
L902
L901
C905
VDR901
A931
C986
C944
C943
T901
T903
R930
R931
C914
C911
C912
Fix the 180 degrees or larger
circumferences of C914, and
fix C911 and C912 with the board.
circumferences of C914, and
fix C911 and C912 with the board.
Fix circumferences of C986.
Fix circumferences of C943 and C944.
Fix both the sides of
L901 and L902 with the board.
L901 and L902 with the board.
Fix A930 with the board.
Fix A931 with the board.
Fix T901 with the board.
Fix T903 with the board.
Fix R930 and R931 with the board.
Fix A932 with the board.
Apply bond on
C905 and VDR901.
C905 and VDR901.
Confirmation points:
1. The bond does not become thin on
1. The bond does not become thin on
the way, and is applied in a fixed
quantity 180 degrees or more.
2. There is no space between C914
and
and
board.
3. The bond is applied to both C914
and
and
board.
4. The bond total amount is not less
than 5 g.
Confirmation points:
1. The leads of L901 and L902 cannot be
seen.
2. There is no space between L901/L902 and
board.
3. The bond is applied to both L901 and L902.
4. The bond is applied not less than 10 mm
1. The leads of L901 and L902 cannot be
seen.
2. There is no space between L901/L902 and
board.
3. The bond is applied to both L901 and L902.
4. The bond is applied not less than 10 mm
to the side body of L901 and L902.
5. The bond total amount in both sides
(the board-edge side and board-center
side) is not less than 7 g, respectively.
The portion which applies bond:
Ver. 1.1
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