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FST-GTK11iP/GTK33iP/RDH-GTK11iP/GTK33iP
8
2. GTK11-SMPS board (GTK11iP only)
– GTK11-SMPS Board (Component Side) –
C905
VDR901
C914
A930
A931
C967
T901
R933
R934
C969
Fix the 180 degrees or larger
circumferences of C914.
circumferences of C914.
Confirmation points:
1. The bond does not become thin on
1. The bond does not become thin on
the way, and is applied in a fixed
quantity 180 degrees or more.
2. There is no space between C914 and
board.
3. The bond is applied to both C914 and
board.
4. The bond total amount is not less
board.
3. The bond is applied to both C914 and
board.
4. The bond total amount is not less
than 5 g.
Confirmation points:
1. The leads of L903 and L904 cannot be
seen.
2. There is no space between L903/L904 and
board.
3. The bond is applied to both L903 and L904.
4. The bond is applied not less than 10 mm
1. The leads of L903 and L904 cannot be
seen.
2. There is no space between L903/L904 and
board.
3. The bond is applied to both L903 and L904.
4. The bond is applied not less than 10 mm
to the side body of L903 and L904.
5. The bond total amount in both sides
(the board-edge side and board-center
side) is not less than 7 g, respectively.
Fix the 90-degree or larger
circumferences of C967.
circumferences of C967.
Fix the 90-degree or larger
circumferences of C969.
circumferences of C969.
Fix both the sides of
L903 and L904 with the board.
L903 and L904 with the board.
Fix both the sides of
T901 with the board.
T901 with the board.
Fix A931 with the board.
Fix A930 with the board.
Fix R933 and R934
with the board.
with the board.
Apply bond on
C905 and VDR901.
C905 and VDR901.
L904
L903
The portion which applies bond:
Ver. 1.1
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