FST-GTK33IP, RDH-GTK11IP, RDH-GTK33IP - Sony Audio Service Manual (repair manual)

fst-gtk33ip, rdh-gtk11ip, rdh-gtk33ip service manual
Model
FST-GTK33IP RDH-GTK11IP RDH-GTK33IP
Pages
86
Size
7.59 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
fst-gtk33ip-rdh-gtk11ip-rdh-gtk33ip.pdf
Date

Read Sony FST-GTK33IP / RDH-GTK11IP / RDH-GTK33IP Service Manual online

SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
SPECIFICATIONS
HOME AUDIO DOCKING SYSTEM
9-893-451-03
2013D33-1
© 
2013.04
US Model
RDH-GTK33iP
AEP Model
UK Model
Saudi Arabia Model
Singapore Model
Malaysia Model
RDH-GTK11iP
E Model
FST-GTK33iP
Australian Model
RDH-GTK11iP/GTK33iP
Mexican Model
FST-GTK11iP/GTK33iP
Ver. 1.2  2013.04
FST-GTK11iP/GTK33iP/
RDH-GTK11iP/GTK33iP
License and Trademark Notice
iPhone, iPod, iPod classic, iPod nano, and iPod touch 
are trademarks of Apple Inc., registered in the U.S. and 
other countries.
MPEG Layer-3 audio coding technology and patents 
licensed from Fraunhofer IIS and Thomson.
Windows Media is either a registered trademark or 
trademark of Microsoft Corporation in the United 
States and/or other countries.
This product contains technology subject to certain 
intellectual property rights of Microsoft. Use or 
distribution of this technology outside of this product 
is prohibited without the appropriate license(s) from 
Microsoft.
All other trademarks and registered trademarks are of 
their respective holders. In this manual, 
 and 
®
 marks 
are not specified.
Amplifier section (Except US model)
The following are measured at AC 120 V   240 V, 50/60 Hz (Latin American 
models (except for Mexican and Argentine models))
The following are measured at AC 127 V, 60 Hz (Mexican model)
The following are measured at AC 220 V   240 V, 50/60 Hz (European, 
Russian, Australian and Argentine models)
The following are measured at AC 120 V   240 V, 50/60 Hz (Other models)
FST-GTK33iP/RDH-GTK33iP
Power output (rated):
100 W + 100 W (at 3.5 Ω, 1 kHz, 1% THD)
RMS output power (reference):
210 W + 210 W (per channel at 3.5 Ω, 1 kHz)
FST-GTK11iP/RDH-GTK11iP
Power output (rated):
55 W + 55 W (at 3 Ω, 1 kHz, 1% THD)
RMS output power (reference):
115 W + 115 W (per channel at 3 Ω, 1 kHz)
Speaker section
Speaker system: 2 way speaker system, Bass reflex
Speaker units:
FST-GTK33iP/RDH-GTK33iP:
Woofer: 200 mm, cone type
Tweeter: 66 mm, cone type
FST-GTK11iP/RDH-GTK11iP:
Woofer: 160 mm, cone type
Tweeter: 40 mm, cone type
Rated impedance:
FST-GTK33iP/RDH-GTK33iP: 3.5 Ω
FST-GTK11iP/RDH-GTK11iP: 3.0 Ω
Input
DVD/PC IN (audio in L/R):
FST-GTK33iP/RDH-GTK33iP: Sensitivity 1,000 mV, impedance 47 kΩ
FST-GTK11iP/RDH-GTK11iP: Sensitivity 1,500 mV, impedance 47 kΩ
iPod/iPhone section
iPod/iPhone connector:
Output voltage: DC 5 V
Maximum output current: 1 A
Compatible iPod/iPhone models:
 iPod touch 4th generation
 iPod touch 3rd generation
 iPod touch 2nd generation
 iPod nano 6th generation
 iPod nano 5th generation (video camera) 
 iPod nano 4th generation (video) 
 iPod nano 3rd generation (video) 
 iPod  classic 
iPhone 4S
iPhone 4
iPhone 3GS
iPhone 3G
“Made for iPod,” and “Made for iPhone” mean that an electronic accessory has 
been designed to connect specifically to iPod or iPhone, respectively, and has 
been certified by the developer to meet Apple performance standards. Apple 
is not responsible for the operation of this device or its compliance with safety 
and regulatory standards. Please note that the use of this accessory with iPod 
or iPhone may affect wireless performance.
USB section
Supported bit rates:
MP3 (MPEG 1 Audio Layer-3): 32 kbps   320 kbps, VBR
WMA: 48 kbps   192 kbps, VBR
AAC: 48 kbps   320 kbps
Sampling frequencies:
MP3 (MPEG 1 Audio Layer-3): 32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
 (USB) port: Type A, maximum current 500 mA
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
FM lead antenna
AM loop antenna
FM tuner section:
Tuning range: 
87.5 MHz   108.0 MHz (50 kHz step) (Except US model)
AM tuner section:
Tuning range:
European, Russian and Saudi Arabian models: 
531 kHz   1,602 kHz (9 kHz step)
US and Latin American models: 
530 kHz   1,710 kHz (10 kHz step) 
531 kHz   1,710 kHz (9 kHz step)
Australian model: 
531 kHz   1,710 kHz (9 kHz step) 
530 kHz   1,710 kHz (10 kHz step)
Other models: 
531 kHz   1,602 kHz (9 kHz step) 
530 kHz   1,610 kHz (10 kHz step)
General
Power requirements:
Latin American models (except for Mexican and Argentine models): 
AC
US model:
 120 V   240 V, 50/60 Hz
Mexican model: 
AC 127 V, 60 Hz
European, Russian, Australian and Argentine models: 
AC 220 V   240 V, 50/60 Hz
Other models: 
AC 120 V   240 V, 50/60 Hz
Power consumption:
FST-GTK33iP/RDH-GTK33iP: 75 W (0.5 W at the Power Saving mode)
FST-GTK11iP/RDH-GTK11iP: 45 W (0.5 W at the Power Saving mode)
Dimensions (W/H/D):
FST-GTK33iP/RDH-GTK33iP: Approx. 768.5 mm × 323 mm × 385 mm
FST-GTK11iP/RDH-GTK11iP: Approx. 678.5 mm × 323 mm × 385 mm
Mass: 
FST-GTK33iP/RDH-GTK33iP: Approx. 14.0 kg
FST-GTK11iP/RDH-GTK11iP: Approx. 12.5 kg
Quantity of the unit: 1 piece
Supplied accessories: Remote Commander (1), R6 (Size AA) batteries (2), 
FM lead/AM loop antenna (1)
Design and specifications are subject to change without notice.
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
(The United States model only)
With 3.5 ohm loads, both channels driven, from 120   10,000 Hz; rated 
50 watts per channel minimum RMS power, with no more than 0.7% total 
harmonic distortion from 250 milliwatts to rated output.
Amplifier section (US model)
RMS output power (reference):
210 W + 210 W (per channel at 3.5 Ω, 1 kHz)
87.5 MHz   108.0 MHz (100 kHz step) (US model)
AC 120 V, 60 Hz
Photo: RDH-GTK33iP
FST-GTK11iP/GTK33iP/RDH-GTK11iP/GTK33iP
2
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
SAFETY  CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs, 
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE  TEST
The AC leakage from any exposed metal part to earth ground and 
from all exposed metal parts to any exposed metal part having a 
return to chassis, must not exceed 0.5 mA (500 microamperes.). 
Leakage current can be measured by any one of three methods.
1.  A commercial leakage tester, such as the Simpson 229 or RCA 
WT-540A. Follow the manufacturers’ instructions to use these 
instruments.
2.  A battery-operated AC milliammeter. The Data Precision 245 
digital multimeter is suitable for this job.
3.  Measuring the voltage drop across a resistor by means of a 
VOM or battery-operated AC voltmeter. The “limit” indication 
is 0.75 V, so analog meters must have an accurate low-voltage 
scale. The Simpson 250 and Sanwa SH-63Trd are examples 
of a passive VOM that is suitable. Nearly all battery operated 
digital multimeters that have a 2 V AC range are suitable. (See 
Fig. A)
1.5 k
Ω
0.15 
μF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
Fig. A.  Using an AC voltmeter to check AC leakage.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
FST-GTK11iP/GTK33iP/RDH-GTK11iP/GTK33iP
3
1. 
SERVICING  NOTES 
 .............................................  
4
2. DISASSEMBLY
2-1. Disassembly 
Flow 
...........................................................  12
2-2.  Side Panel (R) .................................................................   13
2-3.  Side Panel (L-base) .........................................................   14
2-4.  Cover (Back) Block ........................................................   15
2-5.  Back Panel Block (GTK11iP) .........................................   16
2-6.  Back Panel Block (GTK33iP) .........................................   17
2-7.  Shield (Main) Block ........................................................   18
2-8. Panel 
Right 
Assy 
.............................................................  19
2-9. USB 
Board 
......................................................................  20
2-10.  Stage (Bottom-I-PH) Block ............................................   20
2-11. Spring (PWB) .................................................................   21
2-12. IP Board ..........................................................................   21
2-13.  Spring (Lock 2) ...............................................................   22
2-14. MAIN Board ...................................................................   23
2-15.  Shield (Power) Block ......................................................   24
2-16.  Power Cord (AC1) ..........................................................   25
2-17.  GTK11-SMPS Board (GTK11iP) /
GTK33-SMPS Board (GTK33iP) ...................................   26
2-18.  Chassis Block, Reinforcement (Back Panel) Block  .......   27
2-19.  Ornament Base Block .....................................................   27
2-20. Front Panel Assy .............................................................   28
2-21.  Loudspeaker (16 cm) (SP1, SP2) (GTK11iP) .................   29
2-22.  Loudspeaker (20 cm) (SP1, SP2) (GTK33iP) ................   30
3. 
TEST  MODE 
 ............................................................   31
4. 
ELECTRICAL  CHECK 
 .........................................   32
5. DIAGRAMS
5-1.  Block Diagram - MAIN Section - ...................................   33
5-2.  Block Diagram - AMP Section - .....................................   34
5-3.  Block Diagram - REGULATOR Section - ......................   35
5-4.  Block Diagram - POWER SUPPLY Section - ................   36
5-5. Printed 
Wiring 
Board 
- MAIN Board (Component Side) - ................................   38
TABLE  OF  CONTENTS
5-6. Printed 
Wiring 
Board 
- MAIN Board (Conductor Side) - ..................................   39
5-7.  Schematic Diagram - MAIN Board (1/4) - .....................   40
5-8.  Schematic Diagram - MAIN Board (2/4) - .....................   41
5-9.  Schematic Diagram - MAIN Board (3/4) - .....................   42
5-10.  Schematic Diagram - MAIN Board (4/4) - .....................   43
5-11.  Printed Wiring Boards - AUDIO INPUT Section - ........   44
5-12.  Schematic Diagram - AUDIO INPUT Section - .............   45
5-13.  Printed Wiring Boards - PANEL Section - .....................   46
5-14.  Schematic Diagram - PANEL Section - ..........................   47
5-15. Printed Wiring Board 
- GTK11-SMPS Board - (GTK11iP) ..............................   48
5-16. Schematic Diagram 
- GTK11-SMPS Board - (GTK11iP) ..............................   49
5-17. Printed Wiring Board 
- GTK33-SMPS Board - (GTK33iP) ..............................   50
5-18. Schematic Diagram 
- GTK33-SMPS Board - (GTK33iP) ..............................   51
6. 
EXPLODED  VIEWS
6-1.  Side Panel Section ..........................................................   61
6-2.  Back Cover Section ........................................................   62
6-3.  Back Panel Section (GTK11iP) ......................................   63
6-4.  Back Panel Section (GTK33iP) ......................................   64
6-5. Ornament 
Section 
...........................................................  65
6-6.  Top Panel Section ...........................................................   66
6-7.  Front Panel Section .........................................................   67
6-8.  DC Fan Section ...............................................................   68
6-9.  MAIN Board Section ......................................................   69
6-10. Chassis Section ...............................................................   70
6-11.  SPK Box Section (GTK11iP) .........................................   71
6-12.  SPK Box Section (GTK33iP) .........................................   72
6-13.  LED Board Section .........................................................   73
7. 
ELECTRICAL  PARTS  LIST 
 ..............................   74
Accessories are given in the last of the electrical parts list.
FST-GTK11iP/GTK33iP/RDH-GTK11iP/GTK33iP
4
SECTION  1
SERVICING  NOTES
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
•  Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
MODEL  IDENTIFICATION
– Bottom side view –
Model No. 
OME AUDIO DOCKING SYSTEM
R
Power requirements
Displayed characters/
  values are example.
The written example of 
model number label.
Displayed characters/
  values are example.
The written example of 
stamp.
Power requirements
Model
Power requirements
GTK11iP: AEP, UK, AUS
AC:220 - 240V - 50/60Hz 45W
GTK11iP: RU
-
 220 - 240V 50/60Hz 45W
GTK11iP: EA, SP6
AC:120 - 240V - 50/60Hz 45W
GTK11iP: MX
ca 127 V - 60 Hz 45 W
GTK33iP: US
AC:120V - 60Hz 75W
GTK33iP: E2, E51
AC:120 - 240V - 50/60Hz 75W
GTK33iP: MX
ca 127 V - 60 Hz 75 W
GTK33iP: AUS
AC:220 - 240V - 50/60Hz 75W
• Abbreviation
 AUS : 
Australian 
model
  E2 
: 120V AC area in E model
  E51 
: Chilean and Peruvian models
  EA 
: Saudi Arabia model
  MX 
: Mexican model
  RU 
: Russian model
  SP6  : Singapore and Malaysia models
NOTE  THE  D009  AND  D010  ON  THE  LED (L)  BOARD  
REPLACING
D009 and D010 on the LED (L) board cannot exchange with 
single. When these parts are damaged, exchange the complete 
mounted board.
NOTE  THE  D009  AND  D010  ON  THE  LED (R)  BOARD  
REPLACING
D009 and D010 on the LED (R) board cannot exchange with 
single. When these parts are damaged, exchange the complete 
mounted board.
THE  OPERATION  CHECK  AFTER  REPAIR
After repair is completed, connect corresponding “iPhone” etc. 
to this unit and perform operation checks (playback, recording, 
charging, etc.).
NOTE  OF  PERFORMING  THE  OPERATION  CHECK
Don’t perform the operation check in the state where the heat sink 
was removed from this unit, by any means. When the operation 
check is performed, be sure to fi x the heat sink to the board in 
advance.
NOTE  OF  REPLACING  THE  IC702  ON  THE  MAIN  
BOARD  AND  THE  COMPLETE  MAIN  BOARD
When IC702 on the MAIN board and the complete MAIN board 
are replaced, it is necessary to spread the compound between parts 
and heat sink.
Part No.
   
Description
J-2501-221-A 
THERMAL COMPOUND (G747)
Spread the compound referring to the fi gure below.
IC702
– MAIN Board (Component Side) –
IC702
Ver. 1.1
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