Read Sony FST-GTK33IP / RDH-GTK11IP / RDH-GTK33IP Service Manual online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
SPECIFICATIONS
HOME AUDIO DOCKING SYSTEM
9-893-451-03
2013D33-1
©
2013.04
US Model
RDH-GTK33iP
AEP Model
UK Model
Saudi Arabia Model
Singapore Model
Malaysia Model
RDH-GTK11iP
E Model
FST-GTK33iP
Australian Model
RDH-GTK11iP/GTK33iP
Mexican Model
FST-GTK11iP/GTK33iP
Ver. 1.2 2013.04
FST-GTK11iP/GTK33iP/
RDH-GTK11iP/GTK33iP
License and Trademark Notice
iPhone, iPod, iPod classic, iPod nano, and iPod touch
are trademarks of Apple Inc., registered in the U.S. and
other countries.
MPEG Layer-3 audio coding technology and patents
licensed from Fraunhofer IIS and Thomson.
Windows Media is either a registered trademark or
trademark of Microsoft Corporation in the United
States and/or other countries.
This product contains technology subject to certain
intellectual property rights of Microsoft. Use or
distribution of this technology outside of this product
is prohibited without the appropriate license(s) from
Microsoft.
All other trademarks and registered trademarks are of
their respective holders. In this manual,
are trademarks of Apple Inc., registered in the U.S. and
other countries.
MPEG Layer-3 audio coding technology and patents
licensed from Fraunhofer IIS and Thomson.
Windows Media is either a registered trademark or
trademark of Microsoft Corporation in the United
States and/or other countries.
This product contains technology subject to certain
intellectual property rights of Microsoft. Use or
distribution of this technology outside of this product
is prohibited without the appropriate license(s) from
Microsoft.
All other trademarks and registered trademarks are of
their respective holders. In this manual,
™
and
®
marks
are not specified.
Amplifier section (Except US model)
The following are measured at AC 120 V 240 V, 50/60 Hz (Latin American
models (except for Mexican and Argentine models))
The following are measured at AC 127 V, 60 Hz (Mexican model)
The following are measured at AC 220 V 240 V, 50/60 Hz (European,
Russian, Australian and Argentine models)
The following are measured at AC 120 V 240 V, 50/60 Hz (Other models)
models (except for Mexican and Argentine models))
The following are measured at AC 127 V, 60 Hz (Mexican model)
The following are measured at AC 220 V 240 V, 50/60 Hz (European,
Russian, Australian and Argentine models)
The following are measured at AC 120 V 240 V, 50/60 Hz (Other models)
FST-GTK33iP/RDH-GTK33iP
Power output (rated):
100 W + 100 W (at 3.5 Ω, 1 kHz, 1% THD)
RMS output power (reference):
210 W + 210 W (per channel at 3.5 Ω, 1 kHz)
100 W + 100 W (at 3.5 Ω, 1 kHz, 1% THD)
RMS output power (reference):
210 W + 210 W (per channel at 3.5 Ω, 1 kHz)
FST-GTK11iP/RDH-GTK11iP
Power output (rated):
55 W + 55 W (at 3 Ω, 1 kHz, 1% THD)
RMS output power (reference):
115 W + 115 W (per channel at 3 Ω, 1 kHz)
55 W + 55 W (at 3 Ω, 1 kHz, 1% THD)
RMS output power (reference):
115 W + 115 W (per channel at 3 Ω, 1 kHz)
Speaker section
Speaker system: 2 way speaker system, Bass reflex
Speaker units:
Speaker units:
FST-GTK33iP/RDH-GTK33iP:
Woofer: 200 mm, cone type
Tweeter: 66 mm, cone type
Tweeter: 66 mm, cone type
FST-GTK11iP/RDH-GTK11iP:
Woofer: 160 mm, cone type
Tweeter: 40 mm, cone type
Tweeter: 40 mm, cone type
Rated impedance:
FST-GTK33iP/RDH-GTK33iP: 3.5 Ω
FST-GTK11iP/RDH-GTK11iP: 3.0 Ω
FST-GTK11iP/RDH-GTK11iP: 3.0 Ω
Input
DVD/PC IN (audio in L/R):
FST-GTK33iP/RDH-GTK33iP: Sensitivity 1,000 mV, impedance 47 kΩ
FST-GTK11iP/RDH-GTK11iP: Sensitivity 1,500 mV, impedance 47 kΩ
FST-GTK11iP/RDH-GTK11iP: Sensitivity 1,500 mV, impedance 47 kΩ
iPod/iPhone section
iPod/iPhone connector:
Output voltage: DC 5 V
Maximum output current: 1 A
Maximum output current: 1 A
Compatible iPod/iPhone models:
iPod touch 4th generation
iPod touch 3rd generation
iPod touch 2nd generation
iPod nano 6th generation
iPod nano 5th generation (video camera)
iPod nano 4th generation (video)
iPod nano 3rd generation (video)
iPod classic
iPod touch 3rd generation
iPod touch 2nd generation
iPod nano 6th generation
iPod nano 5th generation (video camera)
iPod nano 4th generation (video)
iPod nano 3rd generation (video)
iPod classic
iPhone 4S
iPhone 4
iPhone 3GS
iPhone 3G
iPhone 4
iPhone 3GS
iPhone 3G
“Made for iPod,” and “Made for iPhone” mean that an electronic accessory has
been designed to connect specifically to iPod or iPhone, respectively, and has
been certified by the developer to meet Apple performance standards. Apple
is not responsible for the operation of this device or its compliance with safety
and regulatory standards. Please note that the use of this accessory with iPod
or iPhone may affect wireless performance.
been designed to connect specifically to iPod or iPhone, respectively, and has
been certified by the developer to meet Apple performance standards. Apple
is not responsible for the operation of this device or its compliance with safety
and regulatory standards. Please note that the use of this accessory with iPod
or iPhone may affect wireless performance.
USB section
Supported bit rates:
MP3 (MPEG 1 Audio Layer-3): 32 kbps 320 kbps, VBR
WMA: 48 kbps 192 kbps, VBR
AAC: 48 kbps 320 kbps
WMA: 48 kbps 192 kbps, VBR
AAC: 48 kbps 320 kbps
Sampling frequencies:
MP3 (MPEG 1 Audio Layer-3): 32/44.1/48 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
WMA: 44.1 kHz
AAC: 44.1 kHz
(USB) port: Type A, maximum current 500 mA
Tuner section
FM stereo, FM/AM superheterodyne tuner
Antenna:
FM lead antenna
AM loop antenna
AM loop antenna
FM tuner section:
Tuning range:
87.5 MHz 108.0 MHz (50 kHz step) (Except US model)
AM tuner section:
Tuning range:
European, Russian and Saudi Arabian models:
531 kHz 1,602 kHz (9 kHz step)
US and Latin American models:
530 kHz 1,710 kHz (10 kHz step)
531 kHz 1,710 kHz (9 kHz step)
Australian model:
531 kHz 1,710 kHz (9 kHz step)
530 kHz 1,710 kHz (10 kHz step)
Other models:
531 kHz 1,602 kHz (9 kHz step)
530 kHz 1,610 kHz (10 kHz step)
European, Russian and Saudi Arabian models:
531 kHz 1,602 kHz (9 kHz step)
US and Latin American models:
530 kHz 1,710 kHz (10 kHz step)
531 kHz 1,710 kHz (9 kHz step)
Australian model:
531 kHz 1,710 kHz (9 kHz step)
530 kHz 1,710 kHz (10 kHz step)
Other models:
531 kHz 1,602 kHz (9 kHz step)
530 kHz 1,610 kHz (10 kHz step)
General
Power requirements:
Latin American models (except for Mexican and Argentine models):
AC
AC
US model:
120 V 240 V, 50/60 Hz
Mexican model:
AC 127 V, 60 Hz
European, Russian, Australian and Argentine models:
AC 220 V 240 V, 50/60 Hz
Other models:
AC 120 V 240 V, 50/60 Hz
AC 127 V, 60 Hz
European, Russian, Australian and Argentine models:
AC 220 V 240 V, 50/60 Hz
Other models:
AC 120 V 240 V, 50/60 Hz
Power consumption:
FST-GTK33iP/RDH-GTK33iP: 75 W (0.5 W at the Power Saving mode)
FST-GTK11iP/RDH-GTK11iP: 45 W (0.5 W at the Power Saving mode)
FST-GTK11iP/RDH-GTK11iP: 45 W (0.5 W at the Power Saving mode)
Dimensions (W/H/D):
FST-GTK33iP/RDH-GTK33iP: Approx. 768.5 mm × 323 mm × 385 mm
FST-GTK11iP/RDH-GTK11iP: Approx. 678.5 mm × 323 mm × 385 mm
FST-GTK11iP/RDH-GTK11iP: Approx. 678.5 mm × 323 mm × 385 mm
Mass:
FST-GTK33iP/RDH-GTK33iP: Approx. 14.0 kg
FST-GTK11iP/RDH-GTK11iP: Approx. 12.5 kg
FST-GTK11iP/RDH-GTK11iP: Approx. 12.5 kg
Quantity of the unit: 1 piece
Supplied accessories: Remote Commander (1), R6 (Size AA) batteries (2),
FM lead/AM loop antenna (1)
FM lead/AM loop antenna (1)
Design and specifications are subject to change without notice.
AUDIO POWER SPECIFICATIONS
POWER OUTPUT AND TOTAL HARMONIC DISTORTION:
(The United States model only)
(The United States model only)
With 3.5 ohm loads, both channels driven, from 120 10,000 Hz; rated
50 watts per channel minimum RMS power, with no more than 0.7% total
harmonic distortion from 250 milliwatts to rated output.
50 watts per channel minimum RMS power, with no more than 0.7% total
harmonic distortion from 250 milliwatts to rated output.
Amplifier section (US model)
RMS output power (reference):
210 W + 210 W (per channel at 3.5 Ω, 1 kHz)
210 W + 210 W (per channel at 3.5 Ω, 1 kHz)
87.5 MHz 108.0 MHz (100 kHz step) (US model)
AC 120 V, 60 Hz
Photo: RDH-GTK33iP
FST-GTK11iP/GTK33iP/RDH-GTK11iP/GTK33iP
2
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
SAFETY CHECK-OUT
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
After correcting the original service problem, perform the follow-
ing safety check before releasing the set to the customer:
Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
The AC leakage from any exposed metal part to earth ground and
from all exposed metal parts to any exposed metal part having a
return to chassis, must not exceed 0.5 mA (500 microamperes.).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A. Follow the manufacturers’ instructions to use these
instruments.
instruments.
2. A battery-operated AC milliammeter. The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter. The “limit” indication
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
is 0.75 V, so analog meters must have an accurate low-voltage
scale. The Simpson 250 and Sanwa SH-63Trd are examples
of a passive VOM that is suitable. Nearly all battery operated
digital multimeters that have a 2 V AC range are suitable. (See
Fig. A)
1.5 k
Ω
0.15
μF
AC
voltmeter
(0.75 V)
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Parts on Set
Earth Ground
Fig. A. Using an AC voltmeter to check AC leakage.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
FST-GTK11iP/GTK33iP/RDH-GTK11iP/GTK33iP
3
1.
SERVICING NOTES
.............................................
4
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 12
2-2. Side Panel (R) ................................................................. 13
2-3. Side Panel (L-base) ......................................................... 14
2-4. Cover (Back) Block ........................................................ 15
2-5. Back Panel Block (GTK11iP) ......................................... 16
2-6. Back Panel Block (GTK33iP) ......................................... 17
2-7. Shield (Main) Block ........................................................ 18
2-8. Panel
2-3. Side Panel (L-base) ......................................................... 14
2-4. Cover (Back) Block ........................................................ 15
2-5. Back Panel Block (GTK11iP) ......................................... 16
2-6. Back Panel Block (GTK33iP) ......................................... 17
2-7. Shield (Main) Block ........................................................ 18
2-8. Panel
Right
Assy
............................................................. 19
2-9. USB
Board
...................................................................... 20
2-10. Stage (Bottom-I-PH) Block ............................................ 20
2-11. Spring (PWB) ................................................................. 21
2-12. IP Board .......................................................................... 21
2-13. Spring (Lock 2) ............................................................... 22
2-14. MAIN Board ................................................................... 23
2-15. Shield (Power) Block ...................................................... 24
2-16. Power Cord (AC1) .......................................................... 25
2-17. GTK11-SMPS Board (GTK11iP) /
2-11. Spring (PWB) ................................................................. 21
2-12. IP Board .......................................................................... 21
2-13. Spring (Lock 2) ............................................................... 22
2-14. MAIN Board ................................................................... 23
2-15. Shield (Power) Block ...................................................... 24
2-16. Power Cord (AC1) .......................................................... 25
2-17. GTK11-SMPS Board (GTK11iP) /
GTK33-SMPS Board (GTK33iP) ................................... 26
2-18. Chassis Block, Reinforcement (Back Panel) Block ....... 27
2-19. Ornament Base Block ..................................................... 27
2-20. Front Panel Assy ............................................................. 28
2-21. Loudspeaker (16 cm) (SP1, SP2) (GTK11iP) ................. 29
2-22. Loudspeaker (20 cm) (SP1, SP2) (GTK33iP) ................ 30
2-19. Ornament Base Block ..................................................... 27
2-20. Front Panel Assy ............................................................. 28
2-21. Loudspeaker (16 cm) (SP1, SP2) (GTK11iP) ................. 29
2-22. Loudspeaker (20 cm) (SP1, SP2) (GTK33iP) ................ 30
3.
TEST MODE
............................................................ 31
4.
ELECTRICAL CHECK
......................................... 32
5. DIAGRAMS
5-1. Block Diagram - MAIN Section - ................................... 33
5-2. Block Diagram - AMP Section - ..................................... 34
5-3. Block Diagram - REGULATOR Section - ...................... 35
5-4. Block Diagram - POWER SUPPLY Section - ................ 36
5-5. Printed
5-2. Block Diagram - AMP Section - ..................................... 34
5-3. Block Diagram - REGULATOR Section - ...................... 35
5-4. Block Diagram - POWER SUPPLY Section - ................ 36
5-5. Printed
Wiring
Board
- MAIN Board (Component Side) - ................................ 38
TABLE OF CONTENTS
5-6. Printed
Wiring
Board
- MAIN Board (Conductor Side) - .................................. 39
5-7. Schematic Diagram - MAIN Board (1/4) - ..................... 40
5-8. Schematic Diagram - MAIN Board (2/4) - ..................... 41
5-9. Schematic Diagram - MAIN Board (3/4) - ..................... 42
5-10. Schematic Diagram - MAIN Board (4/4) - ..................... 43
5-11. Printed Wiring Boards - AUDIO INPUT Section - ........ 44
5-12. Schematic Diagram - AUDIO INPUT Section - ............. 45
5-13. Printed Wiring Boards - PANEL Section - ..................... 46
5-14. Schematic Diagram - PANEL Section - .......................... 47
5-15. Printed Wiring Board
5-8. Schematic Diagram - MAIN Board (2/4) - ..................... 41
5-9. Schematic Diagram - MAIN Board (3/4) - ..................... 42
5-10. Schematic Diagram - MAIN Board (4/4) - ..................... 43
5-11. Printed Wiring Boards - AUDIO INPUT Section - ........ 44
5-12. Schematic Diagram - AUDIO INPUT Section - ............. 45
5-13. Printed Wiring Boards - PANEL Section - ..................... 46
5-14. Schematic Diagram - PANEL Section - .......................... 47
5-15. Printed Wiring Board
- GTK11-SMPS Board - (GTK11iP) .............................. 48
5-16. Schematic Diagram
- GTK11-SMPS Board - (GTK11iP) .............................. 49
5-17. Printed Wiring Board
- GTK33-SMPS Board - (GTK33iP) .............................. 50
5-18. Schematic Diagram
- GTK33-SMPS Board - (GTK33iP) .............................. 51
6.
EXPLODED VIEWS
6-1. Side Panel Section .......................................................... 61
6-2. Back Cover Section ........................................................ 62
6-3. Back Panel Section (GTK11iP) ...................................... 63
6-4. Back Panel Section (GTK33iP) ...................................... 64
6-5. Ornament
6-2. Back Cover Section ........................................................ 62
6-3. Back Panel Section (GTK11iP) ...................................... 63
6-4. Back Panel Section (GTK33iP) ...................................... 64
6-5. Ornament
Section
........................................................... 65
6-6. Top Panel Section ........................................................... 66
6-7. Front Panel Section ......................................................... 67
6-8. DC Fan Section ............................................................... 68
6-9. MAIN Board Section ...................................................... 69
6-10. Chassis Section ............................................................... 70
6-11. SPK Box Section (GTK11iP) ......................................... 71
6-12. SPK Box Section (GTK33iP) ......................................... 72
6-13. LED Board Section ......................................................... 73
6-7. Front Panel Section ......................................................... 67
6-8. DC Fan Section ............................................................... 68
6-9. MAIN Board Section ...................................................... 69
6-10. Chassis Section ............................................................... 70
6-11. SPK Box Section (GTK11iP) ......................................... 71
6-12. SPK Box Section (GTK33iP) ......................................... 72
6-13. LED Board Section ......................................................... 73
7.
ELECTRICAL PARTS LIST
.............................. 74
Accessories are given in the last of the electrical parts list.
FST-GTK11iP/GTK33iP/RDH-GTK11iP/GTK33iP
4
SECTION 1
SERVICING NOTES
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
MODEL IDENTIFICATION
– Bottom side view –
Model No.
OME AUDIO DOCKING SYSTEM
R
Power requirements
Displayed characters/
values are example.
values are example.
The written example of
model number label.
model number label.
Displayed characters/
values are example.
values are example.
The written example of
stamp.
stamp.
Power requirements
Model
Power requirements
GTK11iP: AEP, UK, AUS
AC:220 - 240V - 50/60Hz 45W
GTK11iP: RU
-
220 - 240V 50/60Hz 45W
GTK11iP: EA, SP6
AC:120 - 240V - 50/60Hz 45W
GTK11iP: MX
ca 127 V - 60 Hz 45 W
GTK33iP: US
AC:120V - 60Hz 75W
GTK33iP: E2, E51
AC:120 - 240V - 50/60Hz 75W
GTK33iP: MX
ca 127 V - 60 Hz 75 W
GTK33iP: AUS
AC:220 - 240V - 50/60Hz 75W
• Abbreviation
AUS :
AUS :
Australian
model
E2
: 120V AC area in E model
E51
: Chilean and Peruvian models
EA
: Saudi Arabia model
MX
: Mexican model
RU
: Russian model
SP6 : Singapore and Malaysia models
NOTE THE D009 AND D010 ON THE LED (L) BOARD
REPLACING
D009 and D010 on the LED (L) board cannot exchange with
single. When these parts are damaged, exchange the complete
mounted board.
REPLACING
D009 and D010 on the LED (L) board cannot exchange with
single. When these parts are damaged, exchange the complete
mounted board.
NOTE THE D009 AND D010 ON THE LED (R) BOARD
REPLACING
D009 and D010 on the LED (R) board cannot exchange with
single. When these parts are damaged, exchange the complete
mounted board.
REPLACING
D009 and D010 on the LED (R) board cannot exchange with
single. When these parts are damaged, exchange the complete
mounted board.
THE OPERATION CHECK AFTER REPAIR
After repair is completed, connect corresponding “iPhone” etc.
to this unit and perform operation checks (playback, recording,
charging, etc.).
After repair is completed, connect corresponding “iPhone” etc.
to this unit and perform operation checks (playback, recording,
charging, etc.).
NOTE OF PERFORMING THE OPERATION CHECK
Don’t perform the operation check in the state where the heat sink
was removed from this unit, by any means. When the operation
check is performed, be sure to fi x the heat sink to the board in
advance.
Don’t perform the operation check in the state where the heat sink
was removed from this unit, by any means. When the operation
check is performed, be sure to fi x the heat sink to the board in
advance.
NOTE OF REPLACING THE IC702 ON THE MAIN
BOARD AND THE COMPLETE MAIN BOARD
When IC702 on the MAIN board and the complete MAIN board
are replaced, it is necessary to spread the compound between parts
and heat sink.
BOARD AND THE COMPLETE MAIN BOARD
When IC702 on the MAIN board and the complete MAIN board
are replaced, it is necessary to spread the compound between parts
and heat sink.
Part No.
Description
J-2501-221-A
THERMAL COMPOUND (G747)
Spread the compound referring to the fi gure below.
IC702
– MAIN Board (Component Side) –
IC702
Ver. 1.1