FST-GTK33IP, RDH-GTK11IP, RDH-GTK33IP - Sony Audio Service Manual (repair manual). Page 4

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

Model No. 

OME AUDIO DOCKING SYSTEM

R

Displayed characters/
  values are example.

Displayed characters/
  values are example.

GTK11iP: AEP, UK, AUS

AC:220 - 240V - 50/60Hz 45W

GTK11iP: RU

-

 220 - 240V 50/60Hz 45W

GTK11iP: EA, SP6

AC:120 - 240V - 50/60Hz 45W

GTK11iP: MX

ca 127 V - 60 Hz 45 W

GTK33iP: US

AC:120V - 60Hz 75W

GTK33iP: E2, E51

AC:120 - 240V - 50/60Hz 75W

GTK33iP: MX

ca 127 V - 60 Hz 75 W

GTK33iP: AUS

AC:220 - 240V - 50/60Hz 75W

• Abbreviation
 AUS : 

Australian 

model

  E2 

: 120V AC area in E model

  E51 

: Chilean and Peruvian models

  EA 

: Saudi Arabia model

  MX 

: Mexican model

  RU 

: Russian model

  SP6  : Singapore and Malaysia models

NOTE  THE  D009  AND  D010  ON  THE  LED (L)  BOARD  
REPLACING
D009 and D010 on the LED (L) board cannot exchange with 
single. When these parts are damaged, exchange the complete 
mounted board.

NOTE  THE  D009  AND  D010  ON  THE  LED (R)  BOARD  
REPLACING
D009 and D010 on the LED (R) board cannot exchange with 
single. When these parts are damaged, exchange the complete 
mounted board.

THE  OPERATION  CHECK  AFTER  REPAIR
After repair is completed, connect corresponding “iPhone” etc. 
to this unit and perform operation checks (playback, recording, 
charging, etc.).

NOTE  OF  PERFORMING  THE  OPERATION  CHECK
Don’t perform the operation check in the state where the heat sink 
was removed from this unit, by any means. When the operation 
check is performed, be sure to fi x the heat sink to the board in 
advance.

NOTE  OF  REPLACING  THE  IC702  ON  THE  MAIN  
BOARD  AND  THE  COMPLETE  MAIN  BOARD
When IC702 on the MAIN board and the complete MAIN board 
are replaced, it is necessary to spread the compound between parts 
and heat sink.

Part No.

   

Description

J-2501-221-A 

THERMAL COMPOUND (G747)

Spread the compound referring to the fi gure below.