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SECTION 2 DISASSEMBLY PROCEDURES
< RZ670/RW630 >
5. Unscrew the 5 screws and remove the LD unit from Heat spreader.
（Torque:25～35 N・cm）
[ Note for re-assembly ]
・ Evenly put heat compound on the rear surface of each LD unit.
2.12. Removal of Phosphor Wheel 1 / 2
1.Follow process till 2.9
2. Unscrew 3pcs then remove analysis block 2 (UPPER).
3. Unscrew 2pcs the remove RT-PCB
Lighting block 2
RT-P.C.Board
ＬＤ unit
Heat compound
4
3
2
Heat spreader
Heat Compound : Shinnetsu Silicon (X-23-7898D)
DIS-16
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