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SECTION 2 DISASSEMBLY PROCEDURES
< RZ670/RW630 >
6. Unscrew 4pcs the remove FM^PCB and DMD chip.
[ Caution ]
・Do not touch on the connection pads of interposer on FM-PCB.
・Do not touch on the chip surface and contacting pad of DMD.
・Do not touch on the chip surface and contacting pad of DMD.
[ Note for re-assembling ]
・ Screw up 4pcs in turn as show in the dwg. (torque : 50 - 60 N ・cm）
2.9. Removal of Rod (ASSY)
1. Remove the side cover (R) according to the section 2.4 "Removal of Side cover (L) / Side cover (R) / Front cover /
Rear cover.
2. Unscrew the 2 screws and remove the Radiator fan block.
3. Unscrew the 2 screws and remove the Liquid cooling tank plate.
FM-PCB
DMD chip
Interposer
Insulator
backer plate
①
②
③
④
Radiator fan block
Liquid cooling tank
(Upper）
4
2
2
DIS-13
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