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SECTION 2 DISASSEMBLY PROCEDURES
< RZ670/RW630 >
4. Unscrew the 4 screws and remove the Heat receiving plate 2.
And then remove the Liquid cooling unit 2 (upper side).
(Torque:75±15 N・cm)
[ caution for re-assembling ]
1) Evenly put the heat compound on the rear surface of heat absob jacket.
2) Place correctly with the position confirming projection.
5. Remove liquid cooling system-2 (lower) by the same process of liquid cooling system-2.
2.11. Removal of LD unit
1. Remove the Liquid cooling tank and Radiator according to the section 2.10 "Removal of Liquid Cooling Unit 1/2".
2. Unscrew the 4 screws and remove the LD block (LD2-3/LD2-4).
3. Unscrew the 4 screws and remove the LD block (LD2-1/LD2-2).
4. Remove the LD block of lighting block 1 (lower side) at the same procedure.
Heat receiving plate 2 (Upper)
Put heat compound
Position confirming projectioin
LD Block
(LD2-3/LD2-3)
(LD2-3/LD2-3)
LD Block
(LD2-1/LD2-2)
(LD2-1/LD2-2)
1
3
4
1
3
Heat compound : Shinnetsu Silicon X-23-7898D
DIS-15
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