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SECTION 2 DISASSEMBLY PROCEDURES
< RZ670/RW630 >
6. Unscrew the 4 screws, remove FM-PCB and DMD chip.
[ Caution ] ・Do not touch the interposer contact part on FM-P.C.Board. (cause poor contact)
・Do not touch on the chip surface and contact pins of DMD.
[ Note for re-assembling ]
・ Tighten the 4 screws in numerical order. (torque : 50 - 60 N ・cm）
2.9. Removal of Rod (ASSY)
1. Remove the side cover (R) according to the section 2.4 "Removal of Side cover (L) / Side cover (R) / Front cover /
Rear cover".
2. Unscrew the 2 screws and remove the Radiator fan block.
3. Unscrew the 2 screws and remove the Liquid cooling tank plate.
FM-PCB
DMD chip
Interposer
Insulator
backer plate
①
②
③
④
Radiator fan block
Liquid cooling tank
(Upper）
4
2
2
DIS-13
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