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SECTION 2 DISASSEMBLY PROCEDURES
< RZ670/RW630 >
4. Unscrew the 4 screws and remove the Heat receiving plate 2, and then remove the Liquid cooling unit 2 (upper side).
（Torque:75±15 N・cm）
[ caution for re-assembling ]
・ Apply the heat dissipation compound evenly to the rear surface of liquid cooling pump and heat receiving plate.
・ Take care that compound does not stick out.
・ Take care that compound does not stick out.
5. Remove liquid cooling unit 1 (lower) by the same process of liquid cooling unit 2.
2.11. Removal of LD unit
1. Remove the Liquid cooling tank and Radiator according to the section 2.10 "Removal of Liquid Cooling Unit 1/2".
2. Unscrew the 4 screws and remove the LD block (LD2-3/LD2-4).
3. Unscrew the 4 screws and remove the LD block (LD2-1/LD2-2).
4. Remove the LD block of lighting block 1 (lower side) at the same procedure.
Heat receiving plate 2 (Upper)
LD Block
(LD2-3/LD2-3)
(LD2-3/LD2-3)
LD Block
(LD2-1/LD2-2)
(LD2-1/LD2-2)
1
3
4
1
3
Heat dissipation compound :
Shin-Etsu Silicone [ G-776 ] grade
Shin-Etsu Silicone [ G-776 ] grade
Apply heat dissipation compound
DIS-15
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