Read JBL SUB 250P (serv.man2) EMC - CB Certificate online
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Report No.: 11034065 001
IEC 60065
Clause
Requirement + Test
Result - Remark
Verdict
TRF No. IEC60065K
b) Test hook of fig. 4 for 10 s (20 N)
Complied.
P
c) 30 mm diameter test tool for 5 s (100 or 250 N)
250 N applied.
P
9.2
No hazard after removing a cover by hand
No cover can be removed by
hand.
hand.
N/A
10
Insulation requirements
P
10.1
Insulation resistance (MΩ) at least 2 MΩ min. after
surge test for basic and 4 MΩ min. for reinforced
insulation ................................................................. :
surge test for basic and 4 MΩ min. for reinforced
insulation ................................................................. :
See appended table.
P
10.2
Humidity treatment 48 h or 120 h ........................... :
120 h
P
10.3
Insulation resistance and dielectric strength between
mains terminals
mains terminals
See appended table.
P
Insulation Resistance and dielectric strength across
BASIC or SUPPLEMENTARY insulation (Class I)
BASIC or SUPPLEMENTARY insulation (Class I)
N/A
Insulation resistance and dielectric strength across
REINFORCED insulation (Class II)
REINFORCED insulation (Class II)
See appended table.
P
11
Fault conditions
P
11.1
No shock hazard under fault condition
See appended table.
P
11.2
Heating under fault condition
See appended table.
P
Flames extinguish within 10 seconds
No flames.
N/A
No hazard from softening solder
No softerning solder.
N/A
Soldered terminations not used as protective
mechanism
mechanism
Soldered terminals are not
used as protective mechanism.
used as protective mechanism.
P
11.2.1
Measurement of temperature rises
See appended table.
P
11.2.2
Temperature rise of accessible parts
See appended table.
P
11.2.3
Temperature rise of parts, other than windings and
printed boards, providing electrical insulation
printed boards, providing electrical insulation
See appended table.
P
11.2.4
Temperature rise of parts acting as a support or
mechanical barrier
mechanical barrier
N/A
11.2.5
Temperature rise of windings
See appended table.
P
11.2.6
Temperature rise of printed boards shall not exceed
the limits of table 3 by max. 100 K for max. 5 min
the limits of table 3 by max. 100 K for max. 5 min
Not exceed the limits. See
appended table.
appended table.
P
Printed circuit boards (PCB) classified as V-0
according to 60695-11-10 or Clause G.1 may
exceed the limit in table 3 in case a) and b):
according to 60695-11-10 or Clause G.1 may
exceed the limit in table 3 in case a) and b):
N/A
a) Temperature rise of printed circuit boards
exceeding the limits of table 3 by not more than
100 K for an area not greater than 2 cm² ................ :
exceeding the limits of table 3 by not more than
100 K for an area not greater than 2 cm² ................ :
N/A
b) Temperature rise of printed circuit boards
exceeding the limits of table 3 up to 300 K for an
area not greater than 2 cm² for a maximum of 5 min
exceeding the limits of table 3 up to 300 K for an
area not greater than 2 cm² for a maximum of 5 min
N/A
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