Read Harman Kardon TU 970II (serv.man4) EMC - CB Certificate online
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Report Reference No.: CPSA0106916
Clause
Requirement – Test
Result - Remark
Verdict
Test Report EN 60065E Rev. 00 / 2004-09
Test probe 11 of IEC 61032 for 10 s (50 N)
P
Test hook of fig. 4 for 10 s (20 N)
P
30 mm diameter test tool for 5 s (100 or 250 N) .... : Applied 100 N
P
9.2
No hazard after removing a cover by hand
No removing covers by hand
N
10 INSULATION
REQUIREMENTS
⎯
10.1
Insulation resistance (MΩ) at least 2 MΩ min. after
surge test for basic and 4 MΩ min. for reinforced
insulation ................................................................. :
surge test for basic and 4 MΩ min. for reinforced
insulation ................................................................. :
> 4 MΩ P
10.2
Humidity treatment 48 h or 120 h ........................... : 120 h
P
10.3
Insulation resistance and dielectric strength
(see appended table)
P
11 FAULT
CONDITIONS
⎯
11.1
No shock hazard under fault condition
P
11.2
Heating under fault condition
P
No hazard from softening solder
P
11.2.1
Measurement of temperature rises
(see appended table)
P
11.2.2
Temperature rise of accessible parts
(see appended table)
P
11.2.3
Temperature rise of parts, other than windings,
providing electrical insulation
providing electrical insulation
(see appended table)
P
Temperature rise of printed circuit boards (PCB)
exceeding the limits of table 3 by max. 100 K for
max. 5 min
exceeding the limits of table 3 by max. 100 K for
max. 5 min
N
a) Temperature rise of printed circuit boards (PCB)
to 20.1.3, exceeding the limits of table 3 by not
more than 100 K for an area not greater than 2 cm²
to 20.1.3, exceeding the limits of table 3 by not
more than 100 K for an area not greater than 2 cm²
N
b) Temperature rise of printed circuit boards (PCB)
to 20.1.3 up to 300 K for an area not greater than
2 cm² for a maximum of 5 min
to 20.1.3 up to 300 K for an area not greater than
2 cm² for a maximum of 5 min
N
Meets all the special conditions if conductors on
printed circuit boards are interrupted
printed circuit boards are interrupted
N
Class I protective earthing maintained
N
11.2.4
Temperature rise of parts acting as a support or
mechanical barrier
mechanical barrier
N
11.2.5
Temperature rise of windings
(see appended table)
P
11.2.6
Temperature rise of parts not subject to the limits
of 11.2.1 to 11.2.5
of 11.2.1 to 11.2.5
(see appended table)
P
12 MECHANICAL
STRENGTH
⎯
12.1.1
Bump test where mass >7 kg
P
12.1.2
Vibration test
No damage & connection
loosening
loosening
P
12.1.3
Impact hammer test
P
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