Read Harman Kardon HS 500 (serv.man3) EMC - CB Certificate online
Page 9 of 59
Report No: JSH006020710-001
EN 60065
Clause
Requirement - Test
Result - Remark
Verdict
a) Temperature rise of printed circuit boards (PCB)
to 20.1.3, exceeding the limits of table 3 by not
more than 100 K for an area not greater than
2 cm²
to 20.1.3, exceeding the limits of table 3 by not
more than 100 K for an area not greater than
2 cm²
N
b) Temperature rise of printed circuit boards (PCB)
to 20.1.3 up to 300 K for an area not greater than
2 cm² for a maximum of 5 min
to 20.1.3 up to 300 K for an area not greater than
2 cm² for a maximum of 5 min
N
Meets all the special conditions if conductors on
printed circuit boards are interrupted
printed circuit boards are interrupted
N
Class I protective earthing maintained
N
11.2.4
Temperature rise of parts acting as a support or
mechanical barrier
mechanical barrier
P
11.2.5
Temperature rise of windings
(see appended table)
P
11.2.6
Temperature rise of parts not subject to the limits
of 11.2.1 to 11.2.5
of 11.2.1 to 11.2.5
(see appended table)
P
12 MECHANICAL
STRENGTH
P
12.1.1
Bump test where mass >7 kg
5.3kg
N
12.1.2 Vibration
test
Not carried out, no connection
which might impair safety can
become loosen
which might impair safety can
become loosen
P
12.1.3
Impact hammer test
0.5J P
Steel ball test
2J P
12.1.4
Drop test for portable apparatus where mass < 7
kg
kg
P
12.1.5
Thermoplastic enclosures strain relief test
70
o
C, 7h
P
12.2
Fixing of knobs, push buttons, keys and levers
P
12.3
Remote controls with hazardous live parts
N
12.4
Drawers (pull test 50 N, 10 s)
P
12.5
Antenna coaxial sockets providing isolation
N
12.6
Telescoping or rod antennas construction
N
12.6.1
Telescoping or rod antennas securement
N
13
CLEARANCE AND CREEPAGE DISTANCES
P
13.1
Clearances in accordance with 13.3
P
Creepage distances in accordance with 13.4
P
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