HK 3770 (serv.man2) - Harman Kardon Audio EMC - CB Certificate (repair manual). Page 20

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Report No 248607.
 
  
 
 
 
 
 
IEC 60065 
Clause 
Requirement + Test 
Result - Remark 
Verdict
 
TRF No. IEC60065K 
 
13.3.4 
Measurement of transient voltages  
No measurement of transient 
voltages. 
N/A 
13.4 
Creepage distances  
CTI > 100 
(see appended table 13) 
P 
 
Creepage distances greater than table 11 minimum 
values  
Not applicable. 
N/A 
13.5 
Printed boards  
Refer to below 
N/A 
13.5.1 
Clearances and creepage distances between 
conductors on printed circuit boards, one of which 
may be conductively connected to the mains, as in 
fig. 10  
No such PCB used 
N/A 
13.5.2 
Type B coated printed circuit boards complying with 
IEC 60664-3 (basic insulation only)  
No type B coated printed  
circuit boards. 
N/A 
13.6 
Conductive parts along uncemented joints 
clearances and creepage distances comply with 
13.3 and 13.4  
Jointed insulation not applied. 
N/A 
 
Conductive parts along reliably cemented joints 
comply with 8.8  
 
N/A 
 
Temperature cycle test and dielectric strength test  
 
N/A 
 
500V test for transformers, magnetic coupler and 
similar devices, if insulation is relied upon for safety 
 
N/A 
13.7 
Enclosed, enveloped or hermetically sealed parts 
not conductively connected to the mains, clearances 
and creepage distances as in table 12  
No such part used. 
N/A 
13.8 
Parts filled with insulating compound, meeting the 
requirements of 8.8  
Approved optocouplers. 
See appended table, list of 
critical components. 
P 
 
14 Components 
 
14.1 Resistors 
 
 
P 
 
a) Resistors between hazardous live parts and 
accessible metal parts  
No such resistors. 
N/A 
 
b) Resistors, other than between hazardous live 
parts and accessible parts  
Bleeder resistor, RX93. 
(Connected between Live and 
Neutral after mains fuse, 
certified component by VDE) 
See appended table, list of 
critical components. 
P 
 Resistors 
separately approved  .............................. : 
RX93. 
See appended table, list of 
critical components. 
P 
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