Read Harman Kardon HK 3390 EMC - CB Certificate online
- Page 13 of 43 -
Report
No.
98502
11 FAULT
CONDITIONS
11.1
No shock hazard under fault condition
No electric shock hazard
under fault conditions.
under fault conditions.
P
11.2
Heating under fault condition
See appended table
P
No hazard from softening solder
No softening of solder
P
Flames extinguish within 10 seconds
No flames
P
Soldered terminations not used as protective
mechanism
mechanism
No protective mechanism
P
11.2.1
Measurement of temperature rises
See appended table
P
11.2.2
Temperature rise of accessible parts
See appended table
P
11.2.3
Temperature rise of parts, other than windings,
providing electrical insulation
providing electrical insulation
See appended table
P
Temperature rise of printed circuit boards (PCB)
exceeding the limits of table 3 by max. 100 K for
max. 5 min
exceeding the limits of table 3 by max. 100 K for
max. 5 min
No exceeding the limits of
Table 3.
Table 3.
P
a) Temperature rise of printed circuit boards
(PCB) to 20.1.3, exceeding the limits of table 3 by
not more than 100 K for an area not greater than
2 cm²
(PCB) to 20.1.3, exceeding the limits of table 3 by
not more than 100 K for an area not greater than
2 cm²
No area where temperature
exceeds 100K above limits
exceeds 100K above limits
N/A
b) Temperature rise of printed circuit boards
(PCB) to 20.1.3 up to 300 K for an area not greater
than 2 cm² for a maximum of 5 min
(PCB) to 20.1.3 up to 300 K for an area not greater
than 2 cm² for a maximum of 5 min
No area where temperature
exceeds 300K above limits
exceeds 300K above limits
N/A
Meets all the special conditions if conductors on
printed circuit boards are interrupted
printed circuit boards are interrupted
No conductors are
interrupted /peeled/loosened
during fault conditions
interrupted /peeled/loosened
during fault conditions
N/A
Class I protective earthing maintained
Class II equipment
N/A
11.2.4
Temperature rise of parts acting as a support or
mechanical barrier
mechanical barrier
Temperature rises are
within the limits.
within the limits.
N/A
11.2.5
Temperature rise of windings
See appended table
P
11.2.6
Temperature rise of parts not subject to the limits
of 11.2.1 to 11.2.5
of 11.2.1 to 11.2.5
No excessive temperature
observed/measured on
other parts.
See appended table
observed/measured on
other parts.
See appended table
P
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