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Report
No.
98502
13.3 Clearances
2N for internal parts and
30N for enclosures are
considered when
determining clearances.
30N for enclosures are
considered when
determining clearances.
P
13.3.1 General
P
13.3.2
Circuits conductively connected to the mains
comply with table 8 and, where applicable, table 9
comply with table 8 and, where applicable, table 9
See attachment, Table to
EN/IEC 60065 7
EN/IEC 60065 7
th
edition.
P
13.3.3
Circuits not conductively connected to the mains
comply with table 10
comply with table 10
No hazardous secondary
voltages
voltages
N/A
13.3.4
Measurement of transient voltages
No measurement of
transient voltages
transient voltages
N/A
13.4 Creepage
distances
CTI > 100
See attachment, Table to
EN/IEC 60065 7
EN/IEC 60065 7
th
edition.
P
Creepage distances greater than table 11 minima
Not applicable
N/A
13.5 Printed
boards
N/A
13.5.1
Clearances and creepage distances between
conductors on printed circuit boards, one of
which may be conductively connected to the
mains, as in fig. 10
conductors on printed circuit boards, one of
which may be conductively connected to the
mains, as in fig. 10
No such PCB used
N/A
13.5.2
Type B coated printed circuit boards complying
with IEC 60664-3 (basic insulation only)
with IEC 60664-3 (basic insulation only)
No type B coated printed
circuit boards
circuit boards
N/A
13.6
Conductive parts along uncemented joints
clearances and creepage distances comply with
13.3 and 13.4
clearances and creepage distances comply with
13.3 and 13.4
Jointed insulation not
applied
applied
N/A
Conductive parts along reliably cemented joints
comply with 8.8
comply with 8.8
N/A
Temperature cycle test and dielectric strength test
N/A
13.7
Enclosed, enveloped or hermetically sealed parts:
not conductively connected to the mains:
clearances and creepage distances as in table 12
not conductively connected to the mains:
clearances and creepage distances as in table 12
No enclosed, enveloped or
hermetically sealed parts
hermetically sealed parts
N/A
13.8
Parts filled with insulating compound, meeting the
requirements of 8.8
requirements of 8.8
No parts filled with
insulating compound.
insulating compound.
N/A
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