Read Harman Kardon DVD 23 (serv.man11) EMC - CB Certificate online
page 11 of 63
Ref. No. : JSH05110330-002
IEC 60065
Clause
Requirement - Test
Result - Remark
Verdict
13.4 Creepage
distances
Primary—secondary: on PCB
track 5.0mm required.
track 5.0mm required.
Primary—accessible parts /
enclosure (operating voltage:
240Vrms): on PCB track
5.0mm required.
enclosure (operating voltage:
240Vrms): on PCB track
5.0mm required.
Primary—accessible parts /
enclosure (operating voltage:
250Vrms, 600Vp): on PCB
track 5.0mm required.
enclosure (operating voltage:
250Vrms, 600Vp): on PCB
track 5.0mm required.
L-N before fuse link:
3.0mm required
T502: P—S: 5.0mm required.
Pass
Creepage distances greater than table 11 minima
Measured distance:
Primary—secondary:
>5.4mm
>5.4mm
Primary—accessible parts /
enclosure (operating voltage:
240Vrms): >6.0mm
enclosure (operating voltage:
240Vrms): >6.0mm
Primary—accessible parts /
enclosure (operating voltage:
250Vrms, 600Vp): >5.4mm
enclosure (operating voltage:
250Vrms, 600Vp): >5.4mm
T502: P—S: >5.4mm
L-N before fuse link: >4.0mm
Pass
13.5 Printed
boards
N/A
13.5.1
Clearances and creepage distances between
conductors on printed circuit boards, one of which
may be conductively connected to the mains, as in
fig. 10
conductors on printed circuit boards, one of which
may be conductively connected to the mains, as in
fig. 10
N/A
13.5.2
Type B coated printed circuit boards complying with
IEC 60664-3 (basic insulation only)
IEC 60664-3 (basic insulation only)
N/A
13.6
Conductive parts along uncemented joints
clearances and creepage distances comply with
13.3 and 13.4
clearances and creepage distances comply with
13.3 and 13.4
N/A
Conductive parts along reliably cemented joints
comply with 8.8
comply with 8.8
N/A
13.7
Enclosed, enveloped or hermetically sealed parts:
not conductively connected to the mains: clearances
and creepage distances as in table 12
not conductively connected to the mains: clearances
and creepage distances as in table 12
No such parts
N/A
13.8
Parts filled with insulating compound, meeting the
requirements of 8.8
requirements of 8.8
No such parts
N/A
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