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Report
No.
129952
IEC 60065
Clause
Requirement – Test
Result - Remark
Verdict
TRF No. IEC60065_I
10 Insulation
requirements
10.1
Insulation resistance (MΩ) at least 2 MΩ min. after
surge test for basic and 4 MΩ min. for reinforced
insulation ……………………………………………..:
surge test for basic and 4 MΩ min. for reinforced
insulation ……………………………………………..:
> 100 M
Ω after surge test
P
10.2
Humidity treatment 48 h or 120 h ………………….:
Performed for 120 h at temp.
40
40
°C and humidity 93%
P
10.3
Insulation resistance and dielectric strength between
mains terminals ……………………………………...:
mains terminals ……………………………………...:
(see appended table 10.3)
P
Insulation Resistance and dielectric strength across
BASIC or SUPPLEMENTARY insulation (Class 1) :
BASIC or SUPPLEMENTARY insulation (Class 1) :
Class II apparatus
N/A
Insulation resistance and dielectric strength across
REINFORCED insulation (Class II) ……………..:
REINFORCED insulation (Class II) ……………..:
(see appended table 10.3)
P
11 Fault
conditions
11.1
No shock hazard under fault condition ……………:
No electric shock hazard under
fault conditions.
fault conditions.
P
11.2
Heating under fault condition ……………………….:
(see appended table 11.2)
P
Flames extinguish within 10 seconds ....................:
No flames
P
No hazard from softening solder …………………...:
No softening of solder
P
Soldered terminations not used as protective
mechanism ………………………………………..:
mechanism ………………………………………..:
No soldered terminations
P
11.2.1
Measurement of temperature rises ……..:
(see appended table 11.2)
P
11.2.2
Temperature rise of accessible parts ……...:
(see appended table 11.2)
P
11.2.3
Temperature rise of parts, other than windings,
providing electrical insulation ………………:
providing electrical insulation ………………:
(see appended table 11.2)
P
Temperature rise of printed circuit boards (PCB)
exceeding the limits of table 3 by max. 100 K for
max. 5 min ……………...:
exceeding the limits of table 3 by max. 100 K for
max. 5 min ……………...:
No exceeding the limits of
Table 3.
Table 3.
N/A
a) Temperature rise of printed circuit boards (PCB)
to 20.1.3, exceeding the limits of table 3 by not more
than 100 K for an area not greater than 2 cm² …:
to 20.1.3, exceeding the limits of table 3 by not more
than 100 K for an area not greater than 2 cm² …:
N/A
b) Temperature rise of printed circuit boards (PCB)
to 20.1.3 up to 300 K for an area not greater than
2 cm² for a maximum of 5 min ……………………….:
to 20.1.3 up to 300 K for an area not greater than
2 cm² for a maximum of 5 min ……………………….:
N/A
Meets all the special conditions if conductors on
printed circuit boards are interrupted
………………...:
printed circuit boards are interrupted
………………...:
No conductors are
interrupted/peeled/loosened
during fault conditions
interrupted/peeled/loosened
during fault conditions
P
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