AVR 445 (serv.man2) - Harman Kardon Audio EMC - CB Certificate (repair manual). Page 13

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Page 
11
 of 
31
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www.nemko.com
 
Report No. 
72390 
 
 
IEC/EN 60065 
Clause 
Requirement – Test 
Result - Remark 
Verdict 
11.2.1 
Measurement of temperature rises 
See attachment table and 
attachment, Table to 
EN/IEC 60065 7
th
 edition 
11.2.2 
Temperature rise of accessible parts 
See attachment table and 
attachment, Table to 
EN/IEC 60065 7
th
 edition 
11.2.3 
Temperature rise of parts, other than windings, 
providing electrical insulation 
See attachment table and 
attachment, Table to 
EN/IEC 60065 7
th
 edition 
 
Temperature rise of printed circuit boards (PCB) 
exceeding the limits of table 3 by max. 100 K for 
max. 5 min 
No area where temperature 
exceeds 100K above limits 
 
a) Temperature rise of printed circuit boards (PCB) 
to 20.1.3, exceeding the limits of table 3 by not 
more than 100 K for an area not greater than 2 cm²
 
 
b) Temperature rise of printed circuit boards (PCB) 
to 20.1.3 up to 300 K for an area not greater than 
2 cm² for a maximum of 5 min 
 
 
Meets all the special conditions if conductors on 
printed circuit boards are interrupted 
No conductors are 
interrupted/peeled/loosened 
during fault conditions 
 
Class I protective earthing maintained 
Class II apparatus
 
11.2.4 
Temperature rise of parts acting as a support or 
mechanical barrier 
Temperature rises are within 
the limits. 
11.2.5 
Temperature rise of windings 
See attachment table and 
attachment, Table to 
EN/IEC 60065 7
th
 edition 
11.2.6 
Temperature rise of parts not subject to the limits 
of 11.2.1 to 11.2.5 
No excessive temperature 
observed/measured on other 
parts 
 
 
 
12 MECHANICAL 
STRENGTH 
 
12.1.1 
Bump test where mass >7 kg 
No damage in the sense of 
this standard. 
12.1.2 Vibration 
test 
Assessed to be satisfactory 
constructed 
12.1.3 
Impact hammer test 
No damage in the sense of 
this standard 
 
Steel ball test 
No damage in the sense of 
this standard 
TRF No:  IEC/EN 60065F 
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