AVR 134 (serv.man2) - Harman Kardon Audio EMC - CB Certificate (repair manual). Page 11

 

Page 10 of 34 

Report Ref. No. 077-204389-000 

 

IEC/EN 60065 

Clause 

Requirement – Test 

Result - Remark 

Verdict 

 

TRF No. IECEN60065G 
 

 

13.3 

Clearances 

Basic between the mains: min. 
2.0 mm for 346 Vp; Reinforced 
between pri  and sec.: min. 4.0 
mm for 394 Vp 

P 

13.3.2 

Circuits conductively connected to the mains compl
y with table 8 and, where applicable, table 9 

 

Basic: between the mains conduct
ors: min 4,0 mm; between metal b
ottom chassis and  ST-
BY board : min. 9.0 mm; between 
back chassis and CP306 on ST-
BY board: min. 8.4 m; between pri
mary and secondary conductors o
n ST-
BY board: min. 6,4 mm; between s
ide chassis and CP304 on ST-
BY board: min. 8.9 mm; between p
rimary conductor of mains switch b
oard and switch enclosure : 4.2 m
m 

P 

13.3.3 

Circuits not conductively connected to the mains 
comply with table 10 

Non-hazardous secondary 
circuits. 

N/A 

13.4 

Creepage distances 

Basic between the mains: min. 
2.5 mm for 239 Vrms; 
Reinforced between pri  and 
sec.: min. 6.0 mm for 277 Vrms 

P 

 

Creepage distances greater than table 11 minima 

Same as Cl. 13.3.2

 

P 

13.5 Printed 

boards 

 

N/A 

13.5.1 

Clearances and creepage distances between 
conductors on printed circuit boards, one of which 
may be conductively connected to the mains, as in 
fig. 10 

 N/A 

13.5.2 

Type B coated printed circuit boards complying with 
IEC 60664-3 (basic insulation only) 

 N/A 

13.6 

Conductive parts along uncemented joints 
clearances and creepage distances comply with 
13.3 and 13.4 

 N/A 

 

Conductive parts along reliably cemented joints 
comply with 8.8 

 N/A 

13.7 

Enclosed, enveloped or hermetically sealed parts: 
not conductively connected to the mains: 
clearances and creepage distances as in table 12 

 N/A 

13.8 

Parts filled with insulating compound, meeting the 
requirements of 8.8 

 N/A 

 

 

 

14 COMPONENTS 

P 

14.1 Resistors 

N/A