DVP-PQ2 (serv.man2) - Sony DVD Service Manual (repair manual)

dvp-pq2 (serv.man2) service manual
Model
DVP-PQ2 (serv.man2)
Pages
79
Size
6.1 MB
Type
PDF
Document
Service Manual
Brand
Device
DVD
File
dvp-pq2-sm2.pdf
Date

Read Sony DVP-PQ2 (serv.man2) Service Manual online

SERVICE MANUAL
US Model
Canadian Model
AEP Model
Mexican Model
UK Model
CD/DVD PLAYER
DVP-PQ2
RMT-D148A
System
Laser:
 Semiconductor laser
Signal format system:
*(US,CND,MX): NTSC
*(AEP,UK): PAL/NTSC
Outputs
(Jack name: Jack type/Output level/Load impedance)
AUDIO OUT L/R: Phonojack/2 Vrms/10 k
DIGITAL OUT (COAXIAL): Phonojack/0.5 Vp-p/75
VIDEO OUT: Phonojack/1.0 Vp-p/75
S-VIDEO OUT: 4-pin mini DIN/
Y: 1.0 Vp-p
C: 0.3 Vp-p (PAL), 0.286 Vp-p (NTSC)/75
HEADPHONES/EARPHONES JACK:
Stereo mini-jack/9 m W + 9 m W/32
General
Power requirements:
*(US,CND,MX): 120 V, 60 Hz
*(AEP,UK): 220-240 V, 50/60 Hz
Power consumption: 9 W
Dimensions (approx.): 190 
× 147 × 235 mm (7 × 5 
7
/
8
 
× 9 in.)
(w/h/d)
Mass (approx.): 1.3 kg (2.9 lbs)
Operating temperature: 5°C to 35°C (41°F to 95°F)
Operating humidity: 25-80%
Supplied accessories
Operating Instructions (1)
Audio/video cord (1)
Remote (1)
AA (R6) size batteries (2)
EURO AV adaptor (AEP,UK)* (1)
Design sheet
Specifications and design are subject to change
without notice.
ENERGY STAR
 is a U.S. registered mark. As an
ENERGY STAR
 Partner, Sony Corporation has
determined that this product meets the ENERGY STAR
guidelines for energy efficiency.
* Refer Pg.4-1 for Abbreviation
SPECIFICATIONS
– 2 –
WARNING!!
WHEN  SERVICING,  DO  NOT  APPROACH  THE  LASER
EXIT  WITH  THE  EYE  TOO  CLOSELY.  IN  CASE  IT  IS
NECESSARY  TO  CONFIRM  LASER  BEAM  EMISSION,
BE  SURE  TO  OBSERVE  FROM  A  DISTANCE  OF
MORE   THAN   25  cm  FROM  THE  SURFACE  OF  THE
OBJECTIVE  LENS  ON  THE  OPTICAL  PICK-UP  BLOCK.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous ra-
diation exposure.
ATTENTION  AU  COMPOSANT  AYANT  RAPPORT
À  LA  SÉCURITÉ!
LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE 
SUR  LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE
DES  PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ
DE  FONCTIONNEMENT.  NE  REMPLACER  CES  COM-
POSANTS  QUE  PAR  DES  PIÈCES  SONY  DONT  LES
NUMÉROS  SONT  DONNÉS  DANS  CE  MANUEL  OU
DANS  LES  SUPPLÉMENTS  PUBLIÉS  PAR  SONY.
SAFETY-RELATED  COMPONENT  WARNING!!
COMPONENTS  IDENTIFIED  BY  MARK  
  OR  DOTTED
LINE  WITH  MARK  
  ON  THE  SCHEMATIC  DIAGRAMS
AND  IN  THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE
OPERATION.  REPLACE  THESE  COMPONENTS  WITH
SONY  PARTS  WHOSE  PART  NUMBERS  APPEAR  AS
SHOWN  IN  THIS  MANUAL  OR  IN  SUPPLEMENTS  PUB-
LISHED  BY  SONY.
CAUTION:
The use of optical instrument with this product will increase eye
hazard.
Fig. A.
Using an AC voltmeter to check AC leakage.
1.5 k
0.15 µF
AC
voltmeter
(0.75 V)
To Exposed Metal
Parts on Set
Earth Ground
LEAKAGE TEST
The AC leakage from any exposed metal part to earth ground
and from all exposed metal parts to any exposed metal part having
a return to chassis, must not exceed 0.5 mA (500 microamperes).
Leakage current can be measured by any one of three methods.
1. A commercial leakage tester, such as the Simpson 229 or RCA
WT-540A.  Follow the manufacturers' instructions to use these
instruments.
2. A battery-operated AC milliammeter.  The Data Precision 245
digital multimeter is suitable for this job.
3. Measuring the voltage drop across a resistor by means of a
VOM or battery-operated AC voltmeter.  The “limit” indica-
tion is 0.75 V, so analog meters must have an accurate low-
voltage scale.  The Simpson 250 and Sanwa SH-63Trd are ex-
amples of a passive VOM that is suitable.  Nearly all battery
operated digital multimeters that have a 2 V AC range are suit-
able.  (See Fig. A)
1. Check the area of your repair for unsoldered or poorly-sol-
dered connections.  Check the entire board surface for solder
splashes and bridges.
2. Check the interboard wiring to ensure that no wires are
“pinched” or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly transis-
tors, that were installed during a previous repair.  Point them
out to the customer and recommend their replacement.
4. Look for parts which, though functioning, show obvious signs
of deterioration.  Point them out to the customer and recom-
mend their replacement.
5. Check the line cord for cracks and abrasion. Recommend the
replacement of any such line cord to the customer.
6. Check the B+ voltage to see it is at the values specified.
7. Check the antenna terminals, metal trim, “metallized” knobs,
screws, and all other exposed metal parts for AC leakage.
Check leakage as described below.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C .
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur
such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
– 3 –
TABLE  OF  CONTENTS
SERVICE NOTE
................................................................... 4
1.
GENERAL
................................................................... 1
2.
DISASSEMBLY
2-1.
LID Assembly Removal ................................................. 2-1
2-2.
Disk Base Assembly Removal ...................................... 2-1
2-3.
Base Unit Removal ........................................................ 2-1
2-4.
BU Holder Removal ....................................................... 2-1
2-5.
SW-406 Board Removal ................................................ 2-2
2-6.
HP-137 & Jack Plate Removal ...................................... 2-2
2-7.
Lower Case Removal .................................................... 2-2
2-8.
Power Switching Regulator Block Removal ................. 2-2
2-9.
Shield Plate Removal .................................................... 2-3
2-10. AV-77 Board Removal ................................................... 2-3
2-11. IF-106 Board Removal .................................................. 2-3
2-12. MB-108 & SW-407 Boards Removal ............................ 2-3
2-13. Circuit Boards Location ................................................. 2-4
3.
BLOCK DIAGRAMS
3-1.
Overall Block Diagram ................................................... 3-1
3-2.
System Control Block Diagram ..................................... 3-3
3-3.
RF/Servo Block Diagram ............................................... 3-5
3-4.
Signal Processor Block Diagram .................................. 3-7
3-5.
Video/Audio Block Diagram .......................................... 3-9
3-6.
Interface Control Block Diagram ................................... 3-11
3-7.
Power 1 Block Diagram ................................................. 3-13
3-8.
Power 2 Block Diagram ................................................. 3-15
4.
PRINTED WIRING BOARDS AND SCHEMATIC
DIAGRAMS
4-1.
Printed Wiring Boards and Schematic Diagrams ........ 4-1
4-2.
Frame Schematic Diagram ............................................ 4-3
Waveforms ..................................................................... 4-5
MB-108 Printed Wiring Board .................................. 4-7
MB-108 (System Control) Schematic Diagram ....... 4-9
MB-108 (Motor Drive) Schematic Diagram ............. 4-11
MB-108 (Servo) Schematic Diagram ....................... 4-13
MB-108 (AV Decoder) Schematic Diagram ............ 4-15
MB-108 (Audio DAC, PLL) Schematic Diagram ...... 4-17
MB-108 Board Differential Part List ......................... 4-17
AV-77 Printed Wiring Board ..................................... 4-19
AV-77 (Audio/Video Out) Schematic Diagram ........ 4-21
AV-77 Board Differential Part List ............................ 4-23
IF-106 Printed Wiring Board .................................... 4-25
IF-106 (Interface Control) Schematic Diagram ....... 4-27
SW-406, SW-407 Printed Wiring Boards ................ 4-29
SW-406 (Function Switch), SW-407 (Door Switch)
     Schematic Diagram ............................................. 4-31
HP-137 Printed Wiring Board .................................. 4-33
HP-137 (Headphone) Schematic Diagram ............. 4-35
DPSN-20CP Printed Wiring Board .......................... 4-37
DPSN-20CP (Switching Regulator)
     Schematic Diagram ............................................. 4-39
DPSN-20CP-2 Printed Wiring Board ....................... 4-41
DPSN-20CP-2 (Switching Regulator)
     Schematic Diagram ............................................. 4-43
5.
IC  PIN  FUNCTION  DESCRIPTION
5-1.
System Control Pin Function
(MB-108 BOARD IC104: MB9130RPFV-G-BND-E1) ... 5-1
6.
TEST MODE
6-1.
General Description ...................................................... 6-1
6-2.
Starting Test Mode ......................................................... 6-1
6-3.
Syscon Diagnosis .......................................................... 6-1
6-4.
Drive Auto Adjustment ................................................... 6-5
6-5.
Drive Manual Operation ................................................ 6-7
6-6.
Emergency History ........................................................ 6-10
6-7.
Version Information ....................................................... 6-11
6-8.
Video Level Adjustment ................................................ 6-11
6-9.
Troubleshooting ............................................................. 6-11
7.
ELECTRICAL ADJUSTMENT
7-1.
Power Supply Check ..................................................... 7-1
7-2.
Adjustment of Video System ......................................... 7-2
1.
Video Level Adjustment ................................................ 7-2
2.
Checking S Video Output S-Y ....................................... 7-2
3.
Checking S Video Output S-C ...................................... 7-2
7-3.
Adjustment Related Parts Arrangement ....................... 7-3
8.
REPAIR PARTS LIST
8-1.
Exploded Views ............................................................. 8-1
8-1-1. Disk Base Section .................................................... 8-1
8-1-2. Lower Case Section ................................................. 8-2
8-2.
Electrical Parts List ........................................................ 8-3
– 4 –
SERVICE NOTE
1.
DISASSEMBLY
• This set can be disassembled in the order shown below.
Set
Lid Assembly
(Page 2-1)
BU Holder
(Page 2-1)
SW-406 Board
(Page 2-2)
Disk Base Assembly
(Page 2-1)
Base Unit
(Page 2-1)
HP-137 Board &
Jack Plate
(Page 2-2)
Lower Case
(Page 2-2)
AV-77 Board
(Page 2-3)
IF-106 Board
(Page 2-3)
MB-108 & 
SW-407 Boards
(Page 2-3)
Shield Plate
(Page 2-3)
Power Switching
Regulator Block
(Page 2-2)
2.
PRECAUTIONS FOR USE OF BASE UNIT
As the laser diode in the base unit is easily damaged by static
electricity, desolder the laser tap of the flexible board of the base
unit when using it.
Before disconnecting the connector, solder first. Before connect-
ing the connector, be careful not to remove the solder. Also take
adequate measures to prevent damage by static electricity. Handle
the flexible board with care as it breaks easily.
Base unit
Laser tap
Page of 79

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