XR-CA670X - Sony Car Audio Service Manual (repair manual). Page 2

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2
XR-CA670X
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C dur-
ing repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
TABLE  OF  CONTENTS
SERVICING  NOTES
...............................................
2
1.
GENERAL
Location of Controls .......................................................
3
Setting the Clock .............................................................
3
2.
DISASSEMBLY
2-1. Disassembly Flow ...........................................................
7
2-2. Sub Panel Section ............................................................
7
2-3. Mechanism Deck (MG-25M-136) ..................................
8
2-4. MAIN Board ...................................................................
8
3.
ASSEMBLY
3-1. Assembly Flow ................................................................
9
3-2. Housing ........................................................................... 10
3-3. Arm (Suction) ................................................................. 10
3-4. Lever (LDG-A)/(LDG-B) ............................................... 11
3-5. Gear (LDG-FT) ............................................................... 11
3-6. Guide (C) ......................................................................... 12
3-7. Mounting Position of Capstan/Reel Motor (M901) ....... 12
4.
MECHANICAL  ADJUSTMENTS
....................... 13
5.
ELECTRICAL  ADJUSTMENTS
Tape Deck Section .......................................................... 13
Tuner Section .................................................................. 13
6.
DIAGRAMS
6-1. Note for Printed Wiring Boards and
Schematic Diagrams ....................................................... 14
6-2. Printed Wiring Board – MAIN Board – ......................... 15
6-3. Schematic Diagram – MAIN Board (1/3) – ................... 16
6-4. Schematic Diagram – MAIN Board (2/3) – ................... 17
6-5. Schematic Diagram – MAIN Board (3/3) – ................... 18
6-6. Printed Wiring Board – SUB Board – ............................ 19
6-7. Schematic Diagram – SUB Board – ............................... 19
6-8. Printed Wiring Board – KEY Board – ............................ 20
6-9. Schematic Diagram – KEY Board – .............................. 21
6-10. IC Pin Function Description ........................................... 23
7.
EXPLODED  VIEWS
7-1. Chassis Section ............................................................... 26
7-2. Front Panel Section ......................................................... 27
7-3. Mechanism Deck Section (MG-25M-136) ..................... 28
8.
ELECTRICAL  PARTS  LIST
............................... 29
SERVICING  NOTES
SERVICE  POSITION
In checking the key board and main board, prepare two jigs
(connection cable J-2502-066-2 and
connection cable for F/P to main J-2502-071-1).
main board
sub board
(CN801)
mechanism deck
main board (CN351)
key board
(CN901)
connect jig
(connection cable 
for F/P to main J-2502-071-1)
to the key board (CN901) and
sub board (CN801).
connect jig
(connection cable J-2502-066-2)
to the main board (CN351) and 
mechanism deck.
sub panel
assy
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