XAV-601BT - Sony Car Audio Service Manual (repair manual). Page 4

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XAV-601BT
4
SECTION  1
SERVICING  NOTES
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
IMPORTANT  NOTE  FOR  REPAIRING
XAV-601BT contain individual information that the customer reg-
istered because it installs the Bluetooth function.
When repairing, the data that the customer registered might disap-
pear. Have the approval of the customer beforehand.
If any of the following repair is performed, that data disappears.
• 
Complete DISP board exchange
• Initialize
Note: Exchanged old complete DISP board is destroyed with the ham-
mer, and throw out it.
NOTE  THE  IC4  AND  IC11  ON  THE  SERVO  BOARD  
REPLACING
IC4 and IC11 on the SERVO board cannot exchange with single. 
When these parts are damaged, exchange the complete mounted 
board.
NOTE  THE  CN101  AND  CN901  ON  THE  MAIN  BOARD  
REPLACING
CN101 and CN901 on the MAIN board cannot exchange with 
single. When these parts are damaged, exchange the complete 
mounted board.
NOTE  FOR  REPLACEMENT  OF  THE  DISP  BOARD
When repairing, the complete DISP board and should be replaced 
since any parts in the DISP board cannot be repaired.
NOTE  THE  CN2300  ON  THE  M-SUB6  BOARD  RE-
PLACING
CN2300 on the M-SUB6 board cannot exchange with single. 
When this part is damaged, exchange the complete mounted board.
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
• 
Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
Label indication
Destination
Signal format 
system
Region 
code
Part No.
NTSC
1
4-422-571-0[]
US and Canadian 
models
PAL
2
4-422-572-0[]
AEP and UK models
PAL
3
4-422-573-0[]
E (PAL) model
PAL
2
4-422-574-0[]
Saudi Arabia model
PAL
5
4-422-575-0[]
Russian model
NTSC
4
4-422-576-0[]
E (NTSC) model
MODEL  IDENTIFICATION
Part No.
Region Code
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