TCM-900DV - Sony Audio Service Manual (repair manual). Page 2

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2
TCM-900DV
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270
°C during
repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
TABLE OF CONTENTS
SECTION 1
GENERAL
This section is extracted from
instruction manual.
Specifications ...........................................................................  1
1. GENERAL
Location of Parts and Controls .......................................... 2
2. DISASSEMBLY
2-1. Cabinet (Rear), Cassette Lid ASSY ............................ 3
2-2. Main Board ................................................................. 4
2-3. Mechanism Deck ........................................................ 4
2-4. Belt (AR), M601 (Capstan/reel motor),
        HRPE901 (REC/PB/ERASE head) ........................... 5
2-5. SW Board ................................................................... 5
3. ADJUSTMENTS
3-1. Mechanical Adjustments ............................................. 6
3-2. Electrical Adjustments ................................................ 6
4. DIAGRAMS
4-1. Block Diagrams -Main Section (1/2) - ....................... 9
4-2. Block Diagrams -Main Section (2/2) - ..................... 10
4-3. Schematic Diagram - Main Section (1/3) - ................ 11
4-4. Schematic Diagram - Main Section (2/3) - ............... 12
4-5. Schematic Diagram - Main Section (3/3) - ............... 13
4-6.Printed Wiring Boards -Main Section (side A)- ........ 14
4-7.Printed Wiring Boards -Main Section (side B)- ........ 15
4-8.Printed Wiring Boards -SW Section (side A)- ........... 16
4-9.Printed Wiring Boards -SW Section  (side B)- .......... 17
4-10.Schematic Diagram - SW Section - ......................... 18
4-11.Explanation of IC Terminals .................................... 19
5. EXPLODED VIEWS
5-1. Main Board, Cabinet (Rear) section ......................... 22
5-2. Cassette Lid Section ................................................. 23
5-3. Mechanism deck Section -1(MT-900-175) ............... 24
5-4. Mechanism deck Section -2 (MT-900-175) .............. 25
6. ELECTRICAL PARTS LIST ................................ 26
Location of parts and controls
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