Read Sony HBD-TZ145 Service Manual online
HBD-TZ145
2
1.
SERVICING NOTES
.............................................
3
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 7
2-2. SS
Top
Cover
.................................................................. 7
2-3. Door
................................................................................ 8
2-4. POWER
Board
................................................................ 8
2-5. Front Cabinet Block ........................................................ 9
2-6. STANDBY Board, CONTROL Board ............................ 10
2-7. DVD Mechanism Deck Block ........................................ 11
2-8. FFC Holder (Former type (for F-8829F1)) ..................... 12
2-9. Optical Pick-up Block (CMS-S76RFS3G)
2-6. STANDBY Board, CONTROL Board ............................ 10
2-7. DVD Mechanism Deck Block ........................................ 11
2-8. FFC Holder (Former type (for F-8829F1)) ..................... 12
2-9. Optical Pick-up Block (CMS-S76RFS3G)
(Former type (for F-8829F1)) ......................................... 13
2-10. DVD Mechanism Deck (New type (CMS-LS5FP)) ....... 14
2-11. Holder Chuck (New type (CMS-LS5FP)) ...................... 15
2-12. Tray Disc-1 (New type (CMS-LS5FP)) .......................... 15
2-13. Tray Disc-2 (New type (CMS-LS5FP)) .......................... 16
2-14. Optical Pick-up Block-1 (CMS-S79RFVP)
2-11. Holder Chuck (New type (CMS-LS5FP)) ...................... 15
2-12. Tray Disc-1 (New type (CMS-LS5FP)) .......................... 15
2-13. Tray Disc-2 (New type (CMS-LS5FP)) .......................... 16
2-14. Optical Pick-up Block-1 (CMS-S79RFVP)
(New type (CMS-LS5FP)) .............................................. 17
2-15. Optical Pick-up Block-2 (CMS-S79RFVP)
(New type (CMS-LS5FP)) .............................................. 18
2-16. MAIN Board ................................................................... 19
3. DIAGRAMS
3-1. Block
Diagram
................................................................ 21
3-2. Printed Wiring Boards - PANEL Section - ..................... 24
3-3. Schematic Diagram - PANEL Section - .......................... 25
3-4. Printed Wiring Board - POWER Board - ........................ 26
3-5. Schematic Diagram - POWER Board - .......................... 27
3-6. Printed
3-3. Schematic Diagram - PANEL Section - .......................... 25
3-4. Printed Wiring Board - POWER Board - ........................ 26
3-5. Schematic Diagram - POWER Board - .......................... 27
3-6. Printed
Wiring
Board
- MAIN Board (Component Side) - ................................ 28
3-7. Printed
Wiring
Board
- MAIN Board (Conductor Side) - .................................. 29
3-8. Schematic Diagram - MAIN Board (1/5) - ..................... 30
3-9. Schematic Diagram - MAIN Board (2/5) - ..................... 31
3-10. Schematic Diagram - MAIN Board (3/5) - ..................... 32
3-11. Schematic Diagram - MAIN Board (4/5) - ..................... 33
3-12. Schematic Diagram - MAIN Board (5/5) - ..................... 34
3-9. Schematic Diagram - MAIN Board (2/5) - ..................... 31
3-10. Schematic Diagram - MAIN Board (3/5) - ..................... 32
3-11. Schematic Diagram - MAIN Board (4/5) - ..................... 33
3-12. Schematic Diagram - MAIN Board (5/5) - ..................... 34
4.
EXPLODED VIEWS
4-1. Top Cover Section (Former type (F-8829F1)) ................ 35
4-2. Top Cover Section (New type (CMS-LS5FP)) ............... 36
4-3. Chassis
4-2. Top Cover Section (New type (CMS-LS5FP)) ............... 36
4-3. Chassis
Section
............................................................... 37
4-4. DVD Mechanism Deck Section
(Former type (F-8829F1)) ............................................... 38
4-5. DVD Mechanism Deck Section
(New type (CMS-LS5FP)) .............................................. 39
5.
ELECTRICAL PARTS LIST
.............................. 40
TABLE OF CONTENTS
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Trademarks
This system incorporates with Dolby* Digital
and Dolby Pro Logic adaptive matrix
surround decoders.
and Dolby Pro Logic adaptive matrix
surround decoders.
* Manufactured under license from Dolby
Laboratories.
Dolby, Pro Logic, and the double-D
symbol are trademarks of Dolby
Laboratories.
Dolby, Pro Logic, and the double-D
symbol are trademarks of Dolby
Laboratories.
This system incorporates High-Definition
Multimedia Interface (HDMI™) technology.
The terms HDMI and HDMI High-
Definition Multimedia Interface, and the
HDMI Logo are trademarks or registered
trademarks of HDMI Licensing LLC in the
United States and other countries.
Multimedia Interface (HDMI™) technology.
The terms HDMI and HDMI High-
Definition Multimedia Interface, and the
HDMI Logo are trademarks or registered
trademarks of HDMI Licensing LLC in the
United States and other countries.
“PlayStation” and “PS3” are registered
trademarks of Sony Computer Entertainment
Inc.
trademarks of Sony Computer Entertainment
Inc.
“BRAVIA” is a trademark of Sony
Corporation.
Corporation.
MPEG Layer-3 audio coding technology and
patents licensed from Fraunhofer IIS and
Thomson.
patents licensed from Fraunhofer IIS and
Thomson.
Windows Media is either a registered
trademark or trademark of Microsoft
Corporation in the United States and/or other
countries. This product contains technology
subject to certain intellectual property rights
of Microsoft. Use or distribution of this
technology outside of this product is
prohibited without the appropriate license(s)
from Microsoft.
trademark or trademark of Microsoft
Corporation in the United States and/or other
countries. This product contains technology
subject to certain intellectual property rights
of Microsoft. Use or distribution of this
technology outside of this product is
prohibited without the appropriate license(s)
from Microsoft.
THIS PRODUCT IS LICENSED UNDER
THE MPEG-4 VISUAL PATENT
PORTFOLIO LICENSE FOR THE
PERSONAL AND NON-COMMERCIAL
USE OF A CONSUMER FOR
THE MPEG-4 VISUAL PATENT
PORTFOLIO LICENSE FOR THE
PERSONAL AND NON-COMMERCIAL
USE OF A CONSUMER FOR
(i) ENCODING VIDEO IN COMPLIANCE
WITH THE MPEG-4 VISUAL STANDARD
(“MPEG-4 VIDEO”)
AND/OR
(ii) DECODING MPEG-4 VIDEO THAT
WAS ENCODED BY A CONSUMER
ENGAGED IN A PERSONAL AND NON-
COMMERCIAL ACTIVITY AND/OR WAS
OBTAINED FROM A VIDEO PROVIDER
LICENSED BY MPEG LA TO PROVIDE
MPEG-4 VIDEO.
NO LICENSE IS GRANTED OR SHALL BE
IMPLIED FOR ANY OTHER USE.
ADDITIONAL INFORMATION
INCLUDING THAT RELATING TO
PROMOTIONAL, INTERNAL AND
COMMERCIAL USES AND LICENSING
MAY BE OBTAINED FROM MPEG LA,
LLC. SEE HTTP://WWW.MPEGLA.COM
WITH THE MPEG-4 VISUAL STANDARD
(“MPEG-4 VIDEO”)
AND/OR
(ii) DECODING MPEG-4 VIDEO THAT
WAS ENCODED BY A CONSUMER
ENGAGED IN A PERSONAL AND NON-
COMMERCIAL ACTIVITY AND/OR WAS
OBTAINED FROM A VIDEO PROVIDER
LICENSED BY MPEG LA TO PROVIDE
MPEG-4 VIDEO.
NO LICENSE IS GRANTED OR SHALL BE
IMPLIED FOR ANY OTHER USE.
ADDITIONAL INFORMATION
INCLUDING THAT RELATING TO
PROMOTIONAL, INTERNAL AND
COMMERCIAL USES AND LICENSING
MAY BE OBTAINED FROM MPEG LA,
LLC. SEE HTTP://WWW.MPEGLA.COM
All other trademarks are trademarks of their
respective owners.
respective owners.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
Ver. 1.5
Note: The DVD mechanism deck for this unit has been changed in the
midway of production. About the New/Former discrimination,
refer to “ABOUT THE DVD MECHANISM DECK” on page 4.
refer to “ABOUT THE DVD MECHANISM DECK” on page 4.
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