Read Sony HBD-TZ145 Service Manual online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HBD-TZ145
SPECIFICATIONS
DVD RECEIVER
9-893-483-07
2014F33-1
©
2014.06
Indian Model
Ver. 1.6 2014.06
• HBD-TZ145 is DVD receiver in DAV-TZ145.
Model Name Using Similar Mechanism
NEW
Mechanism Type
F-8829F1 or CMS-LS5FP
Optical Pick-up Block Name
CMS-S76RFS3G for F-8829F1
CMS-S79RFVP for CMS-LS5FP
CMS-S79RFVP for CMS-LS5FP
Amplifier Section
POWER OUTPUT (rated):
Front L + Front R
POWER OUTPUT (rated):
Front L + Front R
36 W + 36 W (at
8 ohms, 1 kHz, 1%
THD)
8 ohms, 1 kHz, 1%
THD)
POWER OUTPUT (reference):
Front L/Front R/
Center/Surround L/
Surround R: 60 W
(per channel at
8 ohms, 1 kHz)
Subwoofer: 60 W (at
8 ohms, 100 Hz)
Center/Surround L/
Surround R: 60 W
(per channel at
8 ohms, 1 kHz)
Subwoofer: 60 W (at
8 ohms, 100 Hz)
Inputs
TV/CABLE :
TV/CABLE :
Pin jack
CD/DVD System
Laser Diode Properties
Laser Diode Properties
Emission Duration:
Continuous
Laser Output*: Less
than 44.6 μW
Continuous
Laser Output*: Less
than 44.6 μW
* This output is the value measurement at a
distance of 200 mm from the objective lens
surface on the Optical Pick-up Block with
7 mm aperture.
surface on the Optical Pick-up Block with
7 mm aperture.
USB Section
(USB) port:
Maximum current:
500 mA
Tuner Section
System PLL
System PLL
quartz-locked
digital synthesizer
Tuning range
87.5 MHz - 108.0 MHz
(50 kHz step)
(50 kHz step)
Antenna
FM lead antenna
Video Section
Outputs
Outputs
VIDEO: Pin jack
HDMI OUT: HDMI
19-pin
HDMI OUT: HDMI
19-pin
General
Power requirements 220 V - 240 V AC,
Power requirements 220 V - 240 V AC,
50/60 Hz
Power consumption On: 38 W
Standby: 0.8 W*
* Valid when the system is in the following
status:
[Control for HDMI] is set to [Off ].
Dimensions (approx.) 340 mm × 56 mm ×
325 mm (w/h/d) incl.
projecting parts
projecting parts
Mass (approx.) 2.2
kg
Design and specifications are subject to
change without notice.
change without notice.
HBD-TZ145
2
1.
SERVICING NOTES
.............................................
3
2. DISASSEMBLY
2-1. Disassembly
Flow
........................................................... 7
2-2. SS
Top
Cover
.................................................................. 7
2-3. Door
................................................................................ 8
2-4. POWER
Board
................................................................ 8
2-5. Front Cabinet Block ........................................................ 9
2-6. STANDBY Board, CONTROL Board ............................ 10
2-7. DVD Mechanism Deck Block ........................................ 11
2-8. FFC Holder (Former type (for F-8829F1)) ..................... 12
2-9. Optical Pick-up Block (CMS-S76RFS3G)
2-6. STANDBY Board, CONTROL Board ............................ 10
2-7. DVD Mechanism Deck Block ........................................ 11
2-8. FFC Holder (Former type (for F-8829F1)) ..................... 12
2-9. Optical Pick-up Block (CMS-S76RFS3G)
(Former type (for F-8829F1)) ......................................... 13
2-10. DVD Mechanism Deck (New type (CMS-LS5FP)) ....... 14
2-11. Holder Chuck (New type (CMS-LS5FP)) ...................... 15
2-12. Tray Disc-1 (New type (CMS-LS5FP)) .......................... 15
2-13. Tray Disc-2 (New type (CMS-LS5FP)) .......................... 16
2-14. Optical Pick-up Block-1 (CMS-S79RFVP)
2-11. Holder Chuck (New type (CMS-LS5FP)) ...................... 15
2-12. Tray Disc-1 (New type (CMS-LS5FP)) .......................... 15
2-13. Tray Disc-2 (New type (CMS-LS5FP)) .......................... 16
2-14. Optical Pick-up Block-1 (CMS-S79RFVP)
(New type (CMS-LS5FP)) .............................................. 17
2-15. Optical Pick-up Block-2 (CMS-S79RFVP)
(New type (CMS-LS5FP)) .............................................. 18
2-16. MAIN Board ................................................................... 19
3. DIAGRAMS
3-1. Block
Diagram
................................................................ 21
3-2. Printed Wiring Boards - PANEL Section - ..................... 24
3-3. Schematic Diagram - PANEL Section - .......................... 25
3-4. Printed Wiring Board - POWER Board - ........................ 26
3-5. Schematic Diagram - POWER Board - .......................... 27
3-6. Printed
3-3. Schematic Diagram - PANEL Section - .......................... 25
3-4. Printed Wiring Board - POWER Board - ........................ 26
3-5. Schematic Diagram - POWER Board - .......................... 27
3-6. Printed
Wiring
Board
- MAIN Board (Component Side) - ................................ 28
3-7. Printed
Wiring
Board
- MAIN Board (Conductor Side) - .................................. 29
3-8. Schematic Diagram - MAIN Board (1/5) - ..................... 30
3-9. Schematic Diagram - MAIN Board (2/5) - ..................... 31
3-10. Schematic Diagram - MAIN Board (3/5) - ..................... 32
3-11. Schematic Diagram - MAIN Board (4/5) - ..................... 33
3-12. Schematic Diagram - MAIN Board (5/5) - ..................... 34
3-9. Schematic Diagram - MAIN Board (2/5) - ..................... 31
3-10. Schematic Diagram - MAIN Board (3/5) - ..................... 32
3-11. Schematic Diagram - MAIN Board (4/5) - ..................... 33
3-12. Schematic Diagram - MAIN Board (5/5) - ..................... 34
4.
EXPLODED VIEWS
4-1. Top Cover Section (Former type (F-8829F1)) ................ 35
4-2. Top Cover Section (New type (CMS-LS5FP)) ............... 36
4-3. Chassis
4-2. Top Cover Section (New type (CMS-LS5FP)) ............... 36
4-3. Chassis
Section
............................................................... 37
4-4. DVD Mechanism Deck Section
(Former type (F-8829F1)) ............................................... 38
4-5. DVD Mechanism Deck Section
(New type (CMS-LS5FP)) .............................................. 39
5.
ELECTRICAL PARTS LIST
.............................. 40
TABLE OF CONTENTS
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Trademarks
This system incorporates with Dolby* Digital
and Dolby Pro Logic adaptive matrix
surround decoders.
and Dolby Pro Logic adaptive matrix
surround decoders.
* Manufactured under license from Dolby
Laboratories.
Dolby, Pro Logic, and the double-D
symbol are trademarks of Dolby
Laboratories.
Dolby, Pro Logic, and the double-D
symbol are trademarks of Dolby
Laboratories.
This system incorporates High-Definition
Multimedia Interface (HDMI™) technology.
The terms HDMI and HDMI High-
Definition Multimedia Interface, and the
HDMI Logo are trademarks or registered
trademarks of HDMI Licensing LLC in the
United States and other countries.
Multimedia Interface (HDMI™) technology.
The terms HDMI and HDMI High-
Definition Multimedia Interface, and the
HDMI Logo are trademarks or registered
trademarks of HDMI Licensing LLC in the
United States and other countries.
“PlayStation” and “PS3” are registered
trademarks of Sony Computer Entertainment
Inc.
trademarks of Sony Computer Entertainment
Inc.
“BRAVIA” is a trademark of Sony
Corporation.
Corporation.
MPEG Layer-3 audio coding technology and
patents licensed from Fraunhofer IIS and
Thomson.
patents licensed from Fraunhofer IIS and
Thomson.
Windows Media is either a registered
trademark or trademark of Microsoft
Corporation in the United States and/or other
countries. This product contains technology
subject to certain intellectual property rights
of Microsoft. Use or distribution of this
technology outside of this product is
prohibited without the appropriate license(s)
from Microsoft.
trademark or trademark of Microsoft
Corporation in the United States and/or other
countries. This product contains technology
subject to certain intellectual property rights
of Microsoft. Use or distribution of this
technology outside of this product is
prohibited without the appropriate license(s)
from Microsoft.
THIS PRODUCT IS LICENSED UNDER
THE MPEG-4 VISUAL PATENT
PORTFOLIO LICENSE FOR THE
PERSONAL AND NON-COMMERCIAL
USE OF A CONSUMER FOR
THE MPEG-4 VISUAL PATENT
PORTFOLIO LICENSE FOR THE
PERSONAL AND NON-COMMERCIAL
USE OF A CONSUMER FOR
(i) ENCODING VIDEO IN COMPLIANCE
WITH THE MPEG-4 VISUAL STANDARD
(“MPEG-4 VIDEO”)
AND/OR
(ii) DECODING MPEG-4 VIDEO THAT
WAS ENCODED BY A CONSUMER
ENGAGED IN A PERSONAL AND NON-
COMMERCIAL ACTIVITY AND/OR WAS
OBTAINED FROM A VIDEO PROVIDER
LICENSED BY MPEG LA TO PROVIDE
MPEG-4 VIDEO.
NO LICENSE IS GRANTED OR SHALL BE
IMPLIED FOR ANY OTHER USE.
ADDITIONAL INFORMATION
INCLUDING THAT RELATING TO
PROMOTIONAL, INTERNAL AND
COMMERCIAL USES AND LICENSING
MAY BE OBTAINED FROM MPEG LA,
LLC. SEE HTTP://WWW.MPEGLA.COM
WITH THE MPEG-4 VISUAL STANDARD
(“MPEG-4 VIDEO”)
AND/OR
(ii) DECODING MPEG-4 VIDEO THAT
WAS ENCODED BY A CONSUMER
ENGAGED IN A PERSONAL AND NON-
COMMERCIAL ACTIVITY AND/OR WAS
OBTAINED FROM A VIDEO PROVIDER
LICENSED BY MPEG LA TO PROVIDE
MPEG-4 VIDEO.
NO LICENSE IS GRANTED OR SHALL BE
IMPLIED FOR ANY OTHER USE.
ADDITIONAL INFORMATION
INCLUDING THAT RELATING TO
PROMOTIONAL, INTERNAL AND
COMMERCIAL USES AND LICENSING
MAY BE OBTAINED FROM MPEG LA,
LLC. SEE HTTP://WWW.MPEGLA.COM
All other trademarks are trademarks of their
respective owners.
respective owners.
Laser component in this product is capable of emitting radiation
exceeding the limit for Class 1.
exceeding the limit for Class 1.
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
Ver. 1.5
Note: The DVD mechanism deck for this unit has been changed in the
midway of production. About the New/Former discrimination,
refer to “ABOUT THE DVD MECHANISM DECK” on page 4.
refer to “ABOUT THE DVD MECHANISM DECK” on page 4.
HBD-TZ145
3
SECTION 1
SERVICING NOTES
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
The laser beam on this model is concentrated so as to be focused
on the disc refl ective surface by the objective lens in the optical
pickup block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution:
about 350 °C.
Caution:
The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
ABOUT PART REPAIR OF EACH BOARD
When boards installed by this unit are defective, replace the com-
plete board. However, some of mounted parts are replaceable. Re-
fer to “5. ELECTRICAL PARTS LIST” (page 40) for parts that
can be replaceable.
When boards installed by this unit are defective, replace the com-
plete board. However, some of mounted parts are replaceable. Re-
fer to “5. ELECTRICAL PARTS LIST” (page 40) for parts that
can be replaceable.
RELEASING THE DISC TRAY LOCK
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Setting Procedure:
1. Press the [
The disc tray lock function for the antitheft of an demonstration
disc in the store is equipped.
Setting Procedure:
1. Press the [
?/1
] button to turn on the system.
2. Press the [FUNCTION] button to select “DVD/CD”.
3. Insert
3. Insert
disc.
4. Press the [
x
] and [
Z
] buttons simultaneously and hold down
unit “LOCKED” displayed on the fluorescent indicator tube
(around 5 seconds).
(around 5 seconds).
Releasing Procedure:
1. Press the [
1. Press the [
?/1
] button to turn on the system.
2. Press the [FUNCTION] button to select “DVD/CD”.
3. Press the [
3. Press the [
x
] and [
Z
] buttons simultaneously and hold down
unit “UNLOCKED” displayed on the fluorescent indicator
tube (around 5 seconds).
tube (around 5 seconds).
Note:
When “LOCKED” is displayed, the disc tray lock is not released by
turning power on/off with the [?/1] button.
VERSION DISPLAY
Confi rmation procedure of version only:
1. Connect this unit with TV monitor.
2. Press the [
Confi rmation procedure of version only:
1. Connect this unit with TV monitor.
2. Press the [
?/1
] button to turn on the system.
3. Press the [
Z
] button.
(State of “Tray open”)
3. After press the [
x
] button, press the [ DISPLAY] button on
the remote commander.
4. The version information appears to the TV monitor.
(Displayed character/values are example)
Model NO.
Release: 2012.03.29A
MPEG: 3.22.24
MPEG: 3.22.24
Region: 0
MCU: 3.25.26
HdcpKey: Yes
DAV-TZ145 E12
OK
Releasing Procedure:
1. Press the [ ] button on the remote commander.
2. The system will return to normal mode.
1. Press the [ ] button on the remote commander.
2. The system will return to normal mode.
LASER DIODE AND FOCUS SEARCH
Procedure:
1. Open the case and turn POWER on with no disc inserted.
2. Confi rm that the following operation is performed while ob-
Procedure:
1. Open the case and turn POWER on with no disc inserted.
2. Confi rm that the following operation is performed while ob-
serving the objecting lens from the clearance of DVD mecha-
nism deck.
nism deck.
Confi rm that laser beam is spread.
Up and down motion of the objective lens. (2 times)
ON CLEANING DISCS, DISC/LENS CLEANERS
Do not use cleaning discs or disc/lens cleaners (including wet or
spray types). These may cause the apparatus to malfunction.
Do not use cleaning discs or disc/lens cleaners (including wet or
spray types). These may cause the apparatus to malfunction.
IMPORTANT NOTICE
Caution: This system is capable of holding a still video image or on-
screen display image on your television screen indefi nitely. If you leave
the still video image or on-screen display image displayed on your TV
for an extended period of time you risk permanent damage to your tele-
vision screen.
Projection televisions are especially susceptible to this.
Caution: This system is capable of holding a still video image or on-
screen display image on your television screen indefi nitely. If you leave
the still video image or on-screen display image displayed on your TV
for an extended period of time you risk permanent damage to your tele-
vision screen.
Projection televisions are especially susceptible to this.
ABOUT “PROTECT” DISPLAY
If any one of the speakers is not connected, “PROTECT” may be
displayed. This is a specifi cation of this unit. When performing an
inspection for which disc playback is necessary, connect all of the
speakers.
If any one of the speakers is not connected, “PROTECT” may be
displayed. This is a specifi cation of this unit. When performing an
inspection for which disc playback is necessary, connect all of the
speakers.
HBD-TZ145
4
ABOUT THE DVD MECHANISM DECK
The DVD mechanism deck for this unit has been changed in the
midway of production.
And with the DVD mechanism deck change, the MAIN board also
has been changed.
Please check a serial number before repairing.
The DVD mechanism deck for this unit has been changed in the
midway of production.
And with the DVD mechanism deck change, the MAIN board also
has been changed.
Please check a serial number before repairing.
– Back cabinet –
Serial label
Serial number
Serial Number
Former type
New type
6142196 or smaller
6142197 or larger
It can also distinguish with the wire on the right side of the DVD
mechanism deck.
mechanism deck.
Former type (F-8829F1)
New type (CMS-LS5FP)
Connection of a wire
is two places.
is two places.
Connection of a wire
is one place.
is one place.
NOTE OF REPLACING THE IC101, IC102 AND IC103 ON
THE MAIN BOARD AND THE COMPLETE MAIN BOARD
When IC101, IC102 and IC103 on the MAIN board and the com-
plete MAIN board are replaced, it is necessary to spread the com-
pound between parts and heat sink.
THE MAIN BOARD AND THE COMPLETE MAIN BOARD
When IC101, IC102 and IC103 on the MAIN board and the com-
plete MAIN board are replaced, it is necessary to spread the com-
pound between parts and heat sink.
Part No.
Description
J-2501-221-A
THERMAL COMPOUND (G747)
Spread the compound referring to the fi gure below.
– MAIN Board (Component Side) –
IC103
IC102
IC101
CAPACITOR ELECTRICAL DISCHARGE PROCESSING
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
When checking the board, the electrical discharge is necessary for
the electric shock prevention.
Connect the resistor to both ends of respective capacitors.
• POWER
board
C905
– POWER Board (Conductor Side) –
C905
800
:
2 W
Ver. 1.4