CPF-IX001, NAS-IX001P - Sony Audio Service Manual (repair manual). Page 2

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Never reuse a disconnected chip component.

•

Notice that the minus side of a tantalum capacitor may be

damaged by heat.

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3

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4

3-1.

Disassembly Flow ........................................................... 11

3-2.

Rear Cover Block ............................................................ 11

3-3.

PANEL Board Block ....................................................... 12

3-4.

ETHER Board/Wireless LAN Module (WLAN1) .......... 12

.............................................................. 13

5-1.

Block Diagram ................................................................ 15

5-2.

Printed Wiring Board – ETHER Board – ........................ 17

5-3.

Schematic Diagram – ETHER Board (1/2) – .................. 18

5-4.

Schematic Diagram – ETHER Board (2/2) – .................. 19

5-5.

Printed Wiring Board – PANEL Board – ........................ 20

5-6.

Schematic Diagram – PANEL Board – ........................... 21

5-7.

Printed Wiring Board – LED Board – ............................. 22

5-8.

Schematic Diagram – LED Board – ................................ 22

5-9.

Printed Wiring Board – CONNECTOR Board – ............ 23

5-10. Schematic Diagram – CONNECTOR Board – ............... 23

6-1.

Cover Section .................................................................. 32

6-2.

PANEL Board Block ....................................................... 33

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Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.

•

Unleaded solder melts at a temperature about 40 ˚C higher

than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

•

Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)

than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

•

Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.