BDV-E670W, BDV-E970W, HBD-E970W - Sony Audio Service Manual (repair manual). Page 2

Read Sony BDV-E670W / BDV-E970W / HBD-E970W Service Manual online

HBD-E670W/E970W
2
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
This appliance is classified as a 
CLASS 3R LASER product. 
Visible and invisible laser radiation 
is emitted when the laser protective 
housing is opened, so be sure to 
avoid direct eye exposure.
This marking is located on the laser 
protective housing inside the 
enclosure.
This appliance is classified as a 
CLASS 1 LASER product. This 
marking is located on the rear 
exterior.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Ver. 1.1
㚐嬢⡫⫾下ᶞ DMBTT!4S!
MBTFS ḋ␥Ɂ㼤₭ὁ㈈仍ㆷ
⹤㕚Ṿ⌵⅞⍓夥⏰ᵱ⍓夥
㼤₭廴⭨濇♄㫈Ⅻ≣䙘㌉䃋
⭨䚠䚿Ɂ
㫈㝫⼻ằᷲ㚞⡗⃩䗨㼤₭
ὁ㈈仍ᵮɁ
㚐嬢⡫⫾下ᶞ DMBTT!2!
MBTFS ḋ␥Ɂ㫈㝫⼻ằᷲ倰
恌⡺埌曆Ɂ
Page of 115
Display

Click on the first or last page to see other BDV-E670W / BDV-E970W / HBD-E970W service manuals if exist.