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HBD-E670W/E970W
9
NOTE OF REPLACING THE D913, D931, IC901 AND IC921 ON THE POWER BOARD AND THE COMPLETE
POWER BOARD
When D913, D931, IC901 and IC921 on the POWER board and the complete POWER board are replaced, it is necessary to spread the
compound (THERMAL COMPOUND (G747)) (Part No. J-2501-221-A) between parts and heat sink.
Spread the compound referring to the fi gure below.
POWER BOARD
When D913, D931, IC901 and IC921 on the POWER board and the complete POWER board are replaced, it is necessary to spread the
compound (THERMAL COMPOUND (G747)) (Part No. J-2501-221-A) between parts and heat sink.
Spread the compound referring to the fi gure below.
– POWER Board
(Component Side) –
(Component Side) –
IC901
HS901
HS931
HS921
IC921
D913
D931
IC901
D913
IC921
D931
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