BDV-E670W, BDV-E970W, HBD-E970W - Sony Audio Service Manual (repair manual)

2011A05-1

© 

2011.01

•  HBD-E670W is the amplifi er, video, BD/DVD/Super Audio 

CD/CD system, USB, LAN and tuner section in BDV-E670W.

•  HBD-E970W is the amplifi er, video, BD/DVD/Super Audio 

CD/CD system, USB, LAN and tuner section in BDV-E970W.

Photo: HBD-E970W

Model Name Using Similar Mechanism

BDP-S370

Mechanism Type

BPX-5

Optical Pick-up Block Name

KEM-460AAA

•  This product incorporates copyright protection technology 

that is protected by U.S. patents and other intellectual property 
rights.

 

Use of this copyright protection technology must be authorized 
by Macrovision, and is intended for home and other limited 
viewing uses only unless otherwise authorized by Macrovi-
sion.

 

Reverse engineering or disassembly is prohibited.

•  This system incorporates with Dolby* Digital and Dolby Pro 

Logic (II) adaptive matrix surround decoder and the DTS** 
Digital Surround System.
  *  Manufactured under license from Dolby Laboratories. 

Dolby, Pro Logic, and the double-D symbol are trade-
marks of Dolby Laboratories.

  ** Manufactured under license under U.S. Patent #’s: 

5,451,942; 5,956,674; 5,974,380; 5,978,762; 6,226,616; 
6,487,535; 7,212,872; 7,333,929; 7,392,195; 7,272,567 & 
other U.S. and worldwide patents issued & pending.

   

DTS is a registered trademark and the DTS logos, Sym-
bol, DTS-HD and DTS-HD Master Audio are trademarks 
of DTS, Inc. © 1996-2008 DTS, Inc. All Rights Reserved.

•  This system incorporates High-Defi nition Multimedia Interface 

(HDMITM) technology.

 

HDMI, the HDMI logo and High-Defi nition Multimedia 
Interface are trademarks or registered trademarks of HDMI 
Licensing LLC.

•  Java and all Java-based trademarks and logos are trademarks 

or registered trademarks of Sun Microsystems, Inc.

•  “BD-LIVE” and “BONUSVIEW” are trademarks of Blu-ray 

Disc Association.

•  “Blu-ray Disc” is a trademark.
•  “Blu-ray Disc,” “DVD+RW,” “DVD-RW,” “DVD+R,” 

“DVDR,” “DVD VIDEO,” and “CD” logos are trademarks.

•  “BRAVIA” is a trademark of Sony Corporation.
•  “AVCHD” and the “AVCHD” logo are trademarks of Matsu-

shita Electric Industrial Co., Ltd. and Sony Corporation.

•  “S-AIR” and its logo are trademarks of Sony Corporation.
•  , “XMB,” and “xross media bar” are trademarks of Sony 

Corporation and Sony Computer Entertainment Inc.

•  “PLAYSTATION” is a trademark of Sony Computer Entertain-

ment Inc.

•  DivX®, DivX Certifi ed® and associated logos are registered 

trademarks of DivX, Inc. and are used under license.

•  Music and video recognition technology and related data are 

provided by Gracenote®.

 

Gracenote is the industry standard in music recognition 
technology and related content delivery. For more information, 
please visit www.gracenote.com.

 

CD, DVD, Blu-ray Disc, and music and video-related data 
from Gracenote, Inc., copyright © 2000-present Gracenote. 
Gracenote Software, copyright © 2000-present Gracenote. One 
or more patents owned by Gracenote apply to this product and 
service. See the Gracenote website for a nonexhaustive list of 
applicable Gracenote patents. Gracenote, CDDB, MusicID, 
MediaVOCS, the Gracenote logo and logotype, and the 
“Powered by Gracenote” logo are either registered trademarks 
or trademarks of Gracenote in the United States and/or other 
countries.

POWER OUTPUT (rated)
Front L + Front R:

108 W + 108 W (at 3 ohms, 
1 kHz, 1% THD)

POWER OUTPUT (reference)
 Front L/Front R/Center:

167 W (per channel at 3 
ohms, 1 kHz)

Subwoofer:

165 W (at 3 ohms, 80 Hz)

Inputs (Analog)
AUDIO (AUDIO IN)

Sensitivity: 450/250 mV

Inputs (Digital)
SAT/CABLE (COAXIAL), TV (OPTICAL)

Supported formats: LPCM 
2CH (up to 48 kHz), Dolby 
Digital, DTS

Outputs

VIDEO: 1 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms

P

B

/C

B

, P

R

/C

R

: 0.7 Vp-p 

75 ohms

HDMI OUT: Type A (19 
pin)

Signal format system

PAL/NTSC

LAN (100) terminal

100BASE-TX Terminal

System

PLL quartz-locked digital 
synthesizer

FM tuner section
Tuning range

87.5 MHz - 108.0 MHz 
(50 kHz step)

Antenna (aerial)

FM wire antenna (aerial)

Antenna (aerial) terminals 75 ohms, unbalanced
Intermediate frequency

10.7 MHz

Power requirements
Taiwan models:

120 V AC, 50/60 Hz

Other models:

220 V - 240 V AC, 
50/60 Hz

Power consumption

On: 130 W
Standby: 0.3 W (at the 
Power Saving mode) 

Dimensions (approx.)

430 mm × 85 mm × 335 
mm (w/h/d) incl. 
projecting parts
430 mm × 85 mm × 365 
mm (w/h/d) (incl. wireless 
transceiver)

Mass (approx.)

4.7 kg

Design and specifications are subject to change 
without notice.

POWER OUTPUT (reference)
 Front L/Front R/Center:

100 W (per channel at 3 
ohms, 1 kHz)

Subwoofer:

100 W (at 3 ohms, 80 Hz)

Inputs (Analog)
AUDIO (AUDIO IN)

Sensitivity: 450/250 mV

Inputs (Digital)
SAT/CABLE (COAXIAL), TV (OPTICAL)

Supported formats: LPCM 
2CH (up to 48 kHz), Dolby 
Digital, DTS

 (USB) port:

Type A (For connecting 
USB memory, memory 
card reader, digital still 
camera, and digital video 
camera)

Maximum current:

500 mA

NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 

Never reuse a disconnected chip component.

• 

Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.

FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 

Keep the temperature of soldering iron around 270 °C during 
repairing.

• 

Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).

• 

Be careful not to apply force on the conductor when soldering 
or unsoldering.

0  OR  DOTTED  LINE  

0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  

This appliance is classified as a 
CLASS 3R LASER product. 
Visible and invisible laser radiation 
is emitted when the laser protective 
housing is opened, so be sure to 
avoid direct eye exposure.

This marking is located on the laser 
protective housing inside the 
enclosure.

This appliance is classified as a 
CLASS 1 LASER product. This 
marking is located on the rear 
exterior.

CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.

㚐嬢⡫⫾下ᶞ DMBTT!4S!
MBTFS ḋ␥Ɂ㼤₭ὁ㈈仍ㆷ
⹤㕚Ṿ⌵⅞⍓夥⏰ᵱ⍓夥
㼤₭廴⭨濇♄㫈Ⅻ≣䙘㌉䃋
⭨䚠䚿Ɂ
㫈㝫⼻ằᷲ㚞⡗⃩䗨㼤₭
ὁ㈈仍ᵮɁ

㚐嬢⡫⫾下ᶞ DMBTT!2!
MBTFS ḋ␥Ɂ㫈㝫⼻ằᷲ倰
恌⡺埌曆Ɂ

 ..............................................   4

2-1.  Disassembly  Flow ...........................................................   11
2-2. 

Case .................................................................................   11

2-3.  MB-134  Board ................................................................   12
2-4.  Bracket (MB) Block ........................................................   13
2-5.  Fuse (F901), POWER Board ..........................................   13
2-6.  Front Panel Block ...........................................................   14
2-7.  BD Drive (BPX-5) ..........................................................   14
2-8.  INCLUDE  Board ............................................................   15
2-9.  Back Panel Block ............................................................   15
2-10.  MAIN  Board ...................................................................   16
2-11.  AUDIO  Board .................................................................   16
2-12.  Optical Pick-up Block (KEM-460AAA), 

Wire ( Flat  Type) ..............................................................   17

TEST  MODE 

 ............................................................   18

 ..........................................   27

5-1.  Block Diagram - SERVO Section - ................................   28
5-2.  Block Diagram - MEMORY Section - ............................   29
5-3.  Block Diagram - TUNER, S-AIR Section - ....................   30
5-4.  Block Diagram - AUDIO Section - .................................   31
5-5.  Block Diagram - REGULATOR Section - ......................   32
5-6.  Block Diagram 

- PANEL, POWER SUPPLY Section - ...........................   33

5-7.  Schematic Diagram - MB-134 Board (1/13) - ................   35
5-8.  Schematic Diagram - MB-134 Board (2/13) - ................   36
5-9.  Schematic Diagram - MB-134 Board (3/13) - ................   37
5-10.  Schematic Diagram - MB-134 Board (4/13) - ................   38
5-11.  Schematic Diagram - MB-134 Board (5/13) - ................   39
5-12.  Schematic Diagram - MB-134 Board (6/13) - ................   40
5-13.  Schematic Diagram - MB-134 Board (7/13) - ................   41
5-14.  Schematic Diagram - MB-134 Board (8/13) - ................   42
5-15.  Schematic Diagram - MB-134 Board (9/13) - ................   43

5-16.  Schematic Diagram - MB-134 Board (10/13) - ..............   44
5-17.  Schematic Diagram - MB-134 Board (11/13) - ..............   45
5-18.  Schematic Diagram - MB-134 Board (12/13) - ..............   46
5-19.  Schematic Diagram - MB-134 Board (13/13) - ..............   47
5-20.  Printed Wiring Board 

- MB-134 Board (Component Side) - .............................   48

5-21.  Printed Wiring Board 

- MB-134 Board (Conductor Side) - ...............................   49

5-22.  Printed Wiring Board - AUDIO Board - .........................   50
5-23.  Schematic Diagram - AUDIO Board - ............................   51
5-24.  Printed Wiring Board 

- MAIN Board (Component Side) - ................................   52

5-25.  Printed Wiring Board 

- MAIN Board (Conductor Side) - ..................................   53

5-26.  Schematic Diagram - MAIN Board (1/5) - .....................   54
5-27.  Schematic Diagram - MAIN Board (2/5) - .....................   55
5-28.  Schematic Diagram - MAIN Board (3/5) - .....................   56
5-29.  Schematic Diagram - MAIN Board (4/5) - .....................   57
5-30.  Schematic Diagram - MAIN Board (5/5) - .....................   58
5-31.  Printed Wiring Boards - KEY Section - ..........................   59
5-32.  Schematic Diagram - KEY Section - ..............................   59
5-33.  Printed Wiring Board - REG Board - ..............................   60
5-34.  Schematic Diagram - REG Board - ................................   61
5-35.  Printed Wiring Board - INCLUDE Board - ....................   62
5-36.  Schematic Diagram - INCLUDE Board - .......................   63
5-37.  Printed Wiring Board - FL Board - .................................   64
5-38.  Schematic Diagram - FL Board - ....................................   65
5-39.  Printed Wiring Board - POWER Board - ........................   66
5-40.  Schematic Diagram - POWER Board - ..........................   67

6-1.  Case, Front Panel Section ...............................................   92
6-2.  MB-134 Board Section ...................................................   93
6-3.  Back Panel Section .........................................................   94
6-4.  MAIN Board Section ......................................................   95
6-5.  BD Drive Section (BPX-5) .............................................   96

   ..............................   97

The laser diode in the Optical Pick-up Block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 

the heated tip is applied for too long, so be careful!

• 

Strong viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

• 

Usable with ordinary solder

 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

J-6090-199-A

BLX-104

Single Layer

J-6090-200-A

BLX-204

Dual Layer

J-2501-307-A

CD (HLX-A1)

J-2501-305-A

HLX-513

Single Layer (NTSC)

J-2501-306-A

HLX-514

Dual Layer (NTSC)

J-6090-077-A

HLX-506

Single Layer (PAL)

J-6090-078-A

HLX-507

Dual Layer (PAL)

Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883-

989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204.

1. BLX-104
Procedure:
1.  Select 23.976Hz/1080p.
2.  Play “4.Motion picture”.
3.  Check whether player can play back or not.
4.  Check each outputs.
 Video:
 

Composite/S Video/component/HDMI.

 Audio:
 

Speaker out.

*  When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz) 

can use instead of 1080/24p.

 

However this is temporary correspondence.

2. BLX-204
Procedure:
1.  Select 1080i (59.94Hz or 50Hz).
2.  Play “4.Motion picture”.
3.  Check whether player can play back or not (Check the picture 

and sound output).

3.  CD (HLX-A1)
Procedure:
Check whether player can play back or not (Check the sound out-
put).

4.  HLX-513/514 (NTSC), HLX-506/507 (PAL)
Procedure:
1.  After displayed Main Menu, select “1.Video Signal”.
2.  Play “1.Color bar 100%” (Check the picture and sound out-

put).

3.  Return to Menu.
4.  Play “Demonstration 4:3” or “Demonstration 16:9” (Check the 

picture and sound output).

NOTE  THE  IC101,  IC104,  IC105,  IC204,  IC205,  IC307,  
IC311,  IC501  AND  IC502  ON  THE  MB-134  BOARD  
REPLACING
IC101, IC104, IC105, IC204, IC205, IC307, IC311, IC501 and  
IC502 on the MB-134 board cannot exchange with single. When 
these parts are damaged, exchange the entire mounted board.

RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.

Releasing Procedure:
1.  Press the [

?/1

] button to turn on the system.

2.  Press the [FUNCTION] button to select “BD/DVD”.
3.  Press the [

x

] and [

Z

] buttons simultaneously and hold down 

unit “DEMO OFF” displayed on the fluorescent indicator tube 
(around 5 seconds).

Note: When “DEMO ON” is displayed, the disc tray lock is not released 

by turning power on/off with the [?/1] button.

ABOUT  THE  LENS  CLEANING
Do not do the lens cleaning with the cotton bud etc. It causes the 
trouble.