BDV-E670W - Sony Audio Service Manual (repair manual)

Model
BDV-E670W
Pages
115
Size
7.31 MB
Type
PDF
Document
Service Manual
Brand
Device
Audio
File
bdv-e670w-1.pdf
Date

View Sony BDV-E670W Service Manual online

SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
HBD-E670W/E970W
SPECIFICATIONS
BLU-RAY DISC/DVD RECEIVER
9-889-834-03
2011A05-1
© 
2011.01
AEP Model
Australian Model
Chinese Model
Saudi Arabia Model
Singapore Model
Taiwan Model
HBD-E970W
UK Model
HBD-E670W
Ver. 1.2  2011.01
•  HBD-E670W is the amplifi er, video, BD/DVD/Super Audio 
CD/CD system, USB, LAN and tuner section in BDV-E670W.
•  HBD-E970W is the amplifi er, video, BD/DVD/Super Audio 
CD/CD system, USB, LAN and tuner section in BDV-E970W.
Photo: HBD-E970W
Model Name Using Similar Mechanism
BDP-S370
Mechanism Type
BPX-5
Optical Pick-up Block Name
KEM-460AAA
•  This product incorporates copyright protection technology 
that is protected by U.S. patents and other intellectual property 
rights.
 
Use of this copyright protection technology must be authorized 
by Macrovision, and is intended for home and other limited 
viewing uses only unless otherwise authorized by Macrovi-
sion.
 
Reverse engineering or disassembly is prohibited.
•  This system incorporates with Dolby* Digital and Dolby Pro 
Logic (II) adaptive matrix surround decoder and the DTS** 
Digital Surround System.
  *  Manufactured under license from Dolby Laboratories. 
Dolby, Pro Logic, and the double-D symbol are trade-
marks of Dolby Laboratories.
  ** Manufactured under license under U.S. Patent #’s: 
5,451,942; 5,956,674; 5,974,380; 5,978,762; 6,226,616; 
6,487,535; 7,212,872; 7,333,929; 7,392,195; 7,272,567 & 
other U.S. and worldwide patents issued & pending.
   
DTS is a registered trademark and the DTS logos, Sym-
bol, DTS-HD and DTS-HD Master Audio are trademarks 
of DTS, Inc. © 1996-2008 DTS, Inc. All Rights Reserved.
•  This system incorporates High-Defi nition Multimedia Interface 
(HDMITM) technology.
 
HDMI, the HDMI logo and High-Defi nition Multimedia 
Interface are trademarks or registered trademarks of HDMI 
Licensing LLC.
•  Java and all Java-based trademarks and logos are trademarks 
or registered trademarks of Sun Microsystems, Inc.
•  “BD-LIVE” and “BONUSVIEW” are trademarks of Blu-ray 
Disc Association.
•  “Blu-ray Disc” is a trademark.
•  “Blu-ray Disc,” “DVD+RW,” “DVD-RW,” “DVD+R,” 
“DVDR,” “DVD VIDEO,” and “CD” logos are trademarks.
•  “BRAVIA” is a trademark of Sony Corporation.
•  “AVCHD” and the “AVCHD” logo are trademarks of Matsu-
shita Electric Industrial Co., Ltd. and Sony Corporation.
•  “S-AIR” and its logo are trademarks of Sony Corporation.
•  , “XMB,” and “xross media bar” are trademarks of Sony 
Corporation and Sony Computer Entertainment Inc.
•  “PLAYSTATION” is a trademark of Sony Computer Entertain-
ment Inc.
•  DivX®, DivX Certifi ed® and associated logos are registered 
trademarks of DivX, Inc. and are used under license.
•  Music and video recognition technology and related data are 
provided by Gracenote®.
 
Gracenote is the industry standard in music recognition 
technology and related content delivery. For more information, 
please visit www.gracenote.com.
 
CD, DVD, Blu-ray Disc, and music and video-related data 
from Gracenote, Inc., copyright © 2000-present Gracenote. 
Gracenote Software, copyright © 2000-present Gracenote. One 
or more patents owned by Gracenote apply to this product and 
service. See the Gracenote website for a nonexhaustive list of 
applicable Gracenote patents. Gracenote, CDDB, MusicID, 
MediaVOCS, the Gracenote logo and logotype, and the 
“Powered by Gracenote” logo are either registered trademarks 
or trademarks of Gracenote in the United States and/or other 
countries.
Amplifier Section (Except Chinese model) 
POWER OUTPUT (rated)
Front L + Front R:
108 W + 108 W (at 3 ohms, 
1 kHz, 1% THD)
POWER OUTPUT (reference)
 Front L/Front R/Center:
167 W (per channel at 3 
ohms, 1 kHz)
Subwoofer:
165 W (at 3 ohms, 80 Hz)
Inputs (Analog)
AUDIO (AUDIO IN)
Sensitivity: 450/250 mV
Inputs (Digital)
SAT/CABLE (COAXIAL), TV (OPTICAL)
Supported formats: LPCM 
2CH (up to 48 kHz), Dolby 
Digital, DTS
Video Section
Outputs
VIDEO: 1 Vp-p 75 ohms
COMPONENT:
Y: 1 Vp-p 75 ohms
P
B
/C
B
, P
R
/C
R
: 0.7 Vp-p 
75 ohms
HDMI OUT: Type A (19 
pin)
BD/DVD/Super Audio CD/CD System
Signal format system
PAL/NTSC
LAN Section
LAN (100) terminal
100BASE-TX Terminal
Tuner Section
System
PLL quartz-locked digital 
synthesizer
FM tuner section
Tuning range
87.5 MHz - 108.0 MHz 
(50 kHz step)
Antenna (aerial)
FM wire antenna (aerial)
Antenna (aerial) terminals 75 ohms, unbalanced
Intermediate frequency
10.7 MHz
General
Power requirements
Taiwan models:
120 V AC, 50/60 Hz
Other models:
220 V - 240 V AC, 
50/60 Hz
Power consumption
On: 130 W
Standby: 0.3 W (at the 
Power Saving mode) 
Dimensions (approx.)
430 mm × 85 mm × 335 
mm (w/h/d) incl. 
projecting parts
430 mm × 85 mm × 365 
mm (w/h/d) (incl. wireless 
transceiver)
Mass (approx.)
4.7 kg
Design and specifications are subject to change 
without notice.
Amplifier Section (Chinese model)
POWER OUTPUT (reference)
 Front L/Front R/Center:
100 W (per channel at 3 
ohms, 1 kHz)
Subwoofer:
100 W (at 3 ohms, 80 Hz)
Inputs (Analog)
AUDIO (AUDIO IN)
Sensitivity: 450/250 mV
Inputs (Digital)
SAT/CABLE (COAXIAL), TV (OPTICAL)
Supported formats: LPCM 
2CH (up to 48 kHz), Dolby 
Digital, DTS
USB Section
 (USB) port:
Type A (For connecting 
USB memory, memory 
card reader, digital still 
camera, and digital video 
camera)
Maximum current:
500 mA
HBD-E670W/E970W
2
NOTES  ON  CHIP  COMPONENT  REPLACEMENT
• 
Never reuse a disconnected chip component.
• 
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
FLEXIBLE  CIRCUIT  BOARD  REPAIRING
• 
Keep the temperature of soldering iron around 270 °C during 
repairing.
• 
Do not touch the soldering iron on the same conductor of the 
circuit board (within 3 times).
• 
Be careful not to apply force on the conductor when soldering 
or unsoldering.
SAFETY-RELATED  COMPONENT  WARNING!
COMPONENTS  IDENTIFIED  BY  MARK  
0  OR  DOTTED  LINE  
WITH  MARK  
0  ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 
 
WHOSE  PART  NUMBERS  APPEAR  AS  SHOWN  IN  THIS  
MANUAL  OR  IN  SUPPLEMENTS  PUBLISHED  BY  SONY.
This appliance is classified as a 
CLASS 3R LASER product. 
Visible and invisible laser radiation 
is emitted when the laser protective 
housing is opened, so be sure to 
avoid direct eye exposure.
This marking is located on the laser 
protective housing inside the 
enclosure.
This appliance is classified as a 
CLASS 1 LASER product. This 
marking is located on the rear 
exterior.
CAUTION
Use of controls or adjustments or performance of procedures 
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Ver. 1.1
㚐嬢⡫⫾下ᶞ DMBTT!4S!
MBTFS ḋ␥Ɂ㼤₭ὁ㈈仍ㆷ
⹤㕚Ṿ⌵⅞⍓夥⏰ᵱ⍓夥
㼤₭廴⭨濇♄㫈Ⅻ≣䙘㌉䃋
⭨䚠䚿Ɂ
㫈㝫⼻ằᷲ㚞⡗⃩䗨㼤₭
ὁ㈈仍ᵮɁ
㚐嬢⡫⫾下ᶞ DMBTT!2!
MBTFS ḋ␥Ɂ㫈㝫⼻ằᷲ倰
恌⡺埌曆Ɂ
HBD-E670W/E970W
3
1. 
SERVICING  NOTES
 ..............................................   4
2. DISASSEMBLY
2-1.  Disassembly  Flow ...........................................................   11
2-2. 
Case .................................................................................   11
2-3.  MB-134  Board ................................................................   12
2-4.  Bracket (MB) Block ........................................................   13
2-5.  Fuse (F901), POWER Board ..........................................   13
2-6.  Front Panel Block ...........................................................   14
2-7.  BD Drive (BPX-5) ..........................................................   14
2-8.  INCLUDE  Board ............................................................   15
2-9.  Back Panel Block ............................................................   15
2-10.  MAIN  Board ...................................................................   16
2-11.  AUDIO  Board .................................................................   16
2-12.  Optical Pick-up Block (KEM-460AAA), 
Wire ( Flat  Type) ..............................................................   17
3. 
TEST  MODE 
 ............................................................   18
4. 
ELECTRICAL  CHECK
 ..........................................   27
5. DIAGRAMS
5-1.  Block Diagram - SERVO Section - ................................   28
5-2.  Block Diagram - MEMORY Section - ............................   29
5-3.  Block Diagram - TUNER, S-AIR Section - ....................   30
5-4.  Block Diagram - AUDIO Section - .................................   31
5-5.  Block Diagram - REGULATOR Section - ......................   32
5-6.  Block Diagram 
- PANEL, POWER SUPPLY Section - ...........................   33
5-7.  Schematic Diagram - MB-134 Board (1/13) - ................   35
5-8.  Schematic Diagram - MB-134 Board (2/13) - ................   36
5-9.  Schematic Diagram - MB-134 Board (3/13) - ................   37
5-10.  Schematic Diagram - MB-134 Board (4/13) - ................   38
5-11.  Schematic Diagram - MB-134 Board (5/13) - ................   39
5-12.  Schematic Diagram - MB-134 Board (6/13) - ................   40
5-13.  Schematic Diagram - MB-134 Board (7/13) - ................   41
5-14.  Schematic Diagram - MB-134 Board (8/13) - ................   42
5-15.  Schematic Diagram - MB-134 Board (9/13) - ................   43
TABLE  OF  CONTENTS
5-16.  Schematic Diagram - MB-134 Board (10/13) - ..............   44
5-17.  Schematic Diagram - MB-134 Board (11/13) - ..............   45
5-18.  Schematic Diagram - MB-134 Board (12/13) - ..............   46
5-19.  Schematic Diagram - MB-134 Board (13/13) - ..............   47
5-20.  Printed Wiring Board 
- MB-134 Board (Component Side) - .............................   48
5-21.  Printed Wiring Board 
- MB-134 Board (Conductor Side) - ...............................   49
5-22.  Printed Wiring Board - AUDIO Board - .........................   50
5-23.  Schematic Diagram - AUDIO Board - ............................   51
5-24.  Printed Wiring Board 
- MAIN Board (Component Side) - ................................   52
5-25.  Printed Wiring Board 
- MAIN Board (Conductor Side) - ..................................   53
5-26.  Schematic Diagram - MAIN Board (1/5) - .....................   54
5-27.  Schematic Diagram - MAIN Board (2/5) - .....................   55
5-28.  Schematic Diagram - MAIN Board (3/5) - .....................   56
5-29.  Schematic Diagram - MAIN Board (4/5) - .....................   57
5-30.  Schematic Diagram - MAIN Board (5/5) - .....................   58
5-31.  Printed Wiring Boards - KEY Section - ..........................   59
5-32.  Schematic Diagram - KEY Section - ..............................   59
5-33.  Printed Wiring Board - REG Board - ..............................   60
5-34.  Schematic Diagram - REG Board - ................................   61
5-35.  Printed Wiring Board - INCLUDE Board - ....................   62
5-36.  Schematic Diagram - INCLUDE Board - .......................   63
5-37.  Printed Wiring Board - FL Board - .................................   64
5-38.  Schematic Diagram - FL Board - ....................................   65
5-39.  Printed Wiring Board - POWER Board - ........................   66
5-40.  Schematic Diagram - POWER Board - ..........................   67
6. 
EXPLODED  VIEWS
6-1.  Case, Front Panel Section ...............................................   92
6-2.  MB-134 Board Section ...................................................   93
6-3.  Back Panel Section .........................................................   94
6-4.  MAIN Board Section ......................................................   95
6-5.  BD Drive Section (BPX-5) .............................................   96
7. 
ELECTRICAL  PARTS  LIST
   ..............................   97
Ver. 1.1
HBD-E670W/E970W
4
SECTION  1
SERVICING  NOTES
NOTES  ON  HANDLING  THE OPTICAL  PICK-UP  
BLOCK  OR  BASE  UNIT
The laser diode in the Optical Pick-up Block may suffer electro-
static break-down because of the potential difference generated by 
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.
NOTES  ON  LASER  DIODE  EMISSION  CHECK
The laser beam on this model is concentrated so as to be focused 
on the disc refl ective surface by the objective lens in the optical 
pickup block. Therefore, when checking the laser diode emission, 
observe from more than 30 cm away from the objective lens.
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• 
Strong viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
• 
Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
Part No.
Description
Layer
J-6090-199-A
BLX-104
Single Layer
J-6090-200-A
BLX-204
Dual Layer
J-2501-307-A
CD (HLX-A1)
J-2501-305-A
HLX-513
Single Layer (NTSC)
J-2501-306-A
HLX-514
Dual Layer (NTSC)
J-6090-077-A
HLX-506
Single Layer (PAL)
J-6090-078-A
HLX-507
Dual Layer (PAL)
TEST  DISC
Note: Refer to the service manual of BDP-BX1/S350 (Part No. 9-883-
989-1[]) (page 1-3 to 1-14E) for the use of BLX-104/204.
Operation and Display:
1. BLX-104
Procedure:
1.  Select 23.976Hz/1080p.
2.  Play “4.Motion picture”.
3.  Check whether player can play back or not.
4.  Check each outputs.
 Video:
 
Composite/S Video/component/HDMI.
 Audio:
 
Speaker out.
*  When 1080/24p monitor is nothing, 1080i (59.94Hz or 50Hz) 
can use instead of 1080/24p.
 
However this is temporary correspondence.
2. BLX-204
Procedure:
1.  Select 1080i (59.94Hz or 50Hz).
2.  Play “4.Motion picture”.
3.  Check whether player can play back or not (Check the picture 
and sound output).
3.  CD (HLX-A1)
Procedure:
Check whether player can play back or not (Check the sound out-
put).
4.  HLX-513/514 (NTSC), HLX-506/507 (PAL)
Procedure:
1.  After displayed Main Menu, select “1.Video Signal”.
2.  Play “1.Color bar 100%” (Check the picture and sound out-
put).
3.  Return to Menu.
4.  Play “Demonstration 4:3” or “Demonstration 16:9” (Check the 
picture and sound output).
NOTE  THE  IC101,  IC104,  IC105,  IC204,  IC205,  IC307,  
IC311,  IC501  AND  IC502  ON  THE  MB-134  BOARD  
REPLACING
IC101, IC104, IC105, IC204, IC205, IC307, IC311, IC501 and  
IC502 on the MB-134 board cannot exchange with single. When 
these parts are damaged, exchange the entire mounted board.
RELEASING  THE  DISC  TRAY  LOCK
The disc tray lock function for the antitheft of an demonstration 
disc in the store is equipped.
Releasing Procedure:
1.  Press the [
?/1
] button to turn on the system.
2.  Press the [FUNCTION] button to select “BD/DVD”.
3.  Press the [
x
] and [
Z
] buttons simultaneously and hold down 
unit “DEMO OFF” displayed on the fluorescent indicator tube 
(around 5 seconds).
Note: When “DEMO ON” is displayed, the disc tray lock is not released 
by turning power on/off with the [?/1] button.
ABOUT  THE  LENS  CLEANING
Do not do the lens cleaning with the cotton bud etc. It causes the 
trouble. 

Download Sony BDV-E670W Service Manual (Repair Manual)

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