ES 150PW (serv.man5) - JBL Audio EMC - CB Certificate (repair manual). Page 14

 

Page 11 of 58 

Report No.: 1009950 

Clause 

Requirement + Test 

Result - Remark 

Verdict 

 

 
TRF No. IEC60065J 

 

Insulation Resistance and dielectric strength across 
BASIC or SUPPLEMENTARY insulation (Class 1)  

 P 

 

Insulation resistance and dielectric strength across 
REINFORCED insulation (Class II)  

 P 

 

11.1 

No shock hazard under fault condition  

 

P 

11.2 

Heating under fault condition  

 

P 

 

Flames extinguish within 10 seconds  

 

P 

 

No hazard from softening solder  

 

P 

 

Soldered terminations not used  as protective 
mechanism  

 P 

11.2.1 

Measurement of temperature rises  

(see appended table) 

P 

11.2.2 

Temperature rise of accessible parts  

(see appended table) 

P 

11.2.3 

Temperature rise of parts, other than windings, 
providing electrical insulation  

(see appended table) 

P 

 

Temperature rise of printed circuit boards (PCB) 
exceeding the limits of table 3 by max. 100 K for 
max. 5 min  

 N/A 

 

a) Temperature rise of printed circuit boards (PCB) 
to 20.1.3, exceeding the limits of table 3 by not more 
than 100 K for an area not greater than 2 cm² 
………: 

 N/A 

 

b) Temperature rise of printed circuit boards (PCB) 
to 20.1.3 up to 300 K for an area not greater than 
2 cm² for a maximum of 5 min  

 N/A 

 

Meets all the special conditions if conductors on 
printed circuit boards are interrupted  

 N/A 

 

Class I protective earthing maintained  

 

N/A 

11.2.4 

Temperature rise of parts acting as a support or  
mechanical barrier  

 P 

11.2.5 

Temperature rise of windings  

(see appended table) 

P 

11.2.6 

Temperature rise of parts not subject to the limits of 
11.2.1 to 11.2.5  

(see appended table) 

P 

 

12.1.1 

Bump test where mass >7 kg  

15.5kg 

P 

12.1.2 

Vibration test  

No connection or part that might 
impair safety can become loose 

P 

12.1.3 

Impact hammer test  

 

P