Read JBL DSC 1000 EMC - CB Certificate online
Page 8 of 53
Report No: JSH0406745-001.
IEC 60065
Clause
Requirement - Test
Result - Remark
Verdict
9.1.4
Terminal devices tested with 1 mm x 20 mm test
pin (10 N); test probe D of IEC 61032
pin (10 N); test probe D of IEC 61032
P
Terminal devices tested with 1 mm x 100 mm
straight wire (1 N); test probe D of IEC 61032
straight wire (1 N); test probe D of IEC 61032
P
9.1.5
Pre-set controls tested with 2 mm x 100 mm test
pin (10 N); test probe C of IEC 61032
pin (10 N); test probe C of IEC 61032
No pre-set control
N
9.1.6
No shock hazard due to stored charge on
withdrawal of the mains plug; voltage (V) after 2 s :
withdrawal of the mains plug; voltage (V) after 2 s :
< 5V
P
If C is not greater than 0,1 µF no test needed
0.2
µ
F
N
9.1.7
Enclosure sufficiently resistant to external force
P
Test probe 11 of IEC 61032 for 10 s (50 N)
P
Test hook of fig. 4 for 10 s (20 N)
P
30 mm diameter test tool for 5 s (100 or 250 N) ... : 100N
P
9.2
No hazard after removing a cover by hand
Can not be removed by hand
N
10
INSULATION REQUIREMENTS
10.1
Insulation resistance (MO) at least 2 MO min. after
surge test for basic and 4 MO min. for reinforced
insulation ......................................................... :
surge test for basic and 4 MO min. for reinforced
insulation ......................................................... :
(See appended table)
P
10.2
Humidity treatment 48 h or 120 h ....................... : 120h, 40
O
C, 93%R.H.
P
10.3
Insulation resistance and dielectric strength
(See appended table)
P
11
FAULT CONDITIONS
11.1
No shock hazard under fault condition
P
11.2
Heating under fault condition
(See appended table)
P
No hazard from softening solder
P
11.2.1
Measurement of temperature rises
P
11.2.2
Temperature rise of accessible parts
P
11.2.3
Temperature rise of parts, other than windings,
providing electrical insulation
providing electrical insulation
P
Temperature rise of printed circuit boards (PCB)
exceeding the limits of table 3 by max. 100 K for
max. 5 min
exceeding the limits of table 3 by max. 100 K for
max. 5 min
N
a) Temperature rise of printed circuit boards (PCB)
to 20.1.3, exceeding the limits of table 3 by not
more than 100 K for an area not greater than
2 cm²
to 20.1.3, exceeding the limits of table 3 by not
more than 100 K for an area not greater than
2 cm²
N
b) Temperature rise of printed circuit boards (PCB)
to 20.1.3 up to 300 K for an area not greater than
2 cm² for a maximum of 5 min
to 20.1.3 up to 300 K for an area not greater than
2 cm² for a maximum of 5 min
N
Click on the first or last page to see other DSC 1000 service manuals if exist.