Read Harman Kardon DVD 506 (serv.man12) EMC - CB Certificate online
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Ref.No.: JHS0311045-001
EN 60065
Clause
Requirement - Test
Result - Remark
Verdict
30 mm diameter test tool for 5 s (100 or 250 N): ... 100N
P
9.2
No hazard after removing a cover by hand
Tools required
N
10
INSULATION REQUIREMENTS
(See appended table)
10.1
Insulation resistance (M
Ω
) at least 2 M
Ω
min. after
surge test for basic and 4 M
Ω
min. for reinforced
insulation
> 100 M
Ω
P
10.2
Humidity treatment 48 h or 120 h
120 h, 40
o
C, 39%
P
10.3
Insulation resistance and dielectric strength
P
11
FAULT CONDITIONS
(See appended table)
11.1
No shock hazard under fault conditions
P
11.2
Heating under fault condition
P
No hazard from softening solder
P
11.2.1
Measurement of temperature rises
P
11.2.2
Temperature rise of accessible parts
P
11.2.3
Temperature rise of parts, other than windings,
providing electrical insulation
providing electrical insulation
P
Temperature rise of printed circuit boards (PCB)
exceeding the limits of Table 2 by max. 100 K for
max. 5 min
exceeding the limits of Table 2 by max. 100 K for
max. 5 min
N
a) Temperature rise of printed circuit boards (PCB)
to 20.1.3, exceeding the limits of Table 2 by not
more than 100 K for an area not greater than
2 cm
to 20.1.3, exceeding the limits of Table 2 by not
more than 100 K for an area not greater than
2 cm
2
N
b) Temperature rise of printed circuit boards (PCB)
to 20.1.3 up to 300 K for an area not greater than
2 cm
to 20.1.3 up to 300 K for an area not greater than
2 cm
2
for a maximum of 5 min
N
Meets all the special conditions if conductors on
printed circuit boards are interrupted
printed circuit boards are interrupted
N
11.2.4
Temperature rise of parts acting as a support or
mechanical barrier
mechanical barrier
P
11.2.5
Temperature rise of windings
P
11.2.6
Temperature rise of other parts not subject to the
limits of 11.2.1 to 11.2.5
limits of 11.2.1 to 11.2.5
P
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