Read Harman Kardon BDS 275 EMC - CB Certificate online
Page 11 of 40
Report Ref. No.: 211-2012016-000
IEC 60065
Clause
Requirement + Test
Result - Remark
Verdict
Jiangsu TÜV Product Service Limited. - Shenzhen Branch
TRF No. IEC60065K
No hazard from softening solder
P
Soldered terminations not used as protective
mechanism
mechanism
N/A
11.2.1
Measurement of temperature rises
(see appended table)
P
11.2.2
Temperature rise of accessible parts
(see appended table)
P
11.2.3
Temperature rise of parts, other than windings and
printed boards, providing electrical insulation
printed boards, providing electrical insulation
(see appended table)
P
11.2.4
Temperature rise of parts acting as a support or
mechanical barrier
mechanical barrier
P
11.2.5
Temperature rise of windings
(see appended table)
P
11.2.6
Temperature rise of printed boards shall not exceed
the limits of table 3 by max. 100 K for max. 5 min
the limits of table 3 by max. 100 K for max. 5 min
N/A
Printed circuit boards (PCB) classified as V-0
according to 60695-11-10 or Clause G.1 may
exceed the limit in table 3 in case a) and b):
according to 60695-11-10 or Clause G.1 may
exceed the limit in table 3 in case a) and b):
N/A
a) Temperature rise of printed circuit boards
exceeding the limits of table 3 by not more than
100 K for an area not greater than 2 cm² ................ :
exceeding the limits of table 3 by not more than
100 K for an area not greater than 2 cm² ................ :
N/A
b) Temperature rise of printed circuit boards
exceeding the limits of table 3 up to 300 K for an
area not greater than 2 cm² for a maximum of 5 min
exceeding the limits of table 3 up to 300 K for an
area not greater than 2 cm² for a maximum of 5 min
N/A
Meets all the special conditions if conductors on
printed circuit boards are interrupted
printed circuit boards are interrupted
N/A
Class I protective earthing maintained
N/A
11.2.7
Temperature rise of parts not subject to the limits of
11.2.1 to 11.2.6 shall not exceed the limits in table 3,
item e), "Fault conditions".
11.2.1 to 11.2.6 shall not exceed the limits in table 3,
item e), "Fault conditions".
(see appended table)
P
12
Mechanical strength
—
12.1.1
Bump test where mass >7 kg
3.4 kg
N/A
12.1.2
Vibration test
P
12.1.3
Impact hammer test
P
Steel ball test
P
12.1.4
Drop t
est for portable apparatus where mass ≤ 7 kg
N/A
12.1.5
Thermoplastic enclosures stress relief test
76
C, 7 h
P
12.2
Fixing of knobs, push buttons, keys and levers
50N force for push-buttons on
front panel
front panel
P
12.3
Remote controls with hazardous live parts
N/A
12.4
Drawers (pull test 50 N, 10 s)
P
12.5
Antenna coaxial sockets providing isolation
N/A
12.6
Telescoping or rod antennas construction
N/A
Click on the first or last page to see other BDS 275 service manuals if exist.