Read Harman Kardon AVR 355 (serv.man5) EMC - CB Certificate online
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Report No.
108568
11 FAULT
CONDITIONS
11.1
No shock hazard under fault condition
No electric shock hazard
under fault conditions.
under fault conditions.
P
11.2
Heating under fault condition
P
No hazard from softening solder
No softening of solder
P
Flames extinguish within 10 seconds
No flames
P
Soldered terminations not used as protective
mechanism
mechanism
No protective mechanism
P
11.2.1
Measurement of temperature rises
P
11.2.2
Temperature rise of accessible parts
P
11.2.3
Temperature rise of parts, other than windings,
providing electrical insulation
providing electrical insulation
P
Temperature rise of printed circuit boards (PCB)
exceeding the limits of table 3 by max. 100 K for
max. 5 min
exceeding the limits of table 3 by max. 100 K for
max. 5 min
No exceeding the limits of
Table 3.
Table 3.
P
a) Temperature rise of printed circuit boards
(PCB) to 20.1.3, exceeding the limits of table 3 by
not more than 100 K for an area not greater than
2 cm²
(PCB) to 20.1.3, exceeding the limits of table 3 by
not more than 100 K for an area not greater than
2 cm²
N/A
b) Temperature rise of printed circuit boards
(PCB) to 20.1.3 up to 300 K for an area not greater
than 2 cm² for a maximum of 5 min
(PCB) to 20.1.3 up to 300 K for an area not greater
than 2 cm² for a maximum of 5 min
N/A
14 COMPONENTS
14.5 Protective
devices
P
Protective devices used within their ratings
Approved fuses and
thermal links.
thermal links.
P
External clearances and creepage distances meet
requirement of clause 13 for the voltage across
the device when opened
requirement of clause 13 for the voltage across
the device when opened
Adequate external clearance
and creepage distance.
and creepage distance.
P
14.5.1.1
a) Thermal cut-outs separately approved
None.
N/A
b) Thermal cut-outs tested as part of the
submission
submission
N/A
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