DSC-H5 - Sony Digital Camera Service Manual (repair manual)

Model
DSC-H5
Pages
27
Size
2.07 MB
Type
PDF
Document
Service Manual
Brand
Device
Digital Camera / LEVEL 3
File
dsc-h5.pdf
Date

View Sony DSC-H5 Service Manual online

SERVICE MANUAL
LEVEL
 
3
Revision History
Revision History
How to use
Acrobat Reader
How to use
Acrobat Reader
Sony EMCS Co.
2007F0800-1
  ©2007.06
Published by Kohda TEC
9-852-117-11
DSC-H5_L3
DSC-H5
Internal memory
ON BOARD
Internal memory
ON BOARD
Link
SERVICE NOTE
PRINTED WIRING BOARDS
SCHEMATIC DIAGRAMS
REPAIR PARTS LIST
Link
Ver. 1.3  2007. 06
Note :
The components identified by
mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.
Note :
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro spécifié.
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Chinese Model
Brazilian Model
Hong Kong Model
Korea Model
Tourist Model
Japanese Model
DIGITAL STILL CAMERA
— 2 —
DSC-H5_L3
1.
Check the area of your repair for unsoldered or poorly-soldered
connections.  Check the entire board surface for solder splashes
and bridges.
2.
Check the interboard wiring to ensure that no wires are
"pinched" or contact high-wattage resistors.
3.
Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair.  Point
them out to the customer and recommend their replacement.
4.
Look for parts which, through functioning, show obvious signs
of deterioration.  Point them out to the customer and
recommend their replacement.
5.
Check the B+ voltage to see it is at the values specified.
6.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
 : LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°
C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
°
C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 
0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
CAUTION :
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
— 3 —
DSC-H5_L3
TABLE OF CONTENTS
1.
SERVICE NOTE
1-1.
METHOD FOR COPYING OR ERASING THE DATA IN
INTERNAL MEMORY ·················································· 1-1
4.
PRINTED WIRING BOARDS AND
SCHEMATIC DIAGRAMS
4-2.
SCHEMATIC DIAGRAMS ·········································· 4-14
4-3.
PRINTED WIRING BOARDS ····································· 4-29
4-4.
MOUNTED PARTS LOCATION ································· 4-33
5.
REPAIR PARTS LIST
5-2.
ELECTRICAL PARTS LIST ········································ 5-12
1-1E
DSC-H5_L3
1. SERVICE NOTE
The data can be copied/erased by the operations on the Setup screen. (When erasing the data, execute formatting the internal memory.)
Note: 1 When replacing the SY-150 board, erase the data in internal memory of the board before replacement.
Note: 2 When replacing the SY-150 board or the IC202 on the SY-150 board, execute formatting and initialize the internal memory after 
replacement.
• PROCESS AFTER FIXING FLASH ERROR
When “FLASH error”  (Self-diagnosis Code  E : 91 : ** ) occurs, to prevent any abnormal situation caused by high voltage, setting of the
flash is changed automatically to disabling charge and flash setting.
After fixing, this setting needs to be deactivated. Flash error code can be initialized by the operations on the Setup screen.
Method for Initializing the Flash Error Code
Initializes the setting to the default setting.
1
Select [OK] with v on the control button, then press z.
The message “Initialize all settings Ready?” appears.
2
Select [OK] with v, then press z.
The settings are reset to the default setting.
Make sure that the power is not disconnected during resetting.
Initialize
OK
See the following procedure.
Cancel
Cancels the resetting.
Method for copying the data in internal memory
Method for formatting the internal memory
This item does not appear when a “Memory Stick Duo” is inserted in the camera.
The default settings are marked with 
.
Formats the internal memory.
• Note that formatting irrevocably erases all data in the internal memory, including even protected images.
1
Select [OK] with v on the control button, then press z.
The message “All data in internal memory will be erased Ready?” appears.
2
Select [OK] with v, then press z.
The format is complete.
Format
OK
See the following procedure.
Cancel
Cancels the formatting.
Copies all images in the internal memory to a “Memory Stick Duo”.
1
Insert a “Memory Stick Duo” having 32 MB or larger capacity.
2
Select [OK] with v on the control button, then press z.
The message “All data in internal memory will be copied Ready?” appears.
3
Select [OK] with v, then press z.
Copying starts. 
• Use a fully charged Nickel-Metal Hydride battery or the AC Adaptor (not supplied). If you attempt to 
copy image files using a batteries with little remaining charge, the batteries may run out, causing copying 
to fail or possibly corrupting the data.
• You cannot copy individual images.
• The original images in the internal memory are retained even after copying. To delete the contents of the 
internal memory, remove the “Memory Stick Duo” after copying, then execute the [Format] command in 
 (Internal Memory Tool).
• You cannot select a folder copied on a “Memory Stick Duo”.
• Even if you copy data, a 
 (Print order) mark is not copied.
Copy
OK
See the following procedure.
Cancel
Cancels the copying.
Copying
102_COPY
1-1. METHOD FOR COPYING OR ERASING THE DATA IN INTERNAL MEMORY
DSC-H5_L3
4-2.  SCHEMATIC DIAGRAMS
Link
Link
SY-150 BOARD (4/8) 
(256Mbit SDRAM, 
BURST FLASH MEMORY, ONE NAND FLASH MEMORY)
SY-150 BOARD (5/8)
(A/V AMP, A/V, USB JACK RELAY)
SY-150 BOARD (8/8) 
(DC/DC CONVERTER)
CH-199 BOARD 
(CCD SIGNAL PROCESS)
SY-150 BOARD (7/8) 
(CONNECTOR)
SY-150 BOARD (1/8) 
(LENS DRIVE)
SY-150 BOARD (6/8) 
(STEADY SHOT CONTROL)
SY-150 BOARD (2/8)
(CAMERA A/D CONV., TIMING GENERATOR)
SY-150 BOARD (3/8) 
(CAMERA DSP, SYSTEM CONTROL)
COMMON NOTE FOR SCHEMATIC DIAGRAMS
COMMON NOTE FOR SCHEMATIC DIAGRAMS
DSC-H5_L3
4-3
4-2. SCHEMATIC DIAGRAMS
4-2. SCHEMATIC DIAGRAMS
Link
(For schematic diagrams)
• All capacitors are in 
µ
F unless otherwise noted. pF : 
µ
µ
F.  50 V or less are not indicated except for electrolytics
and tantalums.
• Chip resistors are 1/10 W unless otherwise noted.
k
=1000 
, M
=1000 k
.
• Caution when replacing chip parts.
New parts must be attached after removal of chip.
Be careful not to heat the minus side of tantalum
capacitor, Because it is damaged by the heat.
• Some chip part will be indicated as follows.
Example
C541
L452
22U
10UH
TA  A
2520
• Constants of resistors, capacitors, ICs and etc with XX
indicate that they are not used.
In such cases, the unused circuits may be indicated.
• Parts with * differ according to the model/destination.
Refer to the mount table for each function.
• All variable and adjustable resistors have characteristic
curve B, unless otherwise noted.
• Signal name
XEDIT
→ 
EDIT
PB/XREC 
 PB/REC
• 2: non flammable resistor
• 5: fusible resistor
• C: panel designation
A
: B+ Line
B
: B– Line
J
: IN/OUT direction of (+,–) B LINE.
C
: adjustment for repair.
(Measuring conditions voltage)
• Voltages are measured between the measurement
points and ground when camera shoots color bar chart
of pattern box.  They are reference values.
(VOM of DC 10 M
 input impedance is used)
• Voltage values change depending upon input
impedance of VOM used.)
Precautions for Replacement of imager
• If the imager has been replaced, carry out all the
adjustments for the camera section.
• As the imager may be damaged by static electricity from
its structure, handle it carefully like for the MOS IC.
In addition, ensure that the receiver is not covered with
dusts nor exposed to strong light.
1. Connection
2. Adjust the distance so that the output waveform of
Fig. a and the Fig. b can be obtain.
When indicating parts by reference number, please
include the board name.
THIS NOTE IS COMMON FOR SCHEMATIC DIAGRAMS
(In addition to this, the necessary note is printed in each block)
Kinds of capacitor
Temperature characteristics
External dimensions (mm)
Y
ello
w
A
A
B
B
A=B
Fig. a (Video output terminal output waveform)
Electronic beam
scanning frame
CRT picture frame
H
Cy
an
Green
White
Magenta
Red
Blue
Fig.b (Picture on monitor TV)
Note :
The components identified by
mark 0 or dotted line with mark
0 are critical for safety.
Replace only with part number
specified.
Note :
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro spécifié.
Pattern box
Front of the lens
L = 1 m (PTB-450)
L = 40 cm (PTB-1450)
L
Camera
Pattern box PTB-450
J-6082-200-A
or
Small pattern box
PTB-1450
J-6082-557-A
For PTB-450:
J-6020-250-A
For PTB-1450:
J-6082-559-A
Pattern box
Color bar chart
4-2. SCHEMATIC DIAGRAMS
DSC-H5_L3
4-14
4-2. SCHEMATIC DIAGRAMS
SY-150 (1/8)
:Voltage measurement of the CSP IC
and the Transistors with      mark,is
not possible.
CSP(CHIP SIZE PACKAGE)IC
LENS UNIT is replaced as a block.
So that this PRINTED WIRING BOARD and 
SCHEMATIC DIAGRAM are omitted.
0.1u
C402
DIR2B
ZM_DIR_A
XCAM_DR_PS
FC_DIR_A
FC_DIR_B
0.1u
C401
DIR2A
MSHUT_DIR
FC_EN
MSHUT_EN
BRK2A
D_3.2V
A_3.2V
±
0.5%
R410
22k
ZM_BRK_A
STRB_PLUNGER_ON
STRB_PLUNGER
BRK2B
LENS_TMP
XFC_RST_LED
FC_SENS
ZM_SENS_1ST
ZM_SENS_2ND
XZM_RST_LED
ZM_DC_FG_1A
ZM_DC_FG_1B
XZM_FG_LED
39P
CN401
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
XX
C404
REG_GND
REG_GND
CL401
CL402
±
0.5%
47k
R411
±
0.5%
R409
22k
LV8053LG-TLM-E
IC401
G2
VCC
F7
DGND
F6
VREF
G7
VLIM
G3
RNFS
G4
RNF
D1
VM1
D7
VM2
A4
VM3
G5
VM4
C1
PGND1
E1
PGND1
C7
PGND2
E7
PGND2
F5
IN1
G6
EN1
E5
BR1
D3
IN2
E3
EN2
F1
BR2
D5
IN3
B6
EN3
A7
BR3
A6
IN4
C5
EN4
A5
BR4
A2
IN5
C4
EN5
B2
BR5
C3
IN6
A1
EN6
C2
BR6
G1
IN7
E4
EN7
D4
PS
F2
OUT1A
E2
OUT1B
D2
OUT2A
B1
OUT2B
D6
OUT3A
E6
OUT3B
B7
OUT4A
C6
OUT4B
B4
OUT5A
B5
OUT5B
B3
OUT6A
A3
OUT6B
F4
OUT7A
F3
OUT7B
±
0.5%
10
R432
±
0.5%
10
R433
±
0.5%
10
R434
±
0.5%
10
R435
C403
10V
22u
390
R437
390
R438
1
A
MSHUT_DIR
BRK2A
MSHUT_EN
DIR2A
DIR2B
DIR2A
ZM_DIR_A
FC_DIR_A
FC_DIR_B
FC_EN
DIR2B
FC_DIR_A
FC_DIR_B
ZM_BRK_A
STRB_PLUNGER_ON
STRB_PLUNGER_ON
MSHUT_EN
MSHUT_DIR
IRIS_A
IRIS_XA
IRIS_B
IRIS_XB
FOCUS_A
FOCUS_XA
FOCUS_B
FOCUS_XB
ZOOM_+
ZOOM_-
SHUTTER_-
SHUTTER_+
STRB_PLUNGER
XCAM_DR_PS
BRK2B
BRK2A
BRK2B
IRIS_A
IRIS_B
IRIS_XB
IRIS_XA
FOCUS_XB
FOCUS_A
FOCUS_B
FOCUS_XA
XCAM_DR_PS
SHUTTER_+
SHUTTER_-
ZM_DIR_A
ZM_BRK_A
FC_EN
ZOOM_+
ZOOM_-
STRB_PLUNGER
IRIS_XA
XZM_RST_LED1
ZM_SENS_2ND
XZM_FG_LED
ZM_DC_MOTOR_+
SHUTTER_-
FOCUS_XA
ZM_FG_VCC
IRIS_XB
IRIS_B
ZM_SENS_1ST
IRIS_A
FOCUS_XA
XZM_RST_LED2
LENS_TMP
FOCUS_A
XFC_RST_LED
SHUTTER_+
FOCUS_XB
FOCUS_B
ZM_DC_FG_1B
FC_RST_VCC
ZM_DC_MOTOR_-
SHUTTER_-
ZM_RST_VCC2
FOCUS_A
FC_SENS
ZM_DC_MOTOR_-
ZM_DC_FG_1A
FOCUS_B
FOCUS_XB
REG_GND
ZM_DC_MOTOR_+
ZM_RST_VCC1
SHUTTER_+
XZM_FG_TR
XZM_RST_TR1
XZM_RST_TR2
XFC_RST_TR
(P_GND)
M_5V
SY-150 BOARD(1/8)
LENS DRIVE
XX MARK:NO MOUNT
LENS
UNIT
(1/2)
IC401
ZOOM/FOCUS/IRIS/SHUTTER DRIVE
(7/8)
TO(8/8)
(3/8)
H
2
3
12
J
17
9
G
11
E
C
10
K
14
13
6
B
7
I
D
F
15
5
L
8
4
16
@02
@01
3.2V
5.0V
DSC-H5_L3
4-15
SY-150 (2/8)
Note:  The pin numbers of the CP301 on the SY-150 board
 
corresponds to the numbers from CL001 to CL074
 
on the CH-199 board.
Note:  CP301 (CH-199 board) is included in SY-150 
 complete 
board.
 
:Voltage measurement of the CSP IC
and the Transistors with      mark,is
not possible.
CSP(CHIP SIZE PACKAGE)IC
R8.7/P0
R8.7/P0
0
0
NO MARK:REC/PB MODE
    R  :REC MODE
    P  :PB MODE
5.1
5.1
3.3
XX
C310
10V
10u
A
TA
C302
100uH
L301
0uH
FB301
CA_AD10
47u
6.3V
C316
22
R310
CAM_-7.5V
CA_AD08
1800
R301
3.3u
B
35V
TA
C308
XSAN1_SCK
C313
XX
CA_AD00
CAM_2.9V
0
R313
VSUB_CONT_POST
JL302
3.3u
B
35V
TA
C304
0.1u
C307
6.3V
100u
C315
0
R320
JL303
0
R319
SAN1_SO
0
R318
0uH
FB302
JL301
CA_AD06
100k
R304
RN1904FE(TPLR3)
Q301
6
2
1
3
5
4
3300
R302
CA_AD12
39P
CN301
1
VSUB
2
CSUB
3
REG_GND
4
RAMDOM_TRIGGER
5
REG_GND
6
H2A
7
REG_GND
8
H2B
9
REG_GND
10
H1B
11
REG_GND
12
H1A
13
REG_GND
14
RG
15
REG_GND
16
REG_GND
17
REG_GND
18
CAM_-7.5V_CD
19
REG_GND
20
CCD_OUT
21
REG_GND
22
CAM_15V_CD
23
REG_GND
24
REG_GND
25
REG_GND
26
V5A
27
V9
28
V5B
29
V7
30
VHLD
31
V8
32
V2
33
V6
34
V3A
35
V1
36
V3B
37
VST
38
V10
39
V4
CA_AD09
MA2S111-(K8).SO
D301
VSUB_CONT_PRE
CA_HD
CA_AD04
0
R314
CA_AD11
0
R312
XX
C309
0
R316
1k
R307
XX
C311
CAM_15V
0
R311
CP301
1.2mmP-74P
(H1A)H1
1
(H1B)H3
2
(H2A)H2
3
(H2B)H4
4
RG
5
CCD_OUT
6
V1A/V79
7
V1B/V7
8
V2/V8
9
V3A/V6
10
V3B/V1
11
V4
12
V5A
13
V5B
14
V6/V2
15
V7A/V3A
16
V7B/V3B
17
V8/V10
18
(VST)V9
19
V10(VHLD)
20
SUSCK(SUB)
21
D0
22
D1
23
D2
24
D3
25
D4
26
D5
27
D6
28
D7
29
D8
30
D9
31
D10
32
D11
33
D12
34
D13
35
SYNC
36
MSHUT
37
STROB
38
SL
39
SDA
T
A
40
SCK
41
RST
42
VSUB
43
NC
44
CA_HR
45
CA_VR
46
TG_CKI
47
NC
48
CAM_-7.5V
49
VM
50
CAM_15V
51
TG3V
52
FE3V
53
HVDD
54
HVDD
55
DRVDD
56
TCVDD
57
TCVSS
58
NC
59
GND
60
GND
61
GND
62
GND
63
GND
64
GND
65
GND
66
NC
67
GND
68
GND
69
NC
70
RGVDD
71
GND
72
GND
73
DRVSS
74
CA_AD05
CA_AD07
100k
R308
CA_AD03
B
16V
TA
22u
C306
0
R321
CA_AD01
0.1u
C305
CA_AD13
CA_FD
CLKTGO
100uH
L303
0uH
FB308
CA_AD02
35V
1u
BJ
C303
50V
0.1u
C301
JL304
10uH
L302
XSAN_RST_OUT
C314
0.1u
REG_GND
6.3V
47u
C317
XCS_FE
R309
0
10uH
L304
JL305
IC301
R1114Q331D-TR-FA
1
CE
2
VSS
3
VOUT
4
VIN
ST_5V
10V
1u
B
C318
10V
1u
B
C319
XX
R322
1
A
FB309
0uH
CA_AD00
CA_AD07
SAN1_SO
VSUB_CONT_POST
CA_AD10
V1
V5A
XSAN1_SCK
CA_HD
CA_AD05
XSAN_RST_OUT
CA_AD01
SAN1_SO
CA_AD08
CA_AD10
CA_AD03
CA_AD06
CA_AD09
XCS_FE
CA_AD04
CA_AD02
V9
V6
CA_AD02
V4
CA_FD
CA_AD13
V8
V5B
CA_AD01
V2
CA_AD03
CA_AD09
XSAN1_SCK
CA_AD12
CA_AD00
VST
CA_AD12
CA_AD04
CA_AD11
CA_AD13
CA_AD06
CA_AD08
CLKTGO
CA_AD05
CA_AD07
CA_AD11
V7
V3A
V3B
V10
XCS_FE
CA_HD
CA_FD
VSUB_CONT_PRE
VSUB_CONT_POST
VSUB_CONT_PRE
V3B
V1
V3A
V6
V2
V8
V7
V5A
V5B
V9
VST
V4
V10
CLKTGO
XSAN_RST_OUT
CAM_3.2V
VSUB
SY-150 BOARD(2/8)
(PAGE 4-12
 of LEVEL 2)
CAMERA A/D CONV.TIMING GENERATOR
3.3V REG
TO
CD-621
FLEXIBLE
BOARD
IC301
XX MARK:NO MOUNT
(3/8)
(3/8,5/8,7/8)
(3/8,4/8,6/8,7/8)
(3/8,6/8)
(8/8)
CP301
A/D CONV.S/H,TIMING GENERATOR
H
2
3
12
J
9
G
11
E
C
10
14
13
6
B
7
I
D
F
15
5
8
4
@03
@04
@05
@06
12.1V
-7.5V
12.2V
2.9V
3.2V
2.9V
(PAGE 4-22)
CP301(CH-199 BOARD)
DSC-H5_L3
4-17
SY-150 (4/8)
:Voltage measurement of the CSP IC
and the Transistors with      mark,is
not possible.
CSP(CHIP SIZE PACKAGE)IC
CSP(CHIP SIZE PACKAGE)IC
CSP(CHIP SIZE PACKAGE)IC
Note: A service for IC201 is not available because an 
adjustment is required before replacement.
DSP_DQM3
DSP_DQ07
DSP_AQ11
DSP_DQ16
DSP_DQ10
DSP_AQ10
DSP_DQ28
DSP_AQ08
DSP_DQ15
DSP_DQ18
XDSP_QWE
DSP_DQ27
DSP_DQ04
DSP_QCLK
DSP_DQ25
DSP_DQ02
DSP_QBA1
DSP_DQ30
DSP_QBA0
DSP_DQ05
DSP_DQ31
DSP_DQ12
XDSP_QCAS
DSP_DQ17
XDSP_QRAS
DSP_DQ00
DSP_AQ07
DSP_DQ21
DSP_DQ13
DSP_AQ05
DSP_DQ29
DSP_DQM2
DSP_DQ08
DSP_DQM1
DSP_DQ22
DSP_DQ01
DSP_AQ03
DSP_DQ26
DSP_AQ02
DSP_DQ09
DSP_AQ09
DSP_DQ19
DSP_AQ04
DSP_DQ24
XDSP_QCS0
DSP_DQ03
DSP_AQ06
DSP_QCLKE
DSP_DQM0
D_1.8V
DSP_DQ23
D_3.2V
DSP_AQ00
DSP_DQ20
0.1u
C208
0.1u
C205
0.1u
C212
0.1u
C213
0.1u
C210
0.1u
C211
0.1u
C206
XCPU_CS0
XCPU_RD
XCPU_WE1
CPU_D00
CPU_A01
CPU_A17
CPU_A02
CPU_A03
CPU_A04
CPU_A05
CPU_A06
CPU_A07
CPU_A08
CPU_A09
CPU_A10
CPU_A11
CPU_A12
CPU_A13
CPU_A14
CPU_A15
CPU_A16
CPU_A18
CPU_A19
CPU_A20
CPU_A21
PH28F320W30TD70-A02
IC201
E8
A0
D8
A1
C8
A2
B8
A3
A8
A4
B7
A5
A7
A6
C7
A7
A2
A8
B2
A9
C2
A10
A1
A11
B1
A12
C1
A13
D2
A14
D1
A15
D4
A16
B6
A17
A6
A18
C6
A19
B3
A20
C3
NC
A3
VSS
F1
VSS
G8
VSSQ
G2
VSSQ
D7
NC
A5
VPP
A4
VCC
G4
VCC
E1
VCCQ
G6
VCCQ
F7
D0
E6
D1
E5
D2
G5
D3
E4
D4
G3
D5
E3
D6
G1
D7
G7
D8
F6
D9
F5
D10
F4
D11
D5
D12
F3
D13
F2
D14
E2
D15
D3
WAIT
C4
XADV
B4
CLK
C5
XWE
B5
XRST
D6
XWP
E7
XCE
F8
XOE
SAN_27M_CLKO
XCPU_BS
XSAN_RST_OUT
CPU_D01
CPU_D02
CPU_D03
CPU_D04
CPU_D05
CPU_D06
CPU_D07
CPU_D08
CPU_D09
CPU_D10
CPU_D11
CPU_D12
CPU_D13
CPU_D14
CPU_D15
DSP_DQ06
DSP_DQ14
DSP_DQ11
DSP_AQ01
IC203
K4M56323PG-HG75T
G8
A0
G9
A1
F7
A2
F3
A3
G1
A4
G2
A5
G3
A6
H1
A7
H2
A8
J3
A9
G7
A10
J7
BA0
H8
BA1
R8
DQ0
N7
DQ1
R9
DQ2
N8
DQ3
P9
DQ4
M8
DQ5
M7
DQ6
L8
DQ7
L2
DQ8
M3
DQ9
M2
DQ10
P1
DQ11
N2
DQ12
R1
DQ13
N3
DQ14
R2
DQ15
E8
DQ16
D7
DQ17
D8
DQ18
B9
DQ19
C8
DQ20
A9
DQ21
C7
DQ22
A8
DQ23
A2
DQ24
C3
DQ25
A1
DQ26
C2
DQ27
B1
DQ28
D2
DQ29
D3
DQ30
E2
DQ31
K9
DQM0
K1
DQM1
F8
DQM2
F2
DQM3
J8
CS#
K8
WE#
J9
RAS#
K7
CAS#
J2
CKE
J1
CLK
E3
(NC)
E7
(NC)
H3
(NC)
H7
(NC)
H9
A11
K2
(NC)
K3
(NC)
A7
VDD
F9
VDD
L7
VDD
R7
VDD
B2
VDDQ
B7
VDDQ
C9
VDDQ
D9
VDDQ
E1
VDDQ
L1
VDDQ
M9
VDDQ
N9
VDDQ
P2
VDDQ
P7
VDDQ
A3
VSS
F1
VSS
L3
VSS
R3
VSS
B3
VSSQ
B8
VSSQ
C1
VSSQ
D1
VSSQ
E9
VSSQ
L9
VSSQ
M1
VSSQ
N1
VSSQ
P3
VSSQ
P8
VSSQ
C207
0.1u
SD_1.8V
C201
XX
0.1u
B
C204
0.1u
B
C214
INT3
XCPU_CS4
XX
C215
KFG5616U1A-DIB5T
Note: When IC202 is replaced, formatting is required. 
Execute formatting by referring to Supplement-1.
IC202
G2
A00
G3
A01
H4
A02
H5
A03
H2
A04
H3
A05
G6
A06
F4
A07
F6
A08
E6
A09
G5
A10
F5
A11
D2
A12
F2
A13
F1
A14
D4
A15
D3
DQ00
B3
DQ01
E3
DQ02
C5
DQ03
C2
DQ04
D5
DQ05
D6
DQ06
C1
DQ07
B2
DQ08
B5
DQ09
C4
DQ10
C3
DQ11
B1
DQ12
A6
DQ13
A3
DQ14
D1
DQ15
E1
CLK
E2
XCE
B4
XOE
A1
XWE
A2
XRP
F3
XAVD
G1
INT
H1
RDY
E4
NC
E5
NC
G4
NC
H6
NC
B6
Vcc_Core
C6
Vcc_IO
A4
Vss_Core
A5
Vss_IO
49
NC
50
NC
51
NC
52
NC
53
NC
54
NC
55
NC
56
NC
57
NC
58
NC
59
NC
60
NC
61
NC
62
NC
63
NC
64
NC
65
NC
66
NC
67
NC
10uH
L201
22u
6.3V
P
C209
XX
C216
REG_GND
6.3V
10u
C203
1
A
DSP_DQ22
DSP_AQ09
DSP_DQ31
DSP_AQ05
DSP_DQ18
DSP_DQ18
DSP_DQ28
DSP_DQ17
DSP_DQ25
DSP_AQ06
DSP_DQ26
DSP_AQ08
DSP_DQM3
DSP_DQ29
DSP_DQ30
DSP_AQ04
DSP_AQ03
DSP_DQ27
DSP_DQ24
DSP_DQ20
DSP_DQ23
DSP_DQ29
DSP_DQ21
DSP_DQ19
DSP_AQ07
DSP_DQM1
DSP_DQ16
XDSP_QCAS
DSP_QCLKE
XDSP_QWE
XDSP_QCS0
DSP_DQM2
DSP_DQ20
DSP_DQ21
DSP_DQ23
DSP_DQ24
DSP_DQ26
DSP_DQ27
CPU_D00
XCPU_CS0
XCPU_CS0
XCPU_RD
XCPU_WE1
CPU_D00
CPU_A21
CPU_A16
CPU_A03
CPU_A04
CPU_A05
CPU_A06
CPU_A07
CPU_A08
CPU_A09
CPU_A10
CPU_A11
CPU_A12
CPU_A13
CPU_A14
CPU_A15
CPU_A16
CPU_A17
CPU_A18
CPU_A19
CPU_A20
CPU_A21
CPU_A01
CPU_A02
CPU_A03
CPU_A04
CPU_A05
CPU_A06
CPU_A07
CPU_A08
CPU_A09
CPU_A10
CPU_A11
CPU_A12
CPU_A13
CPU_A14
CPU_A17
CPU_A18
CPU_A19
CPU_A20
CPU_A15
SAN_27M_CLKO
XCPU_BS
XSAN_RST_OUT
SAN_27M_CLKO
XCPU_BS
CPU_D10
CPU_D11
CPU_D12
CPU_D13
CPU_D14
CPU_D15
CPU_D09
CPU_D08
CPU_D07
CPU_D06
CPU_D05
CPU_D04
CPU_D03
CPU_D02
CPU_D01
CPU_D01
CPU_D02
CPU_D03
CPU_D04
CPU_D05
CPU_D06
CPU_D07
CPU_D08
CPU_D09
CPU_D10
CPU_D11
CPU_D12
CPU_D13
CPU_D14
CPU_D15
DSP_DQ00
DSP_DQ01
DSP_DQ02
DSP_DQ03
DSP_DQ04
DSP_DQ05
DSP_DQ07
DSP_DQ08
DSP_DQ09
DSP_DQ10
DSP_DQ12
DSP_DQ13
DSP_DQ15
DSP_DQ06
DSP_DQ14
DSP_AQ02
DSP_AQ04
DSP_AQ05
DSP_AQ07
DSP_AQ08
DSP_AQ10
DSP_QBA0
DSP_DQ00
DSP_DQ11
DSP_AQ00
DSP_AQ02
DSP_AQ10
DSP_AQ11
DSP_AQ01
DSP_DQ12
DSP_DQ13
DSP_DQ14
DSP_DQ11
DSP_DQ08
DSP_QBA0
DSP_QBA1
XDSP_QCS0
XDSP_QRAS
XDSP_QCAS
XDSP_QWE
DSP_DQM0
DSP_DQM2
DSP_QCLKE
DSP_QCLK
DSP_DQ09
DSP_DQ10
DSP_DQ07
DSP_DQ06
DSP_DQ05
DSP_DQ04
DSP_DQ03
DSP_DQ15
DSP_AQ00
DSP_AQ01
DSP_AQ03
DSP_AQ06
DSP_AQ09
DSP_QBA1
DSP_DQ01
DSP_DQ02
DSP_DQ16
DSP_DQ17
DSP_DQ19
DSP_DQ22
DSP_DQ25
DSP_DQ28
DSP_DQ30
DSP_DQ31
DSP_DQM0
DSP_DQM1
DSP_DQM3
XDSP_QRAS
DSP_QCLK
DSP_AQ11
INT3
INT3
XCPU_CS4
CPU_D01
CPU_D02
CPU_D03
CPU_D04
CPU_D05
CPU_D06
CPU_D07
CPU_D08
CPU_D09
CPU_D10
CPU_D11
CPU_D12
CPU_D13
CPU_D14
CPU_D15
XCPU_CS4
CPU_A02
CPU_A01
XSAN_RST_OUT
XCPU_WE1
XCPU_RD
CPU_D00
CPU_A01
CPU_A02
CPU_A03
CPU_A04
CPU_A05
CPU_A06
CPU_A07
CPU_A08
CPU_A09
CPU_A10
CPU_A11
CPU_A12
CPU_A13
CPU_A14
CPU_A15
CPU_A16
256Mbit SDRAM
IC203
IC201
BURST FLASH MEMORY
IC202
ONE NAND FLASH MEMORY
(2/8,3/8,
 6/8,7/8)
(3/8,6/8)
(3/8)
XX MARK:NO MOUNT
256Mbit SDRAM, BURST FLASH MEMORY, ONE NAND FLASH MEMORY
SY-150 BOARD(4/8)
TO
(8/8)
H
M
2
3
12
J
9
G
11
E
C
10
K
14
13
6
B
7
I
D
F
15
5
L
8
4
N
16
@05
@10
@11
3.2V
1.8V
3.2V
3.2V
1.8V
Ver. 1.2  2006. 07

Download Sony DSC-H5 Service Manual (Repair Manual)

Here you can view online and download Sony DSC-H5 Service Manual in PDF. DSC-H5 service manual will guide through the process and help you recover, restore, fix, disassemble and repair Sony DSC-H5 Digital Camera. Information contained in service manuals typically includes schematics / circuit diagrams, wiring diagrams, block diagrams, printed wiring boards, exploded views, parts list, disassembly / assembly, pcb.