Read Sony XSP-N1BT Service Manual online
Ref. No.
Part No.
Description
Remark
Ref. No.
Part No.
Description
Remark
XSP-N1BT
63
63
A-2038-966-A MAIN BOARD, COMPLETE (US, CND)
A-2038-967-A MAIN BOARD, COMPLETE (Except US, CND)
********************
7-685-134-19 SCREW +P 2.6X8 TYPE2 NON-SLIT
7-685-794-01 SCREW +PTT 2.6X10 (S)
< CAPACITOR >
* C03
1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
C05
1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C09
1-116-707-11 CERAMIC
CHIP 47uF
20% 10V
C010 1-116-734-11 CERAMIC
CHIP 1uF
20% 16V
C102 1-116-716-11 CERAMIC
CHIP 10uF
10% 16V
C103 1-118-347-11 CERAMIC
CHIP 0.1uF
10% 25V
C111 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C112 1-118-040-11 CERAMIC
CHIP 2.2uF
10% 16V
C301 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C302 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C303 1-112-839-11 ELECT
4700uF 20% 16V
C304 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C305 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C306 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
C307 1-116-734-11 CERAMIC
CHIP 1uF
20% 16V
C308 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C309 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C310 1-118-347-11 CERAMIC
CHIP 0.1uF
10% 25V
C311 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C313 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C314 1-100-966-91 CERAMIC
CHIP 10uF
20% 10V
C315 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C316 1-116-734-11 CERAMIC
CHIP 1uF
20% 16V
C317 1-116-734-11 CERAMIC
CHIP 1uF
20% 16V
C318 1-116-734-11 CERAMIC
CHIP 1uF
20% 16V
C319 1-116-734-11 CERAMIC
CHIP 1uF
20% 16V
C320 1-116-734-11 CERAMIC
CHIP 1uF
20% 16V
C321 1-116-734-11 CERAMIC
CHIP 1uF
20% 16V
C322 1-116-734-11 CERAMIC
CHIP 1uF
20% 16V
C323 1-116-734-11 CERAMIC
CHIP 1uF
20% 16V
C324 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C325 1-116-734-11 CERAMIC
CHIP 1uF
20% 16V
C326 1-116-734-11 CERAMIC
CHIP 1uF
20% 16V
C328 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C329 1-118-347-11 CERAMIC
CHIP 0.1uF
10% 25V
C330 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C331 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C332 1-118-361-11 CERAMIC
CHIP 0.1uF
10% 50V
C333 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C334 1-128-996-11 ELECT
CHIP 4.7uF
20% 50V
C335 1-128-996-11 ELECT
CHIP 4.7uF
20% 50V
C336 1-128-996-11 ELECT
CHIP 4.7uF
20% 50V
C337 1-128-996-11 ELECT
CHIP 4.7uF
20% 50V
C338 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C339 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C340 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C341 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C342 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C343 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C400 1-116-716-11 CERAMIC
CHIP 10uF
10% 16V
C401 1-128-992-21 ELECT
CHIP 47uF
20% 25V
C402 1-116-734-11 CERAMIC
CHIP 1uF
20% 16V
C404 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C405 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C406 1-124-779-00 ELECT
CHIP 10uF
20% 16V
* C407
1-118-035-11 CERAMIC CHIP 0.1uF
10%
25V
C408 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C409 1-124-779-00 ELECT
CHIP 10uF
20% 16V
C410 1-124-779-00 ELECT
CHIP 10uF
20% 16V
C411 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C412 1-100-966-91 CERAMIC
CHIP 10uF
20% 10V
C413 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C414 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C415 1-116-865-11 CERAMIC
CHIP 10uF
10% 25V
C416 1-124-779-00 ELECT
CHIP 10uF
20% 16V
C417 1-116-728-11 CERAMIC
CHIP 2.2uF
10% 10V
C418 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
C419 1-162-923-11 CERAMIC
CHIP 47PF
5% 50V
* C420
1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
(US, CND)
(US, CND)
* C421
1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
(US, CND)
(US, CND)
* C422
1-116-738-11 CERAMIC CHIP 1uF
10%
6.3V
(US, CND)
(US, CND)
C423 1-118-389-11 CERAMIC
CHIP 0.022uF 10% 25V
C424 1-118-389-11 CERAMIC
CHIP 0.022uF 10% 25V
C425 1-116-728-11 CERAMIC
CHIP 2.2uF
10% 10V
C441 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C442 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C443 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C444 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C445 1-164-866-11 CERAMIC
CHIP 47PF
5% 50V
C501 1-165-492-21 ELECT
CHIP 100uF 20% 10V
C502 1-165-492-21 ELECT
CHIP 100uF 20% 10V
C505 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C506 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C507 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C508 1-118-290-11 CERAMIC
CHIP 0.001uF 10% 50V
C509 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C510 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C511 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C512 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C515 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C516 1-165-908-11 CERAMIC
CHIP 1uF
10% 10V
C517 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C518 1-164-847-11 CERAMIC
CHIP 7PF
0.5PF 50V
C519 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C520 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C521 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C522 1-164-848-11 CERAMIC
CHIP 8PF
0.5PF 50V
C523 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C524 1-164-850-11 CERAMIC
CHIP 10PF
0.5PF 50V
C525 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C526 1-116-711-11 CERAMIC
CHIP 22uF
20% 16V
C527 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C528 1-164-850-11 CERAMIC
CHIP 10PF
0.5PF 50V
C529 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C530 1-116-711-11 CERAMIC
CHIP 22uF
20% 16V
C531 1-164-854-11 CERAMIC
CHIP 15PF
5% 50V
C532 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
C533 1-164-854-11 CERAMIC
CHIP 15PF
5% 50V
C534 1-116-711-11 CERAMIC
CHIP 22uF
20% 16V
C535 1-118-386-11 CERAMIC
CHIP 0.1uF
10% 16V
Note: When the complete MAIN board is replaced, it is necessary to replace cover button SV assy simultaneously. Also, the destination setting, Bluetooth
operation check and Bluetooth information writing is necessary. Refer to “DESTINATION SETTING METHOD” on page 4, “BLUETOOTH FUNC-
TION CHECKING METHOD USING A CELLULAR PHONE” on page 7 and “BLUETOOTH INFORMATION WRITING METHOD” on page 8.
TION CHECKING METHOD USING A CELLULAR PHONE” on page 7 and “BLUETOOTH INFORMATION WRITING METHOD” on page 8.
MAIN
Ver. 1.2
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