Read Sony XSP-N1BT Service Manual online
SERVICE MANUAL
Sony Corporation
Published by Sony Techno Create Corporation
XSP-N1BT
SPECIFICATIONS
9-893-988-03
2014L33-1
©
2014.12
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Ver. 1.2 2014.12
Model Name Using Similar Mechanism
MEX-N5000BE/N5000BT/N5050BT/
N5070BT
N5070BT
Mechanism Type
MG-101CF-188
Optical Pick-up Name
DAX-25A
• The tuner and CD sections have no adjustments.
SMARTPHONE CRADLE RECEIVER
The service manual of the mechanism deck, used in
this model, has been issued in a separate volume.
Please refer to the service manual of the MG-101
series for the mechanism deck information.
this model, has been issued in a separate volume.
Please refer to the service manual of the MG-101
series for the mechanism deck information.
FOR THE CUSTOMERS IN THE USA. NOT
(US and Canadian models only)
APPLICABLE IN CANADA, INCLUDING IN THE
PROVINCE OF QUEBEC.
PROVINCE OF QUEBEC.
POUR LES CLIENTS AUX ÉTATS-UNIS. NON
APPLICABLE AU CANADA, Y COMPRIS LA
PROVINCE DE QUÉBEC.
APPLICABLE AU CANADA, Y COMPRIS LA
PROVINCE DE QUÉBEC.
AUDIO POWER SPECIFICATIONS
(US and Canadian models only)
CEA2006 Standard
Power Output: 17 Watts RMS × 4 at 4
Ohms < 1% THD+N
SN Ratio: 80 dBA
(reference: 1 Watt into 4 Ohms)
Power Output: 17 Watts RMS × 4 at 4
Ohms < 1% THD+N
SN Ratio: 80 dBA
(reference: 1 Watt into 4 Ohms)
Tuner section
(US and Canadian models)
(US and Canadian models)
FM
Tuning range: 87.5 – 107.9 MHz
Antenna (aerial) terminal:
Tuning range: 87.5 – 107.9 MHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 25 kHz
Usable sensitivity: 8 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 80 dB (stereo)
Separation: 50 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
Usable sensitivity: 8 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 80 dB (stereo)
Separation: 50 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
AM
Tuning range: 530 – 1,710 kHz
Antenna (aerial) terminal:
Tuning range: 530 – 1,710 kHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency:
9,115 kHz or 9,125 kHz/5 kHz
Sensitivity: 26 μV
CD Player section
Signal-to-noise ratio: 120 dB
Frequency response: 10 – 20,000 Hz
Wow and flutter: Below measurable limit
Corresponding codec: MP3 (.mp3) and WMA (.wma)
Frequency response: 10 – 20,000 Hz
Wow and flutter: Below measurable limit
Corresponding codec: MP3 (.mp3) and WMA (.wma)
USB Player section
Interface: USB (High-speed)
Maximum current: 1 A
Maximum current: 1 A
1.5 A (When [CHARGE] is set
to [CHARGE HIGH])
to [CHARGE HIGH])
The maximum number of recognizable tracks:
10,000
Corresponding codec:
MP3 (.mp3), WMA (.wma) and WAV (.wav)
(AEP and UK models)
FM
Tuning range: 87.5 – 108.0 MHz
Antenna (aerial) terminal:
Tuning range: 87.5 – 108.0 MHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 25 kHz
Usable sensitivity: 8 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 80 dB (stereo)
Separation: 50 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
Usable sensitivity: 8 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 80 dB (stereo)
Separation: 50 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
MW/LW
Tuning range:
Tuning range:
MW: 531 – 1,602 kHz
LW: 153 – 279 kHz
LW: 153 – 279 kHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency:
9,124.5 kHz or 9,115.5 kHz/4.5 kHz
Sensitivity: MW: 26 μV, LW: 45 μV
(Russian model)
FM
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 25 kHz
Usable sensitivity: 8 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 80 dB (stereo)
Separation: 50 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
FM1/FM2: 87.5 – 108.0 MHz
(at 50 kHz step)
FM3: 65 – 74 MHz (at 30kHz step)
Tuning range:
MW/LW
Tuning range:
MW: 531 – 1,602 kHz
LW: 153 – 279 kHz
LW: 153 – 279 kHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency:
Sensitivity: MW: 26 μV, LW: 45 μV
9,124.5 kHz or 9,115.5 kHz/4.5 kHz
(E, Indian and Australian models)
(Saudi Arabia model)
FM
Tuning range:
Tuning range:
87.5 – 108.0 MHz (at 50 kHz step)
87.5 – 108.0 MHz (at 100 kHz step)
87.5 – 107.9 MHz (at 200 kHz step)
87.5 – 108.0 MHz (at 100 kHz step)
87.5 – 107.9 MHz (at 200 kHz step)
FM tuning step:
50 kHz/100 kHz/200 kHz switchable
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 25 kHz
Usable sensitivity: 8 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 80 dB (stereo)
Separation: 50 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
Usable sensitivity: 8 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 80 dB (stereo)
Separation: 50 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
AM
Tuning range:
Tuning range:
531 – 1,602 kHz (at 9 kHz step)
530 – 1,710 kHz (at 10 kHz step)
530 – 1,710 kHz (at 10 kHz step)
AM tuning step:
9 kHz/10 kHz switchable
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency:
9,124.5 kHz or 9,115.5 kHz/4.5 kHz (at 9 kHz step)
9,115 kHz or 9,125 kHz/5 kHz (at 10 kHz step)
9,115 kHz or 9,125 kHz/5 kHz (at 10 kHz step)
Sensitivity: 26 μV
FM
Tuning range: 87.5 – 108.0 MHz
Antenna (aerial) terminal:
Tuning range: 87.5 – 108.0 MHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency: 25 kHz
Usable sensitivity: 8 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 80 dB (stereo)
Separation: 50 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
Usable sensitivity: 8 dBf
Selectivity: 75 dB at 400 kHz
Signal-to-noise ratio: 80 dB (stereo)
Separation: 50 dB at 1 kHz
Frequency response: 20 – 15,000 Hz
AM
Tuning range: 531 – 1,602 kHz
Antenna (aerial) terminal:
Tuning range: 531 – 1,602 kHz
Antenna (aerial) terminal:
External antenna (aerial) connector
Intermediate frequency:
9,124.5 kHz or 9,115.5 kHz/4.5 kHz
Sensitivity: 26 μV
– Continued on next page –
XSP-N1BT
2
NOTES ON CHIP COMPONENT REPLACEMENT
•
•
Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be dam-
aged by heat.
aged by heat.
FLEXIBLE CIRCUIT BOARD REPAIRING
•
•
Keep the temperature of soldering iron around 270 °C during
repairing.
repairing.
•
Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
circuit board (within 3 times).
•
Be careful not to apply force on the conductor when soldering
or unsoldering.
or unsoldering.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
Use of controls or adjustments or performance of procedures
other than those specifi ed herein may result in hazardous radia-
tion exposure.
CAUTION (US and Canadian models only)
The use of optical instruments with this product will
increase eye hazard.
The use of optical instruments with this product will
increase eye hazard.
SAFETY-RELATED COMPONENT WARNING!
COMPONENTS IDENTIFIED BY MARK
0 OR DOTTED LINE
WITH MARK
0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS
REPLACE THESE COMPONENTS WITH SONY PARTS
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE
0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE FONC-
TIONNEMENT. NE REMPLACER CES COMPOSANTS QUE
PAR DES PIÈCES SONY DONT LES NUMÉROS SONT DON-
NÉS DANS CE MANUEL OU DANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
Power amplifier section
Output: Speaker outputs
Speaker impedance: 4 – 8 ohms
Maximum power output: 55 W × 4 (at 4 ohms)
Speaker impedance: 4 – 8 ohms
Maximum power output: 55 W × 4 (at 4 ohms)
General
Outputs:
Audio outputs terminal (front, rear, sub)
Power antenna (aerial)/Power amplifier control
Power antenna (aerial)/Power amplifier control
terminal (REM OUT)
Magnetic charging connector
Inputs:
SiriusXM input terminal (US and Canadian models only)
Remote controller input terminal
Antenna (aerial) input terminal
MIC input terminal
USB port
Remote controller input terminal
Antenna (aerial) input terminal
MIC input terminal
USB port
Power requirements: 12 V DC car battery (negative
ground (earth))
Dimensions:
Approx. 178 mm × 100 mm × 177 mm
(7
(7
1
/
8
in × 4 in × 7 in) (w/h/d)
Mounting dimensions:
Approx. 182 mm × 111 mm × 160 mm
(7
(7
1
/
4
in × 4
3
/
8
in × 6
3
/
8
in) (w/h/d)
Mass: Approx. 1.4 kg (3 lb 2 oz)
Package contents:
Package contents:
Remote commander (1): RM-X311
Microphone (1)
USB cable (1)
Parts for installation and connections (1 set)
Microphone (1)
USB cable (1)
Parts for installation and connections (1 set)
Design and specifications are subject to change
without notice.
without notice.
Wireless Communication
Communication System:
BLUETOOTH Standard version 3.0
Output:
BLUETOOTH Standard Power Class 2
(Max. +4 dBm)
(Max. +4 dBm)
Maximum communication range:
Line of sight approx. 10 m (33 ft)*
1
Frequency band:
2.4 GHz band (2.4000 – 2.4835 GHz)
Modulation method: FHSS
Compatible BLUETOOTH Profiles*
Compatible BLUETOOTH Profiles*
2
:
A2DP (Advanced Audio Distribution Profile) 1.3
AVRCP (Audio Video Remote Control Profile) 1.5
HFP (Handsfree Profile) 1.6
PBAP (Phone Book Access Profile)
SPP (Serial Port Profile)
MAP (Message Access Profile)
HID (Human Interface Device Profile)
AVRCP (Audio Video Remote Control Profile) 1.5
HFP (Handsfree Profile) 1.6
PBAP (Phone Book Access Profile)
SPP (Serial Port Profile)
MAP (Message Access Profile)
HID (Human Interface Device Profile)
*1 The actual range will vary depending on factors such
as obstacles between devices, magnetic fields
around a microwave oven, static electricity,
reception sensitivity, antenna (aerial)’s performance,
operating system, software application, etc.
around a microwave oven, static electricity,
reception sensitivity, antenna (aerial)’s performance,
operating system, software application, etc.
*2 BLUETOOTH standard profiles indicate the purpose
of BLUETOOTH communication between devices.
SiriusXM Connect Vehicle Tuner and Subscription
sold separately.
www.siriusxm.com
Sirius, XM and all related marks and logos are
trademarks of Sirius XM Radio Inc. All rights
reserved.
sold separately.
www.siriusxm.com
Sirius, XM and all related marks and logos are
trademarks of Sirius XM Radio Inc. All rights
reserved.
The Bluetooth® word mark and logos are registered
trademarks owned by Bluetooth SIG, Inc. and any
use of such marks by Sony Corporation is under
license. Other trademarks and trade names are
those of their respective owners.
trademarks owned by Bluetooth SIG, Inc. and any
use of such marks by Sony Corporation is under
license. Other trademarks and trade names are
those of their respective owners.
The N-Mark is a trademark or registered trademark
of NFC Forum, Inc. in the United States and in other
countries.
of NFC Forum, Inc. in the United States and in other
countries.
Windows Media is either a registered trademark or
trademark of Microsoft Corporation in the United
States and/or other countries.
trademark of Microsoft Corporation in the United
States and/or other countries.
This product is protected by certain intellectual
property rights of Microsoft Corporation. Use or
distribution of such technology outside of this
product is prohibited without a license from
Microsoft or an authorized Microsoft subsidiary.
property rights of Microsoft Corporation. Use or
distribution of such technology outside of this
product is prohibited without a license from
Microsoft or an authorized Microsoft subsidiary.
iPhone, iPod, iPod classic, iPod nano, and iPod
touch are trademarks of Apple Inc., registered in
the U.S. and other countries. App Store is a service
mark of Apple Inc.
touch are trademarks of Apple Inc., registered in
the U.S. and other countries. App Store is a service
mark of Apple Inc.
MPEG Layer-3 audio coding technology and patents
licensed from Fraunhofer IIS and Thomson.
licensed from Fraunhofer IIS and Thomson.
Pandora, the Pandora logo, and the Pandora trade
dress are trademarks or registered trademarks of
Pandora Media, Inc., used with permission.
dress are trademarks or registered trademarks of
Pandora Media, Inc., used with permission.
Google, Google Play and Android are trademarks of
Google Inc.
Google Inc.
BlackBerry® is the property of Research In Motion
Limited and is registered and/or used in the U.S.
and countries around the world. Used under license
from Research In Motion Limited.
Limited and is registered and/or used in the U.S.
and countries around the world. Used under license
from Research In Motion Limited.
Xperia is a trademark or registered trademark of
Sony Mobile Communications AB.
Sony Mobile Communications AB.
Copyrights
XSP-N1BT
3
SECTION 1
SERVICING NOTES
1.
SERVICING NOTES
.............................................
3
2. GENERAL
.................................................................. 13
3. DISASSEMBLY
3-1. Disassembly
Flow
........................................................... 25
3-2. Mini Fuse (Blade Type) (10A/32V) (FU1),
Panel Front Block ........................................................... 25
3-3. Shaft Gear Block ............................................................. 26
3-4. Gear, Shaft Gear .............................................................. 26
3-5. LCD
3-4. Gear, Shaft Gear .............................................................. 26
3-5. LCD
Board
...................................................................... 27
3-6. Lever Detect P ................................................................. 28
3-7. Connector
3-7. Connector
Assy
(CN900)
................................................ 28
3-8. Cover Button Block ........................................................ 29
3-9. KEY Board, Cover Button SV Assy (CB1) .................... 29
3-10. Cover Slider L/R ............................................................. 30
3-11. Slider L/R, Adjuster Plate Assy ...................................... 30
3-12. Chassis Top Block ........................................................... 31
3-13. Slider Popup .................................................................... 31
3-14. CD Mechanism Deck (MG-101CF-188) ........................ 32
3-15. MAIN Board ................................................................... 33
3-16. Antenna BT (BT1) .......................................................... 33
3-9. KEY Board, Cover Button SV Assy (CB1) .................... 29
3-10. Cover Slider L/R ............................................................. 30
3-11. Slider L/R, Adjuster Plate Assy ...................................... 30
3-12. Chassis Top Block ........................................................... 31
3-13. Slider Popup .................................................................... 31
3-14. CD Mechanism Deck (MG-101CF-188) ........................ 32
3-15. MAIN Board ................................................................... 33
3-16. Antenna BT (BT1) .......................................................... 33
4.
TEST MODE
............................................................ 33
5. DIAGRAMS
5-1. Block Diagram - SERVO/BT/USB Section - ................. 34
5-2. Block Diagram - MAIN Section - ................................... 35
5-3. Block
5-2. Block Diagram - MAIN Section - ................................... 35
5-3. Block
Diagram
- PANEL/POWER SUPPLY Section - ............................ 36
5-4. Printed Wiring Boards - MAIN Section (1/2) - .............. 38
5-5. Printed Wiring Board - MAIN Section (2/2) - ................ 39
5-6. Schematic Diagram - MAIN Section (1/4) - ................... 40
5-7. Schematic Diagram - MAIN Section (2/4) - ................... 41
5-8. Schematic Diagram - MAIN Section (3/4) - ................... 42
5-9. Schematic Diagram - MAIN Section (4/4) - ................... 43
5-10. Printed Wiring Board - PANEL Section (1/2) - .............. 44
5-11. Printed Wiring Boards - PANEL Section (2/2) - ............. 45
5-12. Schematic Diagram - PANEL Section - .......................... 46
5-5. Printed Wiring Board - MAIN Section (2/2) - ................ 39
5-6. Schematic Diagram - MAIN Section (1/4) - ................... 40
5-7. Schematic Diagram - MAIN Section (2/4) - ................... 41
5-8. Schematic Diagram - MAIN Section (3/4) - ................... 42
5-9. Schematic Diagram - MAIN Section (4/4) - ................... 43
5-10. Printed Wiring Board - PANEL Section (1/2) - .............. 44
5-11. Printed Wiring Boards - PANEL Section (2/2) - ............. 45
5-12. Schematic Diagram - PANEL Section - .......................... 46
6.
EXPLODED VIEWS
6-1. Chassis
Top
Section
........................................................ 58
6-2. LCD Board Section ......................................................... 59
6-3. Panel Front Section ......................................................... 60
6-4. Chassis Bottom Section .................................................. 61
6-3. Panel Front Section ......................................................... 60
6-4. Chassis Bottom Section .................................................. 61
7.
ELECTRICAL PARTS LIST
.............................. 62
Accessories are given in the last of the electrical parts list.
TABLE OF CONTENTS
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
BLOCK OR BASE UNIT
The laser diode in the optical pick-up block may suffer electro-
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
static break-down because of the potential difference generated by
the charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The fl exible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
Never look into the laser diode emission from right above when
checking it for adjustment. It is feared that you will lose your sight.
If the optical pick-up block is defective, please replace the whole
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical
pick-up block.
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical
pick-up block.
optical pick-up
semi-fixed resistor
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong
viscosity
Unleaded solder is more viscous (sticky, less prone to fl ow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
•
Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
also be added to ordinary solder.
XSP-N1BT
4
DESTINATION SETTING METHOD
When the complete MAIN board or IC502 on the MAIN board is
replaced, the destination setting is necessary.
When the complete MAIN board or IC502 on the MAIN board is
replaced, the destination setting is necessary.
1. Destination
Setting
Set destination according to the procedure below.
1-1. Setting the Destination Code
1. In the state of source off (the clock is displayed), enter the
1. In the state of source off (the clock is displayed), enter the
test mode by pressing the buttons on the remote commander in
order of the [4
order of the [4
]
t [5 MIC/
EC/NC]
t [6 PAUSE] (press
only the [6 PAUSE] button for two seconds).
2. In the state in which the software main version is displayed on
the liquid crystal display (refer to following fi gure), enter the
destination setting mode by pressing the buttons on the remote
commander in order of the [
destination setting mode by pressing the buttons on the remote
commander in order of the [
>
b] t [B
.
]
t [ENTER].
(Displayed characters/values in the following fi gure are ex-
ample)
ample)
Software main version
3. Input the alphanumeric character of 12 digits of “F XXXXXX”
displayed on the liquid crystal display, and execute the destina-
tion setting.
tion setting.
Note: Refer to following “1-3. Entering the Destination Code” for opera-
tion method.
4. The resetting operation is executed by pressing the [SRC
OFF] button for 1 second after the setting ends, and the unit
returns to the normal condition.
returns to the normal condition.
1-2. Display in Destination Setting Mode
(Displayed characters/values in the following fi gure are example)
(Displayed characters/values in the following fi gure are example)
12 digits
OP5 OP4 OP3 OP2 OP1 OP0
Destination code
1-3. Entering the Destination Code
•
•
Method of operation by remote commander
1. Press the [
V +] or [– v] button, and select the alphanumeric
character of “0 to F”.
2. The digit advances by pressing the [
>
b] button.
The digit returns by pressing the [
B
.
] button.
3. The setting is completed by pressing the [ENTER] button, and
the initialization operation is done.
1-4. Destination Code
Destination
OP5
OP4
OP3
OP2
OP1
OP0
US, Canadian
7
0
4
2
1
2
AEP, UK
3
0
4
0
2
1
Russian
3
1
4
0
3
7
E
3
4
5
0
4
0
Saudi Arabia
3
4
5
0
7
5
Indian
3
4
6
0
5
0
Australian
7
4
4
0
6
0
2. Confi rmation After Destination Setting
Execute the following operation after completing the destination
setting, and confi rm a correct destination was set.
Execute the following operation after completing the destination
setting, and confi rm a correct destination was set.
Destination setting checking method:
1. In the state of source off (the clock is displayed on the liquid
1. In the state of source off (the clock is displayed on the liquid
crystal display), enter the test mode by pressing the buttons on
the remote commander in order of the [4
the remote commander in order of the [4
]
t [5 MIC/
EC/
NC]
t [6 PAUSE] (press only the [6 PAUSE] button for two
seconds).
2. In the state in which the software main version is displayed on
the liquid crystal display (refer to following fi gure), enter the
destination setting value display mode by pressing the [DSPL/
destination setting value display mode by pressing the [DSPL/
SCRL] button twice on the remote commander.
(Displayed characters/values in the following fi gure are ex-
ample)
ample)
Software main version
3. Confi rm the alphanumeric character of 12 digits in liquid crys-
tal display is a value correctly input.
(Displayed characters/values in the following fi gure are ex-
ample)
ample)
12 digits
OP5 OP4 OP3 OP2 OP1 OP0
Destination code
4. The resetting operation is executed by pressing the [SRC
OFF] button for 1 second after the confi rming ends, and the
unit returns to the normal condition.
unit returns to the normal condition.
Ver. 1.1