MEX-BT5100 - Sony Car Audio Service Manual (repair manual)

2007J05-1

© 

2007.10

Model Name Using Similar Mechanism

MEX-BT5000

CD Mechanism Type

MG-611WA-186//Q

Optical Pick-up Name

KSS1000E

– Continued on next page –

US and foreign patents licensed 
from Dolby Laboratories

R

Manufactured under license

from BBE Sound, Inc.

Licensed by BBE Sound, Inc.

under one or more of the following US patents:

5510752, 5736897. BBE and BBE symbol are

registered trademarks of BBE Sound, Inc.

BBE MP (Minimized Polynomial Non-Linear

Saturation) Process improves digitally

compressed sound, such as MP3, by restoring

and enhancing the harmonics lost through

compression. BBE MP works by re-generating

harmonics from the source material, effectively

recovering warmth, details and nuance.

The Bluetooth word mark and logos are owned

by the Bluetooth SIG, Inc. and any use of such

marks by Sony Corporation is under license.

Other trademarks and trade names are those of

their respective owners.
SonicStage and its logo are trademarks of Sony

Corporation.

“ATRAC” and its logo are trademarks of Sony

Corporation.

The “SAT Radio Ready”

logo indicates that this

product will control a

satellite radio tuner module

(sold separately). Please see your nearest

authorized Sony dealer for details on the

satellite radio tuner module.

“SAT Radio,” “SAT Radio Ready,” the SAT

Radio and SAT Radio Ready logos and all

related marks are trademarks of Sirius Satellite

Radio Inc. and XM Satellite Radio Inc.

Microsoft, Windows Media, 

and the Windows logo are 

trademarks or registered 

trademarks of Microsoft 

Corporation in the United States and/or other 

countries.

Signal-to-noise ratio: 120 dB

Frequency response: 10 – 20,000 Hz

Wow and flutter: Below measurable limit

Tuning range: 87.5 – 107.9 MHz

Antenna terminal: External antenna connector

Intermediate frequency: 10.7 MHz/450 kHz

Usable sensitivity: 9 dBf

Selectivity: 75 dB at 400 kHz

Signal-to-noise ratio: 67 dB (stereo), 69 dB (mono)

Harmonic distortion at 1 kHz: 0.5 % (stereo),

0.3 % (mono)

Separation: 35 dB at 1 kHz

Frequency response: 30 – 15,000 Hz

Tuning range: 530 – 1,710 kHz

Antenna terminal: External antenna connector

Intermediate frequency: 10.7 MHz/450 kHz

Sensitivity: 30 μV

POWER OUTPUT AND TOTAL HARMONIC 

DISTORTION

23.2 watts per channel minimum continuous

average power into 4 ohms, 4 channels driven

from 20 Hz to 20 kHz with no more than 5% total 

harmonic distortion.

CEA2006 Standard

Power Output: 17 Watts RMS 

× 4 at 

4 Ohms < 1% THD+N

SN Ratio: 82 dBA

(reference: 1 Watt into 4 Ohms)

Tuning range: 87.5 – 108 MHz

Aerial terminal: External aerial connector

Intermediate frequency: 10.7 MHz/450 kHz

Usable sensitivity: 9 dBf

Selectivity: 75 dB at 400 kHz

Signal-to-noise ratio: 67 dB (stereo), 69 dB (mono)

Harmonic distortion at 1 kHz: 0.5 % (stereo),

0.3 % (mono)

Separation: 35 dB at 1 kHz

Frequency response: 30 – 15,000 Hz

MW: 531 – 1,602 kHz

LW: 153 – 279 kHz

Aerial terminal: External aerial connector

Intermediate frequency: 10.7 MHz/450 kHz

Sensitivity: MW: 30 μV, LW: 40 μV

87.5 – 108.0 MHz (at 50 kHz step)

87.5 – 107.9 MHz (at 200 kHz step)

FM tuning interval: 50 kHz/200 kHz switchable

Aerial terminal: External aerial connector

Intermediate frequency: 10.7 MHz/450 kHz

Usable sensitivity: 9 dBf

Selectivity: 75 dB at 400 kHz

Signal-to-noise ratio: 67 dB (stereo), 69 dB (mono)

Harmonic distortion at 1 kHz: 0.5 % (stereo),

0.3 % (mono)

Separation: 35 dB at 1 kHz

Frequency response: 30 – 15,000 Hz

531 – 1,602 kHz (at 9 kHz step)

530 – 1,710 kHz (at 10 kHz step)

AM tuning interval: 9 kHz/10 kHz switchable

Aerial terminal: External aerial connector

Intermediate frequency: 10.7 MHz/450 kHz

Sensitivity: 30 μV

The “HD Radio Ready” logo indicates that this 
product will control a Sony HD Radio

TM

 tuner 

(sold separately).
For HD Radio

TM

 tuner operation, please refer to 

the HD Radio

TM

 tuner Operating Instructions.

The HD Radio Ready logo is a registered 
trademark of iBiquity.

HD Radio

TM

 is a trademark of iBiquity Digital 

Corp.

CAUTION
Use of controls or adjustments or performance of procedures other than 
those specifi ed herein may result in hazardous radiation exposure.

Bluetooth Standard version 2.0

Bluetooth Standard Power Class 2 (Max. +4 dBm)

Line of sight approx. 10 m (32.8 ft)*

1

2.4 GHz band (2.4000 – 2.4835 GHz)

Modulation method: FHSS

Compatible Bluetooth Profiles*

2

A2DP (Advanced Audio Distribution Profile)

AVRCP (Audio Video Remote Control Profile)

HFP (Handsfree Profile)

OPP (Object Push Profile)

*1 The actual range will vary depending on factors

*2 Bluetooth standard profiles indicate the purpose of

Outputs: Speaker outputs (sure seal connectors)

Speaker impedance: 4 – 8 ohms

Maximum power output: 52 W

× 4 (at 4 ohms)

Audio outputs terminal (front/rear)

Subwoofer output terminal (mono)

Power antenna relay control terminal

Power amplifier control terminal

Telephone ATT control terminal

Illumination control terminal

BUS control input terminal

BUS audio input/AUX IN terminal

Remote controller input terminal

Antenna input terminal

Low: ±10 dB at 60 Hz or 100 Hz (XPLOD)

Mid: ±10 dB at 500 Hz or 1 kHz (XPLOD)

High: ±10 dB at 10 kHz or 12.5 kHz (XPLOD)

Power requirements: 12 V DC car battery

(negative ground)

Dimensions: Approx. 178

× 50 × 183 mm

(7

1

/

8

× 2 × 7

1

/

4

in) (w/h/d)

Mounting dimensions: Approx. 182

× 53 × 162 mm

(7

1

/

4

× 2

1

/

8

× 6

1

/

2

in) (w/h/d)

Mass: Approx. 1.2 kg (2 lb 11 oz)

Card remote commander: RM-X301 (US, Canadian)

Card remote commander: RM-X302 (AEP, UK)

Card remote commander: RM-X303 (E)
Parts for installation and connections (1 set)

Your dealer may not handle some of the above listed
accessories. Please ask the dealer for detailed
information.

MPEG Layer-3 audio coding technology and 

patents licensed from Fraunhofer IIS and Thomson.

Notes on chip component replacement
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

Flexible Circuit Board Repairing
•  Keep the temperature of soldering iron around 270 °C during 

repairing.

•  Do not touch the soldering iron on the same conductor of the 

circuit board (within 3 times).

•  Be careful not to apply force on the conductor when soldering 

or unsoldering.

COMPONENTS  IDENTIFIED  BY  MARK 0 OR  DOTTED  LINE  
WITH  MARK 0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

LES  COMPOSANTS  IDENTIFIÉS  PAR  UNE  MARQUE  0 SUR  
LES  DIAGRAMMES  SCHÉMATIQUES  ET  LA  LISTE  DES  
PIÈCES  SONT  CRITIQUES  POUR  LA  SÉCURITÉ  DE  FONC-
TIONNEMENT.  NE  REMPLACER  CES  COM-  POSANTS  QUE  
PAR  DES  PIÈCES  SONY  DONT  LES  NUMÉROS  SONT  DON-
NÉS  DANS  CE  MANUEL  OU  DANS  LES  SUPPLÉMENTS  
PUBLIÉS  PAR  SONY.

This label is located on the bottom of the

• AEP, UK, E model

chassis.

CAUTION – CLASS 1M INVISIBLE LASER RADIATION 

WHEN OPEN.

DO NOT VIEW DIRECTLY WITH OPTICAL INSTRUMENTS.

  .............................................   4

  ..................................................................   6

3-1. Disassembly 

Flow 

 

..........................................................  13

3-2.  Front Back Panel Assy  ...................................................   13
3-3. KEY 

Board 

......................................................................  14

3-4.  Sub Panel Assy  ...............................................................   14
3-5.  CD Mechanism Block (MG-611WA-186//Q)  ................   15
3-6.  MAIN Board  ..................................................................   15
3-7.  ANTENNA Board, IT Board ..........................................   16
3-8.  Chassis (T) SUB Assy  ....................................................   16
3-9. Roller 

Arm 

Assy 

..............................................................  17

3-10. Chassis (OP) Assy ...........................................................   17
3-11.  Optical Pick-up (KSS1000E) ..........................................   18
3-12.  SL Motor Assy (Sled) (M902) ........................................   18
3-13.  LE Motor Assy (B) (Loading) (M903) ...........................   19
3-14. SERVO Board .................................................................   19

TEST  MODE 

 ............................................................   20

5-1.  Block Diagram - CD SERVO Section - ..........................   21
5-2.  Block Diagram - BLUETOOTH Section - .....................   22
5-3.  Block Diagram - AUDIO Section - .................................   23
5-4.  Block Diagram - DISPLAY/MAIN Section - .................   24
5-5.  Block Diagram - POWER SUPPLY Section - ................   25
5-6.  Printed Wiring Boards - SERVO Section - .....................   27
5-7.  Schematic Diagram - SERVO Section (1/2) - .................   28
5-8.  Schematic Diagram - SERVO Section (2/2) - .................   29
5-9.  Schematic Diagram - BLUETOOTH Section (1/2) - .....   30
5-10.  Schematic Diagram - BLUETOOTH Section (2/2) - .....   31
5-11.  Printed Wiring Boards - BLUETOOTH Section - ..........   32
5-12.  Schematic Diagram - MAIN Board (1/3) - .....................   33
5-13.  Schematic Diagram - MAIN Board (2/3) - .....................   34
5-14.  Schematic Diagram - MAIN Board (3/3) - .....................   35
5-15. Printed Wiring Board 
 

- MAIN Board (Component Side) - ................................   36

5-16. Printed Wiring Board 
 

- MAIN Board (Conductor Side) - ..................................   37

5-17.  Printed Wiring Board - SUB Board - ..............................   38
5-18.  Schematic Diagram - SUB Board - .................................   39
5-19.  Schematic Diagram - KEY Board (1/2) -........................   40
5-20.  Schematic Diagram - KEY Board (2/2) -........................   41
5-21.  Printed Wiring Board - KEY Board -..............................   42

6-1. Overall 

Section 

 

..............................................................  61

6-2.  Front Panel Section  ........................................................   62
6-3.  CD Mechanism Deck Section-1 
 (MG-611WA-186//Q) 

.....................................................  

63

6-4.  CD Mechanism Deck Section-2 
 (MG-611WA-186//Q) 

.....................................................  

64

6-5.  CD Mechanism Deck Section-3 
 (MG-611WA-186//Q) 

.....................................................  

65

6-6.  CD Mechanism Deck Section-4 
 (MG-611WA-186//Q) 

.....................................................  

66

  ..............................   67

The laser diode in the optical pick-up block may suffer electrostat-
ic break-down because of the potential difference generated by the 
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also 
use the procedure in the printed matter which is included in the 
repair parts.
The fl exible board is easily damaged and should be handled with 
care.

NOTES  ON  LASER  DIODE  EMISSION  CHECK
Never look into the laser diode emission from right above when 
checking it for adjustment. It is feared that you will lose your 
sight.

If the optical pick-up block is defective, please replace the whole 
optical pick-up block.
Never turn the semi-fi xed resistor located at the side of optical 
pick-up block.

EXTENSION  CABLE  AND  SERVICE  POSITION
When repairing or servicing this set, connect the jig (extension 
cable) as shown below.

•  Connect the MAIN board (CNP501) and the SERVO board 

(CN2) with the extension cable (Part No. J-2502-076-1).

NOTE  THE  IC500  AND  IC510  ON  THE  IT  BOARD  
REPLACING
When IC500 and IC510 on the IT board are damaged, exchange 
the new IT board for the IT board which IC damaged.

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution:  The printed pattern (copper foil) may peel away if the 

heated tip is applied for too long, so be careful!

• Strong 

viscosity

 

Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•  Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.