CDX-NC9950 - Sony Car Audio Service Manual (repair manual). Page 4

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4
CDX-NC9950
TABLE OF CONTENTS
1. GENERAL
Location of Controls ................................................................ 5
Connections ............................................................................. 5
2. DISASSEMBLY
2-1.   Front Panel Assy ................................................................. 8
2-2.   Sub Panel Assy .................................................................... 8
2-3.   CD Mechanism Block ......................................................... 9
2-4.   Driving Section ................................................................... 9
2-5.   Driven (F) Assy, Inverted (F) Assy .................................... 10
2-6.   Digital Board ..................................................................... 10
2-7.   Main Board ....................................................................... 11
2-8.   Chassis (T) Sub Assy ........................................................ 11
2-9.   Roller Arm Assy ................................................................ 12
2-10. Chassis (OP) Assy ............................................................. 12
2-11. Optical Pick-up ................................................................. 13
2-12. SL Motor Assy (M902) ..................................................... 13
2-13. LE Motor Assy (M903) ..................................................... 14
2-14. Servo Board ....................................................................... 14
3. DIAGRAMS
3-1.   Block Diagram –CD Section– ........................................... 15
3-2.   Block Diagram –Main Section– ........................................ 16
3-3.   Block Diagram –Display Section– .................................... 17
3-4.   Circuit Boards Location .................................................... 18
3-5.   Printed Wiring Boards –CD Mechanism Section– ............ 19
3-6.   Schematic Diagram –CD Mechanism Section (1/2)– ....... 20
3-7.   Schematic Diagram –CD Mechanism Section (2/2)– ....... 21
3-8.   Printed Wiring Boards –Main Section– ............................ 22
3-9.   Schematic Diagram –Main Section (1/4)– ........................ 24
3-10. Schematic Diagram –Main Section (2/4)– ........................ 25
3-11. Schematic Diagram –Main Section (3/4)– ........................ 26
3-12. Schematic Diagram –Main Section (4/4)– ........................ 27
3-13. Schematic Diagram –Display Section– ............................. 28
3-14. Printed Wiring Board –Display Section– .......................... 29
4. EXPLODED VIEWS
4-1.   Chassis Section ................................................................. 40
4-2.   Main Board Section .......................................................... 41
4-3.   Front Panel Section ........................................................... 42
4-4.   CD Mechanism Section (1) ............................................... 43
4-5.   CD Mechanism Section (2) ............................................... 44
4-6.   CD Mechanism Section (3) ............................................... 45
4-7.   CD Mechanism Section (4) ............................................... 46
5. ELECTRICAL PARTS LIST
........................................ 47
z
 UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
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