CDX-GT517EE - Sony Car Audio Service Manual (repair manual). Page 3

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Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size.)

Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40

°C higher than

ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350

°C.

Caution: The printed pattern (copper foil) may peel away if the

heated tip is applied for too long, so be careful!

• Strong viscosity

Unleaded solder is more viscous (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

• Usable with ordinary solder

It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.

You can play CD-DA (also containing CD TEXT*) and CD-R/
CD-RW (MP3/WMA/AAC files also containing Multi Session)
and ATRAC CD (ATRAC3 and ATRAC3plus format).

Type of discs

Label on the disc

CD-DA

MP3

WMA

AAC

ATRAC CD

* A CD TEXT disc is a CD-DA that includes information such as disc,

artist and track name.

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4

Location of Controls ........................................................

5

Connections .....................................................................

5

3-1.

Sub Panel Assy ................................................................

8

3-2.

CD Mechanism Block .....................................................

8

3-3.

Main Board ......................................................................

9

3-4.

Servo Board .....................................................................

9

3-5.

Chassis (T) Sub Assy ....................................................... 10

3-6.

Roller Arm Assy .............................................................. 10

3-7.

Chassis (OP) Assy ........................................................... 11

........................................ 12

5-1.

Block Diagram –Main Section– ...................................... 15

5-2.

Block Diagram –Display Section– .................................. 16

5-3.

Printed Wiring Board –Main Section– ............................ 17

5-4.

Schematic Diagram –Main Section (1/3)– ...................... 18

5-5.

Schematic Diagram –Main Section (2/3)– ...................... 19

5-6.

Schematic Diagram –Main Section (3/3)– ...................... 20

5-7.

Printed Wiring Board –Sub Section– .............................. 21

5-8.

Schematic Diagram –Sub Section– ................................. 22

5-9.

Printed Wiring Board –Key Section– .............................. 23

5-10. Schematic Diagram –Key Section– ................................. 24

6-1.

Main Section .................................................................... 30

6-2.

Front Panel Section ......................................................... 31

6-3.

CD Mechanism Section (MG-101FA-188//Q) ................ 32

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