TAV-L1 - Sony Audio Service Manual (repair manual). Page 5

5

8-1.

Grille Frame, Center Cover Section ............................... 170

8-2.

Back Cover Section ........................................................ 171

8-3.

Rear Cabinet Section ...................................................... 172

8-4.

Front Cover, Top Guide Section ..................................... 173

8-5.

Side Cover, Ornament (TV) Section .............................. 174

8-6.

DVD Block Section ........................................................ 175

8-7.

Front Speaker, MAIN Board Section ............................. 176

8-8.

Base Panel Section ......................................................... 177

8-9.

Bottom Switch Section ................................................... 178

8-10. Chassis (DVD) Section ................................................... 179
8-11. Driving Section ............................................................... 180
8-12. DVD Mechanism Deck Section-1

(CDM86-DVBU101) ...................................................... 181

8-13. DVD Mechanism Deck Section-2

(CDM86-DVBU101) ...................................................... 182

8-14. DVD Mechanism Deck Section-3

(CDM86-DVBU101) ...................................................... 183

8-15. DVD Mechanism Deck Section-4

(CDM86-DVBU101) ...................................................... 184

8-16. LCD Block Section ........................................................ 185
8-17. BE Board, N Board and N1 Board Section .................... 186
8-18. A2E Board, GE2 Board and LINK (CE)

Board Section ................................................................. 187

8-19. Front Cabinet, LCD Section ........................................... 188
8-20. Stand Section .................................................................. 189
8-21. Power Section ................................................................. 190
8-22. Subwoofer Section ......................................................... 191
8-23. Base Cover Section ......................................................... 192

............................. 193

The laser diode in the optical pick-up block may suffer electrostatic
break-down because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic break-down and also
use the procedure in the printed matter which is included in the
repair parts.
The flexible board is easily damaged and should be handled with
care.

The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.

Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.

•

Unleaded solder melts at a temperature about 40 

°

C higher

than ordinary solder.

Ordinary soldering irons can be used but the iron tip has to be

applied to the solder joint for a slightly longer time.

Soldering irons using a temperature regulator should be set to

about 350 

°

C.

Caution: The printed pattern (copper foil) may peel away if

the heated tip is applied for too long, so be careful!

•

Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)

than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.

•

Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may

also be added to ordinary solder.