STR-KM3500 - Sony Audio Service Manual (repair manual). Page 2

  .............................................   2

2-1.   Disassembly Flow  ..........................................................   3
2-2.   Case .................................................................................   3
2-3.   Back Panel Section .........................................................   4
2-4.   Front Panel Section  ........................................................   4
2-5.   Main Board Section ........................................................   5
2-6.   Main Board, Temp-Sensor Board ...................................   5

TEST  MODE 

 ............................................................   6

ELECTRICAL  CHECK 

 .........................................   7

5-1.  Block Diagram - MAIN Section - ...................................   9
5-2.  Block Diagram - AMP Section - .....................................   10
5-3.  Block Diagram - POWER SUPPLY AND 
 

DISPLAY Section - .........................................................   11

5-4.  Printed Wiring Board - MAIN Board - ...........................   13
5-5.  Schematic Diagram - MAIN Board (1/3) - .....................   14
5-6.  Schematic Diagram - MAIN Board (2/3) - .....................   15
5-7.  Schematic Diagram - MAIN Board (3/3) - .....................   16
5-8. Printed 

Wiring 

Board 

 

- DIGITAL Board (Component Side) - ...........................   17

5-9. Printed 

Wiring 

Board 

 

- DIGITAL Board (Conductor Side) - .............................   18

5-10.  Schematic Diagram - DIGITAL Board (1/3) - ................   19
5-11.  Schematic Diagram - DIGITAL Board (2/3) - ................   20
5-12.  Schematic Diagram - DIGITAL Board (3/3) - ................   21
5-13. Printed Wiring Boards 
 

- DISPLAY AND POWER KEY ....................................   22

5-14.  Schematic Diagram - DISPLAY AND POWER KEY 
 Board 

- 

............................................................................  

23

5-15. Printed Wiring Boards 
 

- AC SELECT AND HEADPHONE Board....................   24

5-16.  Schematic Diagram - AC SELECT AND 
 

HEADPHONE Board - ...................................................   24

5-17.  Printed Wiring Board - VIDEO STANDBY Board  .......   25
5-18.  Schematic Diagram - VIDEO STANDBY Board - .........   26
5-19.  Printed Wiring Board - CONNECTION AND 
 

TEMP-SENSOR Board - ................................................   27

5-20.  Schematic Diagram - CONNECTION AND 
 TEMP-SENSOR 

Board- 

.................................................  

27

6-1.  Front Panel Section .........................................................   37
6-2.  Back Panel Section .........................................................   38
6-3. Main 

Section 

...................................................................  39

  ..............................   40

COMPONENTS  IDENTIFIED  BY  MARK 0 OR  DOTTED  LINE  
WITH  MARK 0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•   Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution:  The printed pattern (copper foil) may peel away if the 

heated tip is applied for too long, so be careful!

•   Strong viscosity
 

Unleaded solder is more viscou-s (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•   Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

Notes on chip component replacement
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be da-
 

maged by heat.

AR

4-265-328-1[]

TH

4-265-328-2[]

E51

4-265-328-3[]

MX

4-265-328-4[]

SAF

4-265-328-5[]

SP

4-265-328-7[]

• Abbreviation
 AR  : 

Argentina

  E51 

: Chilean and Peruvian models

 MX  : 

Mexican

 SAF  : 

South 

African

 SP  : 

Singapore

 TH  : 

Thai