STR-KM3500 - Sony Audio Service Manual (repair manual)

2011F08-1

© 

2011.06

•  STR-KM3500 is the receiver section in HT-DDW3500.

This receiver incorporates Dolby* Digital and Pro Logic Surround and the DTS** Digital Surround System.
*   Manufactured under license from Dolby Laboratories. Dolby, Pro Logic, and the double- D symbol are tradmarks    
 

of Dolby Laboratories.

** Manufactured under license under U.S. Patent #’s: 5,451,942; 5,956,674; 5,974,380; 5,978,762; 6,487,535 & other 
 

U.S. and worldwide patents issued & pending. DTS and the Symbol are registered trademarks & DTS Digital 

 

Surround and the DTS logos are trademarks of DTS, Inc. Product includes software. © DTS, Inc. All Rights Reserved.

“PlayStation” is a registered trademark of Sony Computer Entertainment Inc.

Amplifi er section
Power Output
Stereo mode (rated) (6 ohms, 1 kHz, THD 1%)
   

70 W + 70 W

1

)

   

60 W + 60 W

2

)

Surround mode

3

) (reference) (6 ohms, 1 kHz,

THD 10%)
  

RMS 

output

FRONT: 

170 W per channel

1

)

   

160 W per channel

2

)

CENTER: 170 

W

1

)

  

160 

W

2

)

SURROUND: 

170 W per channel

1

)

   

160 W per channel

2

)

Surround mode

3

) (reference) (6 ohms,

100 Hz, THD 10%)
SUBWOOFER: 

170 W per channel

1

)

   

160 W per channel

2

)

1)

Measured under the following conditions:

 SAF, SP 

240 V AC, 50 Hz

 MX 

127 V AC, 60 Hz

 AR, TH 

230 V AC, 50 Hz

 E51 

240 V AC, 50 Hz

1)

Measured under the following conditions:

 AR, TH 

220 V AC, 50 Hz

 E51 

120/220/240V

3) 

Reference power output for front, center, 

  surround speakers and subwoofer. Depending  
  on the sound fi eld settings and the source,    
  there may be no sound output.

Inputs
  Analog 

Sensitivity: 800 mV/

  

50 

kohms

  Digital (Coaxial) 

Impedance: 75 ohms

Outputs (Analog)
  AUDIO OUT 

Voltage: 800 mV/

  

1 

kohms

Tone
  Gain levels 

±6 dB, 1 dB step

Reproduction frequency range:
   

28 – 20,000 Hz

FM tuner section
Tuning range 

87.5 – 108.0 MHz

Antenna 

FM wire antenna

Antenna terminals 

75 ohms, unbalanced

Intermediate frequency
  

10.7 

MHz

AM tuner section
Tuning range

10 kHz step  9 kHz step

E51, MX, AR

530 – 

531 –

1,710 kHz 

1,710 kHz

SAF, SP, TH

 

–

 531 

–

  

1,602 

kHz

Antenna Loop 

antenna

Intermediate frequency
  

450 

kHz

General
Power requirements

 SAF, SP 

230 – 240 V AC, 50/60 Hz

 MX 

127 V AC, 60 Hz

 E51 

120/220/240 V AC, 50/60 Hz

 AR, TH 

220 – 230 V AC, 50/60 Hz

Power consumption 

220 W

Power consumption (during standby mode)
  

0.3 W

Dimensions (width/height/depth) including
projecting parts and controls (Approx.)
Receiver 

430 mm × 158 mm ×

  

342 mm

Mass (Approx.) 

7.7 kg

Design and specifi cations are subject to
change without notice.

Halogenated fl ame retardants are not used in
the certain printed wiring boards.

•  Abbreviation
  AR : 

Argentina 

model

  E51 

: Chilean and Peruvian models

  MX 

: Mexican model

  SAF 

: South African model

  SP 

: Singapore model

 TH  : 

Thai 

model

  .............................................   2

2-1.   Disassembly Flow  ..........................................................   3
2-2.   Case .................................................................................   3
2-3.   Back Panel Section .........................................................   4
2-4.   Front Panel Section  ........................................................   4
2-5.   Main Board Section ........................................................   5
2-6.   Main Board, Temp-Sensor Board ...................................   5

TEST  MODE 

 ............................................................   6

ELECTRICAL  CHECK 

 .........................................   7

5-1.  Block Diagram - MAIN Section - ...................................   9
5-2.  Block Diagram - AMP Section - .....................................   10
5-3.  Block Diagram - POWER SUPPLY AND 
 

DISPLAY Section - .........................................................   11

5-4.  Printed Wiring Board - MAIN Board - ...........................   13
5-5.  Schematic Diagram - MAIN Board (1/3) - .....................   14
5-6.  Schematic Diagram - MAIN Board (2/3) - .....................   15
5-7.  Schematic Diagram - MAIN Board (3/3) - .....................   16
5-8. Printed 

Wiring 

Board 

 

- DIGITAL Board (Component Side) - ...........................   17

5-9. Printed 

Wiring 

Board 

 

- DIGITAL Board (Conductor Side) - .............................   18

5-10.  Schematic Diagram - DIGITAL Board (1/3) - ................   19
5-11.  Schematic Diagram - DIGITAL Board (2/3) - ................   20
5-12.  Schematic Diagram - DIGITAL Board (3/3) - ................   21
5-13. Printed Wiring Boards 
 

- DISPLAY AND POWER KEY ....................................   22

5-14.  Schematic Diagram - DISPLAY AND POWER KEY 
 Board 

- 

............................................................................  

23

5-15. Printed Wiring Boards 
 

- AC SELECT AND HEADPHONE Board....................   24

5-16.  Schematic Diagram - AC SELECT AND 
 

HEADPHONE Board - ...................................................   24

5-17.  Printed Wiring Board - VIDEO STANDBY Board  .......   25
5-18.  Schematic Diagram - VIDEO STANDBY Board - .........   26
5-19.  Printed Wiring Board - CONNECTION AND 
 

TEMP-SENSOR Board - ................................................   27

5-20.  Schematic Diagram - CONNECTION AND 
 TEMP-SENSOR 

Board- 

.................................................  

27

6-1.  Front Panel Section .........................................................   37
6-2.  Back Panel Section .........................................................   38
6-3. Main 

Section 

...................................................................  39

  ..............................   40

COMPONENTS  IDENTIFIED  BY  MARK 0 OR  DOTTED  LINE  
WITH  MARK 0 ON  THE  SCHEMATIC  DIAGRAMS  AND  IN  
THE  PARTS  LIST  ARE  CRITICAL  TO  SAFE  OPERATION.
REPLACE  THESE  COMPONENTS  WITH  SONY  PARTS 

UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with 

the lead free mark due to their particular size)

Unleaded solder has the following characteristics.
•   Unleaded solder melts at a temperature about 40 °C higher 

than ordinary solder.

 

Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.

 

Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution:  The printed pattern (copper foil) may peel away if the 

heated tip is applied for too long, so be careful!

•   Strong viscosity
 

Unleaded solder is more viscou-s (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.

•   Usable with ordinary solder
 

It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.

Notes on chip component replacement
•  Never reuse a disconnected chip component.
•  Notice that the minus side of a tantalum capacitor may be da-
 

maged by heat.

AR

4-265-328-1[]

TH

4-265-328-2[]

E51

4-265-328-3[]

MX

4-265-328-4[]

SAF

4-265-328-5[]

SP

4-265-328-7[]

• Abbreviation
 AR  : 

Argentina

  E51 

: Chilean and Peruvian models

 MX  : 

Mexican

 SAF  : 

South 

African

 SP  : 

Singapore

 TH  : 

Thai

•  This set can be disassembled in the order shown below.

Note:  Follow the disassembly procedure in the numerical order given.

1 three screws

u 8)

4 case

2 two screws

u 8)

2 two screws

u 8)

3

3

8 back panel block

qa AC SELECT board

6 five screws

u 8)

1 wire (flat type) (21 core)

7 eight screws

u 8)

2 CNP940 (3P)

3 CNP907 (4P)

4 CNP902 (2P)

5 CNP905 (3P)

q; CNP903 (4P)

9 two screws

u 8)

3 five screws

u 8)

4 cushion, saranet

2 lead (with connector) 

1 CNP790 (4P)

5 claw

5 claw

6 front panel section