SA-WNT3 - Sony Audio Service Manual (repair manual). Page 4

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SA-WNT3
4
SECTION  1
SERVICING  NOTES
UNLEADED  SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution:  Some printed circuit boards may not come printed with 
the lead free mark due to their particular size)
 : LEAD  FREE  MARK
Unleaded solder has the following characteristics.
•  Unleaded solder melts at a temperature about 40 °C higher 
than ordinary solder.
 
Ordinary soldering irons can be used but the iron tip has to be 
applied to the solder joint for a slightly longer time.
 
Soldering irons using a temperature regulator should be set to 
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if 
the heated tip is applied for too long, so be careful!
• Strong 
viscosity
 
Unleaded solder is more viscous (sticky, less prone to fl ow) 
than ordinary solder so use caution not to let solder bridges 
occur such as on IC pins, etc.
• 
Usable with ordinary solder
 
It is best to use only unleaded solder but unleaded solder may 
also be added to ordinary solder.
ADVANCE  PREPARATION  WHEN  CONFIRMING  OP-
ERATION
All of the units included in the HT-NT3 (SA-WNT3/SA-NT3) are 
required to confi rming operation of SA-WNT3. Check in advance 
that you have all of the units.
NOTE  OF  PERFORMING  THE  OPERATION  CHECK  IN  
THE  STATE  THAT  HEAT  SINK  WAS  REMOVED
When performing the operation check in the state that this unit was 
disassembled, it is possible to perform the operation check in the 
state that heat sink was removed. But don’t perform the operation 
check in the long time, and perform the operation check in the 
volume state as low as possible.
NOTE  OF  REPLACING  THE  IC7400  ON  THE  SUB  
MAIN  BOARD
IC7400 on the SUB MAIN board cannot replace with single. When 
this part is damaged, replace the complete mounted board.
“PRTECT (PROTECT)”  APPEARS  ON  THE  DISPLAY  OF  
THE  BAR  SPEAKER (SA-NT3)
q Press the ÒÄÆ (on/standby) button to turn off the system. After the 
indicator disappears, disconnect the AC power cord (mains lead) 
then check that nothing is blocking the ventilation holes of the 
system.
NOTE  OF  REPLACING  THE  IC7203  ON  THE  SUB  
MAIN  BOARD  AND  THE  COMPLETE  SUB  MAIN 
 
BOARD
When IC7203 on the SUB MAIN board and the complete SUB 
MAIN board are replaced, it is necessary to spread the compound 
between the SUB MAIN board and the heat sink.
Spread the compound (THERMAL COMPOUND (G747)) refer-
ring to the fi gure below.
– SUB MAIN Board (Component Side) –
IC7203
thermal compound (G747)
CAPACITOR  ELECTRICAL  DISCHARGE  PROCESSING 
When checking the board, for the electric shock prevention, con-
nect the resistors to both ends of respective capacitor (C201 or 
C207) to discharge the capacitor (C201 or C207).
– SWITCHING REGULATOR (3L405W) Board 
(Conductor Side) –
C207
C201
800 
:/2 W
800 
:/2 W
BOND  FIXATION  OF  ELECTRIC  PARTS
When SWITCHING REGULATOR (3L405W) board or SUB 
MAIN board is replaced or the following object parts are replaced, 
it is necessary to fi x parts to the boards by using a specifi ed bond 
without fail.
• Object boards
SWITCHING REGULATOR (3L405W) board
Complete SUB MAIN board
• Object parts
Board
Ref. No.
SWITCHING 
REGULATOR 
(3L405W)
C101, C102, C103, C201, C207, C211, 
C402, C408, C461, C465, L101, L102, 
L401, NR101, R208, T201
SUB MAIN
C7230, C7233, C7234, L7202
• Use bond
Part No. 
 
Description
7-600-020-70 
ADHESIVE (SC608Z2) 180ML
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